TAI-SAW TECHNOLOGY CO., LTD. TZ0968B Crystal Unit
The TAI-SAW TECHNOLOGY CO., LTD. TZ0968B is an ultra-miniature, surface-mount 2.5x2.0mm crystal unit designed for wireless communications devices. It offers excellent reliability performance, good frequency perturbation and stability over temperature, and is ideal for applications requiring a compact package for mobility.
Product Attributes
- Brand: TAI-SAW TECHNOLOGY CO., LTD.
- Model: TZ0968B
- Origin: DCC Release document (implied manufacturing)
- Certifications: RoHS Compliant, Lead-free
- Material: Conductive polystyrene with color black (for tape)
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 24.000000 | MHz | Fundamental |
| Storage Temperature Range | -40 to +85 | C | |
| Operating Temperature Range | -10 to +60 | C | |
| Frequency Stability over Operating Temperature Range | +/-10 | ppm | (referred to the value at 25C) |
| Frequency Make Tolerance (FL) | +/-10 | ppm | @ 25C +/- 3C |
| Equivalent Series Resistance (ESR) | 50 | max | |
| Nominal Drive Level | 10 | uW | max. |
| Shunt Capacitance (Co) | 3.0 | pF | max |
| Load Capacitance (CL) | 12 | pF | |
| Insulation Resistance | 500 | M min. | /DC 100V |
| Unit Weight | 9.5 +/-0.5 | mg |
Mechanical Dimensions
Dimensions (mm): (Image/Diagram would typically be here)
Recommended Land Pattern: (unit: mm) (Image/Diagram would typically be here)
Marking
Line 1: Frequency (24.0)
Line 2: TST Logo + Date Code + Product Code
Date Code Table
(Table would typically be here)
Pin Connection
#1 pin: IN/OUT
#2 pin: GND
#3 pin: IN/OUT
#4 pin: GND
Product Code Table
(Table would typically be here)
Reel Dimensions
(mm) (Image/Diagram would typically be here)
Tape Dimensions
(mm) (Image/Diagram would typically be here)
Notes:
- Unless otherwise specified tolerance on dimension +/-0.1 mm.
- Material: conductive polystyrene with color black.
- 10 pitch cumulative tolerance +/-0.2 mm.
Packing Quantity/Packing
3K pcs maximum per reel
Reflow Profile
Note:
- Max peak temperature: 260+/-5 deg C; Time: 10+/-2 sec
- Temperature: 217+/-5 deg C; Time: 90~100 sec
Reliability Specifications
| Test Name | Test Process / Method | Reference Standard |
|---|---|---|
| Soldering heat | resistance to Temp./ Duration : 260C /10sec 2 times (IR reflow) Total time : 4min.(IR-reflow) | EIAJED-4701 -300(301)M(II) |
| Vibration | Total peak amplitude : 1.5mm Vibration frequency : 10 to 55 Hz Sweep period : 1.0 minute Vibration directions : 3 mutually perpendicular Duration : 2 hr / direc. | MIL-STD 202F method 201A |
| Shock | Mechanical directions : 3 impacts per axis Acceleration : 3000g's, +20/-0 % Duration : 0.3 ms (total 18 shocks) Waveform : Half-sine | MIL-STD 202F method 213C |
| Solderability | Solder Temperature:2655C Duration time: 50.5 seconds. | MIL-STD 883G method 2003 |
| Thermal Shock | Heat cycle conditions -55 (30min) 125 (30min) * cycle time : 10 times | MIL-STD 883G method 1010.7 |
| Humidity test | Temperature : 70 2 C Relative humidity : 90~95% Duration : 96 hours | MIL-STD 202F method 103B |
| Dry heat ( Aging test ) | Temperature : 125 2 C Duration : 168 hours | MIL-STD 883G method 1008.2 condition C |
| PCT test | Pressure: 2.06kg/cm2 (2.03*105 pa) Temperature : 121 2 C Relative humidity : 100% Duration : 24 hours | EIAJED-4701 B-123A |
2410121248_TST-TZ0968B_C596562.pdf
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