Product Overview
The TZ1444A is a Surface Mount Hermetic Crystal Unit with an ultra-miniature 3.2mmx2.5mm package. It offers excellent reliability performance and good frequency perturbation and stability over temperature, making it ideal for wireless communications devices where mobility and compact size are essential.
Product Attributes
- Brand: TAI-SAW TECHNOLOGY CO., LTD.
- Origin: Taiwan, R.O.C.
- Certifications: RoHS Compliant, Lead-free
- Material: Conductive Polystyrene (Tape)
- Color: Black (Tape)
Technical Specifications
| Model No. | Nominal Frequency | Mode of Oscillation | Storage Temperature Range | Operating Temperature Range | Frequency Stability over Operating Temperature Range | Frequency Make Tolerance (FL) | Equivalent Series Resistance (ESR) | Nominal Drive Level | Shunt Capacitance (Co) | Load Capacitance (CL) | Insulation Resistance | Aging | Unit Weight |
| TZ1444A | 12.000000 MHz | Fundamental | -40C to +85C | -30C to +85C | +/-15 ppm (referred to the value at 25C) | +/-10 ppm @ 25C +/- 3C | 100 max | 100 uW max. | 5 pF max | 10pF | 500 M min./DC 100V | +/-1ppm/year | 0.017+/-0.005 g |
Mechanical Dimensions
Dimensions (mm): (Image of dimensions would be here if available)
Recommended Land Pattern: (Image of land pattern would be here if available)
Marking
Line 1: Frequency (12.00)
Line 2: TST Logo + Crystal Product Code + Date Code
Packing
Quantity/Packing: 3K pcs maximum per reel
Reflow Profile
Max peak temperature: 260+/-5 deg C; Time: 10+/-2 sec
Temperature: 217+/-5 deg C; Time: 90~100 sec
Reliability Specifications
| Test Name | Test Process / Method | Reference Standard |
| Soldering heat | Resistance to Temp./ Duration : 260C /10sec 2 times (IR-reflow) | EIAJED-4701-300(301)M(II) |
| Vibration | Total peak amplitude : 1.5mm Vibration frequency : 10 to 55 Hz Sweep period : 1.0 minute Vibration directions : 3 mutually perpendicular Duration : 2 hr / direc. | MIL-STD 202F method 201A |
| Shock | Acceleration : 3000g's, +20/-0 % Duration : 0.3 ms (total 18 shocks) Waveform : Half-sine | MIL-STD 202F method 213C |
| Solderability | Solder Temperature:2655C Duration time: 50.5 seconds. | MIL-STD 883G method 2003 |
| Thermal Shock | -55 (30min) 125 (30min) * cycle time : 10 times | MIL-STD 883G method 1010.7 |
| Humidity test | Temperature : 70 2 C Relative humidity : 90~95% Duration : 96 hours | MIL-STD 202F method 103B |
| Dry heat (Aging test) | Temperature : 125 2 C Duration : 168 hours | MIL-STD 883G method 1008.2 condition C |
| PCT test | Pressure: 2.06kg/cm2 (2.03*105 pa) Temperature : 121 2 C Relative humidity : 100% Duration : 24 hours | EIAJED-4701-B-123A |
2410121231_TST-TZ1444A_C501794.pdf
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