TAI-SAW TECHNOLOGY CO., LTD.
Product Name: SMD 2.5x2.0 26.0MHz Crystal Unit
Model No.: TZ0661C
Description: Surface mount 2.5mmx2.0mm crystal unit designed for wireless communications devices, particularly where an ultra-miniature package is required for mobility. It features a hermetic package, excellent reliability, and good frequency perturbation and stability over temperature.
Applications: Wireless communications devices requiring ultra-miniature packages for mobility.
Product Attributes
- Brand: TAI-SAW TECHNOLOGY CO., LTD.
- Origin: Taiwan, R.O.C.
- Certifications: RoHS Compliant, Lead-free
- Material: Conductive polystyrene with color black (for tape)
- Marking: Laser Marking (Line 1: Frequency (26.0), Line 2: TST Logo + Date Code + Product Code)
Technical Specifications
| Specification | Value | Unit | Notes |
|---|---|---|---|
| Nominal Frequency | 26.000000 | MHz | Fundamental |
| Frequency Stability over Operating Temperature Range | +/-9 | ppm | Referred to the value at 25C |
| Frequency Make Tolerance (FL) | +/-10 | ppm | @ 25C +/- 3C |
| Equivalent Series Resistance (ESR) | 60 max | ||
| Nominal Drive Level | 50 typical, 100 max | uW | |
| Shunt Capacitance (Co) | 2.0 pF max | ||
| Load Capacitance (CL) | 9 | pF | |
| Insulation Resistance | 500 M min. | /DC 100V | |
| Aging | +/-1 | ppm/year | |
| Unit Weight | 9.5 +/-0.5 | mg | |
| Storage Temperature Range | -40 to +85 | C | |
| Operating Temperature Range | -20 to +75 | C | |
Mechanical Dimensions
Dimensions: 2.5mm x 2.0mm
Recommended Land Pattern: (unit: mm)
Pin Connection: #1 pin IN/OUT, #2 pin GND, #3 pin IN/OUT, #4 pin GND
Packaging
Reel Dimensions: (Refer to Tape Dimensions)
Tape Dimensions: (Refer to Reel Dimensions)
Quantity/Packing: 3K pcs maximum per reel
Reflow Profile
Max peak temperature: 260+/-5 deg C; Time: 10+/-2 sec
Temperature: 217+/-5 deg C; Time: 90~100 sec
Reliability Specifications
| Test Name | Test Process / Method | Conditions |
|---|---|---|
| Soldering heat | EIAJED-4701 (IR-reflow) | 260C /10sec 2 times |
| Vibration | MIL-STD 202F method 201A | 10 to 55 Hz, 1.0 minute sweep period, 3 mutually perpendicular directions, 2 hr / direction |
| Shock | MIL-STD 202F method 213C | 3000g's, +20/-0 %, 0.3 ms duration (18 shocks), Half-sine waveform |
| Solderability | MIL-STD 883G method 2003 | 2655C, 50.5 seconds |
| Thermal Shock | MIL-STD 883G method 1010.7 | -55 (30min) 125 (30min), 10 cycles |
| Humidity test | MIL-STD 202F method 103B | 70 2 C, 90~95% RH, 96 hours |
| Dry heat (Aging test) | MIL-STD 883G method 1008.2 condition C | 125 2 C, 168 hours |
| PCT test | EIAJED-4701-3 B-123A | Pressure: 2.06kg/cm2 (2.03*105 pa), 121 2 C, 100% RH, 24 hours |
2410121234_TST-TZ0661C_C337673.pdf
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