Skyworks Solutions Si510/511 Crystal Oscillator (XO)
Product Overview
The Skyworks Solutions Si510/511 is a Crystal Oscillator (XO) that leverages advanced DSPLL technology to provide any frequency from 100 kHz to 250 MHz. Unlike traditional XOs requiring a unique crystal for each frequency, this IC-based solution uses a single fixed crystal and a proprietary DSPLL synthesizer. This approach enhances reliability, mechanical robustness, and stability, while offering superior supply noise rejection for low jitter clock generation in noisy environments. The Si510/511 is factory-configurable for various user specifications, including frequency, supply voltage, output format, and stability, eliminating long lead times and NRE charges associated with custom oscillators. It is ideal for applications such as SONET/SDH/OTN, Gigabit Ethernet, Fibre Channel/SAS/SATA, PCI Express, 3G-SDI/HD-SDI/SDI, Telecom, Switches/Routers, and FPGA/ASIC clock generation.
Product Attributes
- Brand: Skyworks Solutions
- Technology: DSPLL Synthesis
- Compliance: Pb-free, RoHS compliant
- Packaging Options: 5 x 7 mm, 3.2 x 5 mm, 2.5 x 3.2 mm
Technical Specifications
| Parameter | Symbol | Test Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Operating Specifications | ||||||
| Supply Voltage (3.3 V option) | VDD | 2.97 | 3.3 | 3.63 | V | |
| Supply Voltage (2.5 V option) | VDD | 2.25 | 2.5 | 2.75 | V | |
| Supply Voltage (1.8 V option) | VDD | 1.71 | 1.8 | 1.89 | V | |
| Supply Current (CMOS, 100 MHz, single-ended) | IDD | 21 | 26 | mA | ||
| Supply Current (LVDS, output enabled) | IDD | 19 | 23 | mA | ||
| Supply Current (LVPECL, output enabled) | IDD | 39 | 43 | mA | ||
| Supply Current (HCSL, output enabled) | IDD | 41 | 44 | mA | ||
| Supply Current (Tristate, output disabled) | IDD | 18 | mA | |||
| Operating Temperature | TA | 40 | 85 | C | ||
| Output Clock Frequency Characteristics | ||||||
| Nominal Frequency (CMOS, Dual CMOS) | FO | 0.1 | 212.5 | MHz | ||
| Nominal Frequency (LVDS/LVPECL/HCSL) | FO | 0.1 | 250 | MHz | ||
| Total Stability (Grade C) | 30 | +30 | ppm | |||
| Total Stability (Grade B) | 50 | +50 | ppm | |||
| Total Stability (Grade A) | 100 | +100 | ppm | |||
| Startup Time | TSU | Minimum VDD until output frequency (FO) within specification | 10 | ms | ||
| Disable Time (FO 10 MHz) | TD | 5 | s | |||
| Disable Time (FO < 10 MHz) | TD | 40 | s | |||
| Enable Time (FO 10 MHz) | TE | 20 | s | |||
| Enable Time (FO < 10 MHz) | TE | 60 | s | |||
| Output Clock Levels and Symmetry | ||||||
| CMOS Output Rise/Fall Time (20 to 80% VDD) | TR/TF | 0.1 to 212.5 MHz, CL = 15 pF | 0.45 | 0.8 | 1.2 | ns |
| LVPECL Output Rise/Fall Time (20 to 80% VDD) | TR/TF | 100 | 565 | ps | ||
| HCSL Output Rise/Fall Time (20 to 80% VDD) | TR/TF | 100 | 470 | ps | ||
| LVDS Output Rise/Fall Time (20 to 80% VDD) | TR/TF | 350 | 800 | ps | ||
| Duty Cycle | DC | All formats | 48 | 50 | 52 | % |
| Output Clock Jitter and Phase Noise (LVPECL) | ||||||
| Period Jitter (RMS) | JPRMS | 10k samples | 1.3 | ps | ||
| Period Jitter (Pk-Pk) | JPPKPK | 10k samples | 11 | ps | ||
| Phase Jitter (RMS) (1.875 MHz to 20 MHz) | J | (brickwall) | 0.31 | 0.5 | ps | |
| Output Clock Jitter and Phase Noise (LVDS) | ||||||
| Period Jitter (RMS) | JPRMS | 10k samples | 2.1 | ps | ||
| Period Jitter (Pk-Pk) | JPPKPK | 10k samples | 18 | ps | ||
| Phase Jitter (RMS) (1.875 MHz to 20 MHz) | J | (brickwall) | 0.25 | 0.55 | ps | |
| Output Clock Jitter and Phase Noise (HCSL) | ||||||
| Period Jitter (RMS) | JPRMS | 10k samples* | 1.2 | ps | ||
| Period Jitter (Pk-Pk) | JPPKPK | 10k samples* | 11 | ps | ||
| Phase Jitter (RMS) (1.875 MHz to 20 MHz) | J | *(brickwall) | 0.25 | 0.30 | ps | |
| Output Clock Jitter and Phase Noise (CMOS, Dual CMOS) | ||||||
| Phase Jitter (RMS) (1.875 MHz to 20 MHz) | J | 2 (brickwall) | 0.25 | 0.35 | ps | |
| Environmental Compliance and Package Information | ||||||
| Mechanical Shock | MIL-STD-883, Method 2002 | |||||
| Mechanical Vibration | MIL-STD-883, Method 2007 | |||||
| Solderability | MIL-STD-883, Method 2003 | |||||
| Gross and Fine Leak | MIL-STD-883, Method 1014 | |||||
| Resistance to Solder Heat | MIL-STD-883, Method 2036 | |||||
| Contact Pads | Gold over Nickel | |||||
| Thermal Characteristics | ||||||
| Thermal Resistance Junction to Ambient (CLCC) | JA | Still air | 110 | C/W | ||
| Thermal Resistance Junction to Ambient (2.5x3.2mm) | JA | Still air | 164 | C/W | ||
| Absolute Maximum Ratings | ||||||
| Maximum Operating Temperature | TAMAX | 85 | C | |||
| Storage Temperature | TS | 55 | +125 | C | ||
| Supply Voltage | VDD | 0.5 | +3.8 | V | ||
| Input Voltage (any input pin) | VI | 0.5 | VDD + 0.3 | V | ||
| ESD Sensitivity (HBM, per JESD22-A114) | HBM | 2 | kV | |||
| Soldering Temperature (Pb-free profile) | TPEAK | 260 | C | |||
| Soldering Temperature Time at TPEAK (Pb-free profile) | TP | 20 | 40 | sec | ||
2411041604_SKYWORKS-510CCA20M0000CAGR_C22263978.pdf
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