Skyworks Solutions Si500D Differential Output Silicon Oscillator
Product Overview
The Skyworks Solutions Si500D is a quartz-free, MEMS-free, and PLL-free all-silicon oscillator designed to deliver reliable and stable clock signals across a wide frequency range. Offering excellent temperature stability and high immunity to shock and vibration, this oscillator is ideal for applications demanding high reliability and low jitter. It supports various output formats including CMOS, SSTL, LVPECL, LVDS, and HCSL, with multiple voltage options and flexible control features like driver stopped, tri-state, and powerdown modes. The Si500D is footprint compatible with industry-standard 3.2 x 5.0 mm XOs and is RoHS compliant.
Product Attributes
- Brand: Skyworks Solutions, Inc.
- Material: All-silicon
- Certifications: RoHS compliant
- Package: 6-pad, 3.2 x 4.0 mm SMD
Technical Specifications
| Parameter | Condition | Min | Typ | Max | Units | Notes |
|---|---|---|---|---|---|---|
| Frequency Range | 0.9 | 200 | MHz | |||
| Frequency Stability | Temperature stability, 0 to +70 C | 10 | ppm | |||
| Frequency Stability | Temperature stability, 0 to +85 C | 20 | ppm | |||
| Total Stability | 0 to +70 C operation | 150 | ppm | 1 | ||
| Total Stability | 0 to +85 C operation | 250 | ppm | 2 | ||
| Operating Temperature | Commercial | 0 | 70 | C | ||
| Operating Temperature | Extended commercial | 0 | 85 | C | ||
| Storage Temperature | 55 | +125 | C | |||
| Supply Voltage | 1.8 V option | 1.71 | 1.98 | V | ||
| Supply Voltage | 2.5 V option | 2.25 | 2.75 | V | ||
| Supply Voltage | 3.3 V option | 2.97 | 3.63 | V | ||
| Supply Current | LVPECL | 34.0 | 36.0 | mA | ||
| Supply Current | Low Power LVPECL | 19.3 | 22.2 | mA | ||
| Supply Current | LVDS | 14.9 | 16.5 | mA | ||
| Supply Current | HCSL | 25.3 | 29.3 | mA | ||
| Supply Current | Differential CMOS (3.3 V, 10 pF, 200 MHz) | 33 | 36 | mA | ||
| Supply Current | Differential CMOS (3.3 V, 1 pF, 40 MHz) | 16 | mA | |||
| Supply Current | Differential SSTL-3.3 | 24.5 | 27.7 | mA | ||
| Supply Current | Differential SSTL-2.5 | 24.3 | 26.7 | mA | ||
| Supply Current | Differential SSTL-1.8 | 22.2 | 25 | mA | ||
| Supply Current | Tri-State | 9.7 | 10.7 | mA | ||
| Supply Current | Powerdown | 1.0 | 1.9 | mA | ||
| Output Symmetry | VDIFF = 0 | 46 | 54 | % TCLK | 13 ns/TCLK | |
| Rise and Fall Times (20/80%) | LVPECL/LVDS | 460 | ps | 3 | ||
| Rise and Fall Times (20/80%) | HCSL/Differential SSTL | 800 | ps | 3 | ||
| Rise and Fall Times (20/80%) | Differential CMOS, 15 pF, >80 MHz | 1.1 | 1.6 | ns | 3 | |
| LVPECL Output Option (DC coupling, 50 to VDD 2.0 V) | Mid-level | VDD 1.5 | VDD 1.34 | V | 3 | |
| LVPECL Output Option (DC coupling, 50 to VDD 2.0 V) | Diff swing | .720 | .880 | VPK | 3 | |
| Low Power LVPECL Output Option (AC coupling, 100 Differential Load) | Mid-level | N/A | V | 3 | ||
| Low Power LVPECL Output Option (AC coupling, 100 Differential Load) | Diff swing | .68 | .95 | VPK | 3 | |
| LVDS Output Option (2.5/3.3 V) (RTERM = 100 diff) | Mid-level | 1.15 | 1.26 | V | 3 | |
