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Specifications
Frequency Stability:
±25ppm
Output Type:
CML
Voltage - Supply:
3.3V
Frequency:
214.999MHz
Mfr. Part #:
590QB-BDG
Package:
SMD7050-6P
Key Attributes
Model Number:
590QB-BDG
Product Description
Product Overview
The Skyworks Si590/591 is a Crystal Oscillator (XO) utilizing advanced DSPLL circuitry to deliver low jitter clock signals at high frequencies, supporting any frequency from 10 to 810 MHz. Unlike traditional XOs, it uses a single fixed crystal, enabling a wide range of output frequencies with exceptional stability and reliability. Its IC-based design offers superior supply noise rejection, making it ideal for noisy communication environments. The Si590/591 is factory configurable for frequency, supply voltage, output format, and stability, minimizing lead times for custom specifications.
Product Attributes
- Brand: Skyworks Solutions, Inc.
- Certifications: Pb-free/RoHS-compliant
- Material: Internal fundamental mode crystal
- Package Options: 5x7 mm, 3.2x5 mm
Technical Specifications
| Parameter | Symbol | Test Condition | Min | Typ | Max | Units |
| Electrical Specifications | ||||||
| Supply Voltage | VDD | 3.3 V option | 2.97 | 3.3 | 3.63 | V |
| 2.5 V option | 2.25 | 2.5 | 2.75 | V | ||
| 1.8 V option | 1.71 | 1.8 | 1.89 | V | ||
| Supply Current | IDD | Output enabled LVPECL | 110 | 125 | mA | |
| Output enabled CML | 100 | 110 | mA | |||
| Output enabled LVDS | 90 | 100 | mA | |||
| Output enabled CMOS | 80 | 90 | mA | |||
| Tristate mode | 60 | 75 | mA | |||
| Output Enable (OE) VIH | VIH | 0.75 x VDD | V | |||
| Output Enable (OE) VIL | VIL | 0.5 | V | |||
| Operating Temperature Range | TA | 40 | 85 | C | ||
| CLK Output Frequency Characteristics | ||||||
| Nominal Frequency | fO | LVPECL/LVDS/CML | 10 | 810 | MHz | |
| CMOS | 10 | 160 | MHz | |||
| Initial Accuracy | fi | Measured at +25 C at time of shipping | 1.5 | ppm | ||
| Total Stability | second option code D | 20 | ppm | |||
| second option code C | 30 | ppm | ||||
| second option code B | 50 | ppm | ||||
| second option code A | 100 | ppm | ||||
| Temperature Stability | second option code D | 7 | ppm | |||
| second option code C | 20 | ppm | ||||
| second option code B | 25 | ppm | ||||
| second option code A | 50 | ppm | ||||
| Powerup Time | tOSC | Time from powerup or tristate mode to fO | 10 | ms | ||
| CLK Output Levels and Symmetry | ||||||
| LVPECL Output Option VO mid-level | VO | VDD 1.42 | VDD 1.25 | V | ||
| LVPECL Output Option VOD swing (diff) | VOD | 1.1 | 1.9 | VPP | ||
| LVDS Output Option VO mid-level | VO | 1.125 | 1.20 | 1.275 | V | |
| LVDS Output Option VOD swing (diff) | VOD | 0.5 | 0.7 | 0.9 | VPP | |
| CML Output Option VO mid-level (2.5/3.3 V) | VO | VDD 1.30 | V | |||
| CML Output Option VOD swing (diff) (2.5/3.3 V) | VOD | 1.10 | 1.50 | 1.90 | VPP | |
| CMOS Output VOH | VOH | 0.8 x VDD | VDD | V | ||
| CMOS Output VOL | VOL | 0.4 | V | |||
| Rise/Fall time (20/80%) | tR, tF | LVPECL/LVDS/CML | 350 | ps | ||
| Rise/Fall time (20/80%) | tR, tF | CMOS with CL = 15 pF | 1 | 2 | ns | |
| Symmetry (duty cycle) | SYM | LVPECL: VDD 1.3 V (diff) | 45 | 55 | % | |
| Symmetry (duty cycle) | SYM | LVDS: 1.25 V (diff) | 45 | 55 | % | |
| Symmetry (duty cycle) | SYM | CMOS: VDD/2 | 45 | 55 | % | |
| CLK Output Phase Jitter | ||||||
| Phase Jitter (RMS) (LVPECL/LVDS/CML) | J | 50 MHz < FOUT < 810 MHz, 12 kHz to 20 MHz | 0.5 | 1.0 | ps | |
| Phase Jitter (RMS) (LVPECL/LVDS/CML) | J | 155.52 MHz output frequency, 12 kHz to 20 MHz | 0.4 | 0.7 | ps | |
| Phase Jitter (RMS) (CMOS) | J | 50 MHz < FOUT < 160 MHz, 12 kHz to 20 MHz | 0.6 | 1.0 | ps | |
| CLK Output Period Jitter | ||||||
| Period Jitter (RMS) | JPER | Any output mode, N = 1000 cycles | 3 | ps | ||
| Period Jitter (Peak-to-Peak) | Any output mode, N = 1000 cycles | 35 | ps | |||
| Environmental Compliance and Package Information | ||||||
| Mechanical Shock | MIL-STD-883, Method 2002 | |||||
| Mechanical Vibration | MIL-STD-883, Method 2007 | |||||
| Solderability | MIL-STD-883, Method 2003 | |||||
| Gross and Fine Leak | MIL-STD-883, Method 1014 | |||||
| Resistance to Solder Heat | MIL-STD-883, Method 2036 | |||||
| Contact Pads | Gold over Nickel | |||||
| Thermal Characteristics (Typical values TA = 25 C, VDD = 3.3 V) | ||||||
| Thermal Resistance Junction to Ambient | JA | 5x7mm, Still Air | 84.6 | C/W | ||
| Thermal Resistance Junction to Case | JC | 5x7mm, Still Air | 38.8 | C/W | ||
| Thermal Resistance Junction to Ambient | JA | 3.2x5mm, Still Air | 31.1 | C/W | ||
| Thermal Resistance Junction to Case | JC | 3.2x5mm, Still Air | 13.3 | C/W | ||
| Ambient Temperature | TA | 40 | 85 | C | ||
| Junction Temperature | TJ | 125 | C | |||
| Absolute Maximum Ratings | ||||||
| Maximum Operating Temperature | TAMAX | 85 | C | |||
| Supply Voltage, 1.8 V Option | VDD | 0.5 | 1.9 | V | ||
| Supply Voltage, 2.5/3.3 V Option | VDD | 0.5 | 3.8 | V | ||
| Input Voltage (any input pin) | VI | 0.5 | VDD + 0.3 | V | ||
| Storage Temperature | TS | 55 | 125 | C | ||
| ESD Sensitivity (HBM, per JESD22-A114) | ESD | 2500 | V | |||
| Soldering Temperature (Pb-free profile) | TPEAK | 260 | C | |||
| Soldering Temperature Time @ TPEAK (Pb-free profile) | tP | 20 | 40 | seconds | ||
2411041628_SKYWORKS-590QB-BDG_C7026786.pdf
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