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quality Hermetic Crystal Unit TST TZ1444A Surface Mount Ultra Miniature Package for Wireless Communication factory
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quality Hermetic Crystal Unit TST TZ1444A Surface Mount Ultra Miniature Package for Wireless Communication factory
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Specifications
Frequency Stability:
±10ppm
Operating Temperature:
-30℃~+85℃
Load Capacitance:
10pF
Frequency:
12MHz
Mfr. Part #:
TZ1444A
Package:
SMD3225-4P
Key Attributes
Model Number: TZ1444A
Product Description

Product Overview

The TZ1444A is a Surface Mount Hermetic Crystal Unit with an ultra-miniature 3.2mmx2.5mm package. It offers excellent reliability performance and good frequency perturbation and stability over temperature, making it ideal for wireless communications devices where mobility and compact size are essential.

Product Attributes

  • Brand: TAI-SAW TECHNOLOGY CO., LTD.
  • Origin: Taiwan, R.O.C.
  • Certifications: RoHS Compliant, Lead-free
  • Material: Conductive Polystyrene (Tape)
  • Color: Black (Tape)

Technical Specifications

Model No.Nominal FrequencyMode of OscillationStorage Temperature RangeOperating Temperature RangeFrequency Stability over Operating Temperature RangeFrequency Make Tolerance (FL)Equivalent Series Resistance (ESR)Nominal Drive LevelShunt Capacitance (Co)Load Capacitance (CL)Insulation ResistanceAgingUnit Weight
TZ1444A12.000000 MHzFundamental-40C to +85C-30C to +85C+/-15 ppm (referred to the value at 25C)+/-10 ppm @ 25C +/- 3C100 max100 uW max.5 pF max10pF500 M min./DC 100V+/-1ppm/year0.017+/-0.005 g

Mechanical Dimensions

Dimensions (mm): (Image of dimensions would be here if available)

Recommended Land Pattern: (Image of land pattern would be here if available)

Marking

Line 1: Frequency (12.00)
Line 2: TST Logo + Crystal Product Code + Date Code

Packing

Quantity/Packing: 3K pcs maximum per reel

Reflow Profile

Max peak temperature: 260+/-5 deg C; Time: 10+/-2 sec
Temperature: 217+/-5 deg C; Time: 90~100 sec

Reliability Specifications

Test NameTest Process / MethodReference Standard
Soldering heatResistance to Temp./ Duration : 260C /10sec 2 times (IR-reflow)EIAJED-4701-300(301)M(II)
VibrationTotal peak amplitude : 1.5mm
Vibration frequency : 10 to 55 Hz
Sweep period : 1.0 minute
Vibration directions : 3 mutually perpendicular
Duration : 2 hr / direc.
MIL-STD 202F method 201A
ShockAcceleration : 3000g's, +20/-0 %
Duration : 0.3 ms (total 18 shocks)
Waveform : Half-sine
MIL-STD 202F method 213C
SolderabilitySolder Temperature:2655C
Duration time: 50.5 seconds.
MIL-STD 883G method 2003
Thermal Shock-55 (30min) 125 (30min)
* cycle time : 10 times
MIL-STD 883G method 1010.7
Humidity testTemperature : 70 2 C
Relative humidity : 90~95%
Duration : 96 hours
MIL-STD 202F method 103B
Dry heat (Aging test)Temperature : 125 2 C
Duration : 168 hours
MIL-STD 883G method 1008.2 condition C
PCT testPressure: 2.06kg/cm2 (2.03*105 pa)
Temperature : 121 2 C
Relative humidity : 100%
Duration : 24 hours
EIAJED-4701-B-123A

2410121231_TST-TZ1444A_C501794.pdf

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