TAI-SAW TECHNOLOGY CO., LTD. Crystal Unit SMD 5.0x3.2 18.432MHz
The TZ0609B is a surface mount 5.0mmx3.2mm crystal unit designed for wireless communications devices. It features an ultra-miniature package with excellent reliability performance, good frequency perturbation, and stability over temperature, making it ideal for mobile applications requiring compact solutions.
Product Attributes
- Brand: TAI-SAW TECHNOLOGY CO., LTD.
- Model Number: TZ0609B
- Revision Number: 2
- Certifications: RoHS Compliant, Lead-free
- Soldering: Lead-free soldering
Technical Specifications
| Specification | Value |
|---|---|
| Nominal Frequency | 18.432000MHz |
| Mode of Oscillation | Fundamental |
| Storage Temperature Range | -40C to +85C |
| Operating Temperature Range | -20C to +70C |
| Frequency Stability over Operating Temperature Range | +/-10 ppm (referred to the value at 25C) |
| Frequency Make Tolerance (FL) | +/-10 ppm @ 25C +/- 3C |
| Equivalent Series Resistance (ESR) | 40 max. |
| Nominal Drive Level | 10uW typical and 100uW max |
| Shunt Capacitance (Co) | 2.0 pF max |
| Load Capacitance (CL) | 18 pF |
| Unit Weight | 0.037+/-0.005g |
Mechanical Dimensions
Refer to the Mechanical Dimensions diagram provided in the original document for precise measurements.
Recommended Land Pattern
Refer to the Recommended Land Pattern diagram provided in the original document for precise measurements.
Marking
Line 1: Frequency (18.432)
Line 2: TST Logo + Crystal Product Code + Date Code + Traceability code (1 or 2 letters)
Pin Connection
| Pin # | Function |
|---|---|
| #1 pin | IN/OUT |
| #2 pin | GND |
| #3 pin | IN/OUT |
| #4 pin | GND |
The inner vision of Pin#1, Pin#4 side is XTAL blank mounting pad.
Reel and Tape Dimensions
Refer to the Reel Dimensions and Tape Dimensions diagrams provided in the original document for precise measurements.
Packing Quantity
3K pcs maximum per reel
Reflow Profile
Max peak temperature: 260+/-5 deg C; Time: 10+/-2 sec
Temperature: 217+/-5 deg C; Time: 90~100 sec
Reliability Specifications
| Test Name | Test Process / Method | Conditions |
|---|---|---|
| Soldering heat | EIAJED-4701 (IR-reflow) | 260C /10sec 2 times (Total time : 4min.) |
| Vibration | MIL-STD 202F method 201A | Total peak amplitude : 1.5mm, Frequency : 10 to 55 Hz, Sweep period : 1.0 minute, Directions : 3 mutually perpendicular, Duration : 2 hr / direc. |
| Shock | MIL-STD 202F method 213C | Acceleration : 3000g's, +/-20/-0 %, Duration : 0.3 ms (total 18 shocks), Waveform : Half-sine |
| Solderability | MIL-STD 883G method 2003 | Solder Temperature:2655C, Duration time: 50.5 seconds. |
| Thermal Shock | MIL-STD 883G method 1010.7 | -55 (30min) 125 (30min), cycle time : 10 times |
| Humidity test | MIL-STD 202F method 103B | Temperature : 70 2 C, Relative humidity : 90~95%, Duration : 96 hours |
| Dry heat (Aging test) | MIL-STD 883G method 1008.2 condition C | Temperature : 125 2 C, Duration : 168 hours |
| PCT test | EIAJED-4701-3 B-123A | Pressure: 2.06kg/cm2 (2.03*105 pa), Temperature : 121 2 C, Relative humidity : 100%, Duration : 24 hours |
2410121317_TST-TZ0609B_C596589.pdf
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