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Specifications
Normal temperature Frequency Tolerance:
±10ppm
Load Capacitance:
6.8pF
Operating Temperature:
-40℃~+85℃
Frequency:
26MHz
Mfr. Part #:
TZ3330A
Package:
SMD2016-4P
Key Attributes
Model Number:
TZ3330A
Product Description
Product Overview
The TZ3330A is a crystal unit from TAI-SAW TECHNOLOGY CO., LTD., designed for surface mount applications. It features an ultra-miniature package (2.0x1.6mm) and excellent reliability, making it ideal for wireless communications devices where mobility and compact size are essential. The unit offers good frequency perturbation and stability over temperature.
Product Attributes
- Brand: TAI-SAW TECHNOLOGY CO., LTD.
- Origin: Taiwan, R.O.C.
- Certifications: RoHS Compliant, Lead-free
- Package Type: Surface Mount Hermetic Package
- Moisture Sensitivity Level (MSL): Level-1
Technical Specifications
| Model No. | Nominal Frequency | Mode of Oscillation | Storage Temperature Range | Operating Temperature Range | Frequency Stability over Operating Temperature Range | Frequency Make Tolerance (FL) | Equivalent Series Resistance (ESR) | Nominal Drive Level | Shunt Capacitance (Co) | Load Capacitance (CL) | Hysteresis | Aging | Insulation Resistance | Trim Sensitivity | Unit Weight |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| TZ3330A | 26.000000 MHz | Fundamental | -50C to +105C | -40C to +85C | +/-15 ppm (referred to the value at 25C) | +/-10 ppm @ 25C +/- 3C | 80 max | 10uW typical and 100uW max | 3.0 pF max | 6.8 pF | +/-0.5 ppm @ -40~85C | +/-1ppm/year | 500 M min./DC 100V | 14.5 ppm/pF min | 5.7mg+/-0.5mg |
| Parameter | Min | Typ | Max | Unit |
|---|---|---|---|---|
| Inflection Point (Ti) | 30.0 | 30.5 | 32.0 | C |
| Room Temp (T0) | 30.5 | C | ||
| C1 (3rd order curve fitting coefficient) | -0.45 | -0.35 | -0.24 | ppm/C |
| C2 (3rd order curve fitting coefficient) | 0.37 | 1.28 | 0.88 | e-4 ppm/C |
| C3 (3rd order curve fitting coefficient) | 9.55 | 9.40 | 9.04 | e-5 ppm/C |
| Test Name | Test Process / Method | Conditions / Notes |
|---|---|---|
| Soldering heat | EIAJ ED-4701 (IR-reflow) -300(301)M(II) | Resistance to Temp./ Duration : 265C /10sec 2 times; Total time : 4min.(IR-reflow) |
| Vibration | MIL-STD 202G method 204 | Total peak amplitude : 1.5mm; Vibration frequency : 10 to 2000 Hz; Sweep period : 20 minute; Vibration directions : 3 mutually perpendicular; Duration : 2 hr / direc. |
| Drop test | MIL-STD 202G method 213 | 150 cm with load on Concrete floor; Mechanical directions : 6 mutually perpendicular x 1time; Duration : 0.3 ms (total 18 shocks); Waveform : Half-sine |
| Shock | MIL-STD 202G method 213 | Acceleration : 3000g's, +20/-0 %; Duration : 0.3 ms (total 18 shocks); Waveform : Half-sine |
| Solderability | J-STD-002 | Solder Temperature:2655C; Duration time: 50.5 seconds. |
| Thermal Shock | MIL-STD 883G method 1010.8 | Heat cycle conditions: -40 (30min) 85 (30min); * cycle time : 10 times |
| Humidity test | MIL-STD 202G method 103 | Temperature : 85 2 C; Relative humidity : 85%; Duration : 96 hours |
| Dry heat (Aging test) | MIL-STD 202G method 108A | Temperature : 125 2 C; Duration : 168 hours |
| Cold resistance (Low Temp Storage) | IEC 60068-2-1 | Temperature : -40 2 C; Duration : 96 hours |
2410121246_TST-TZ3330A_C18221404.pdf
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