| LVDS Output Option (2.5/3.3 V) (RTERM = 100 diff) | Diff swing | 0.25 | 0.45 | VPK | 3 | |
| LVDS Output Option (1.8 V) (RTERM = 100 diff) | Mid-level | 0.85 | 0.96 | V | 3 | |
| LVDS Output Option (1.8 V) (RTERM = 100 diff) | Diff swing | 0.25 | 0.45 | VPK | 3 | |
| HCSL Output Option | Mid-level | 0.35 | 0.425 | V | 3 | |
| HCSL Output Option | Diff swing | 0.65 | 0.82 | VPK | 3 | |
| DC termination per pad | 45 | 55 | ||||
| CMOS Output Voltage | VOH, sourcing 9 mA | VDD 0.6 | V | 3 | ||
| CMOS Output Voltage | VOL, sinking 9 mA | 0.6 | V | 3 | ||
| SSTL-1.8 Output Voltage | VOH | VTT + 0.375 | V | 4 | ||
| SSTL-1.8 Output Voltage | VOL | VTT 0.375 | V | 4 | ||
| SSTL-2.5 Output Voltage | VOH | VTT + 0.48 | V | 4 | ||
| SSTL-2.5 Output Voltage | VOL | VTT 0.48 | V | 4 | ||
| SSTL-3.3 Output Voltage | VOH | VTT + 0.48 | V | 5 | ||
| SSTL-3.3 Output Voltage | VOL | VTT 0.48 | V | 5 | ||
| Powerup Time | From VDD crosses min spec supply | 2 | ms | |||
| OE Deassertion to Clk Stop | 250 | 3 x TCLK | ns | |||
| Return from Output Driver Stopped Mode | 250 | 3 x TCLK | ns | |||
| Return From Tri-State Time | 12 | 3 x TCLK | s | |||
| Return From Powerdown Time | 2 | ms | ||||
| Period Jitter (1-sigma) | Non-CMOS | 1 | 2 | ps RMS | ||
| Period Jitter (1-sigma) | CMOS, CL = 7 pF | 1 | 3 | ps RMS | ||
| Integrated Phase Jitter | 1.0 MHz min(20 MHz, 0.4 x FOUT), non-CMOS | 0.6 | 1 | ps RMS | ||
| Integrated Phase Jitter | 1.0 MHz min(20 MHz, 0.4 x FOUT), CMOS format | 0.7 | 1.5 | ps RMS | ||
| Package Dimensions | A | 0.80 | 0.85 | 0.90 | mm | |
| Package Dimensions | A1 | 0.00 | 0.03 | 0.05 | mm | |
| Package Dimensions | b | 0.59 | 0.64 | 0.69 | mm | |
| Package Dimensions | D | 3.20 | BSC. | |||
| Package Dimensions | E | 4.00 | BSC. | |||
| Package Dimensions | e | 1.27 | BSC. | |||
| Package Dimensions | L | 0.95 | 1.00 | 1.05 | mm | |
| Package Dimensions | L1 | 0.00 | 0.05 | 0.10 | mm | |
| Package Dimensions | aaa | 0.10 | mm | |||
| Package Dimensions | bbb | 0.10 | mm | |||
| Package Dimensions | ccc | 0.08 | mm | |||
| Package Dimensions | ddd | 0.10 | mm | |||
| Package Dimensions | eee | 0.05 | mm | |||
| Pad Connections | 1 | OE | ||||
| Pad Connections | 2 | NCMake no external connection to this pin | ||||
| Pad Connections | 3 | GND | ||||
| Pad Connections | 4 | Output | ||||
| Pad Connections | 5 | Complementary Output | ||||
| Pad Connections | 6 | VDD | ||||
| Environmental Compliance | Mechanical Shock | MIL-STD-883, Method 2002.4 | ||||
| Environmental Compliance | Mechanical Vibration | MIL-STD-883, Method 2007.3 | ||||
| Environmental Compliance | Resistance to Soldering Heat | MIL-STD-202, 260 C for 8 seconds | ||||
| Environmental Compliance | Solderability | MIL-STD-883, Method 2003.8 | ||||
| Environmental Compliance | Damp Heat | IEC 68-2-3 | ||||
| Environmental Compliance | Moisture Sensitivity Level | J-STD-020, MSL 3 |
2508281723_SKYWORKS-500DABB156M250ACH_C17572588.pdf
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