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quality Temperature stable and clock source SKYWORKS 500DABB156M250ACH oscillator with footprint compatible SMD package factory
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quality Temperature stable and clock source SKYWORKS 500DABB156M250ACH oscillator with footprint compatible SMD package factory
quality Temperature stable and clock source SKYWORKS 500DABB156M250ACH oscillator with footprint compatible SMD package factory
>
Specifications
Mfr. Part #:
500DABB156M250ACH
Package:
SMD4032-6P
Key Attributes
Model Number: 500DABB156M250ACH
Product Description

Skyworks Solutions Si500D Differential Output Silicon Oscillator

Product Overview

The Skyworks Solutions Si500D is a quartz-free, MEMS-free, and PLL-free all-silicon oscillator designed to deliver reliable and stable clock signals across a wide frequency range. Offering excellent temperature stability and high immunity to shock and vibration, this oscillator is ideal for applications demanding high reliability and low jitter. It supports various output formats including CMOS, SSTL, LVPECL, LVDS, and HCSL, with multiple voltage options and flexible control features like driver stopped, tri-state, and powerdown modes. The Si500D is footprint compatible with industry-standard 3.2 x 5.0 mm XOs and is RoHS compliant.

Product Attributes

  • Brand: Skyworks Solutions, Inc.
  • Material: All-silicon
  • Certifications: RoHS compliant
  • Package: 6-pad, 3.2 x 4.0 mm SMD

Technical Specifications

Parameter Condition Min Typ Max Units Notes
Frequency Range 0.9 200 MHz
Frequency Stability Temperature stability, 0 to +70 C 10 ppm
Frequency Stability Temperature stability, 0 to +85 C 20 ppm
Total Stability 0 to +70 C operation 150 ppm 1
Total Stability 0 to +85 C operation 250 ppm 2
Operating Temperature Commercial 0 70 C
Operating Temperature Extended commercial 0 85 C
Storage Temperature 55 +125 C
Supply Voltage 1.8 V option 1.71 1.98 V
Supply Voltage 2.5 V option 2.25 2.75 V
Supply Voltage 3.3 V option 2.97 3.63 V
Supply Current LVPECL 34.0 36.0 mA
Supply Current Low Power LVPECL 19.3 22.2 mA
Supply Current LVDS 14.9 16.5 mA
Supply Current HCSL 25.3 29.3 mA
Supply Current Differential CMOS (3.3 V, 10 pF, 200 MHz) 33 36 mA
Supply Current Differential CMOS (3.3 V, 1 pF, 40 MHz) 16 mA
Supply Current Differential SSTL-3.3 24.5 27.7 mA
Supply Current Differential SSTL-2.5 24.3 26.7 mA
Supply Current Differential SSTL-1.8 22.2 25 mA
Supply Current Tri-State 9.7 10.7 mA
Supply Current Powerdown 1.0 1.9 mA
Output Symmetry VDIFF = 0 46 54 % TCLK 13 ns/TCLK
Rise and Fall Times (20/80%) LVPECL/LVDS 460 ps 3
Rise and Fall Times (20/80%) HCSL/Differential SSTL 800 ps 3
Rise and Fall Times (20/80%) Differential CMOS, 15 pF, >80 MHz 1.1 1.6 ns 3
LVPECL Output Option (DC coupling, 50 to VDD 2.0 V) Mid-level VDD 1.5 VDD 1.34 V 3
LVPECL Output Option (DC coupling, 50 to VDD 2.0 V) Diff swing .720 .880 VPK 3
Low Power LVPECL Output Option (AC coupling, 100 Differential Load) Mid-level N/A V 3
Low Power LVPECL Output Option (AC coupling, 100 Differential Load) Diff swing .68 .95 VPK 3
LVDS Output Option (2.5/3.3 V) (RTERM = 100 diff) Mid-level 1.15 1.26 V 3
LVDS Output Option (2.5/3.3 V) (RTERM = 100 diff) Diff swing 0.25 0.45 VPK 3
LVDS Output Option (1.8 V) (RTERM = 100 diff) Mid-level 0.85 0.96 V 3
LVDS Output Option (1.8 V) (RTERM = 100 diff) Diff swing 0.25 0.45 VPK 3
HCSL Output Option Mid-level 0.35 0.425 V 3
HCSL Output Option Diff swing 0.65 0.82 VPK 3
DC termination per pad 45 55
CMOS Output Voltage VOH, sourcing 9 mA VDD 0.6 V 3
CMOS Output Voltage VOL, sinking 9 mA 0.6 V 3
SSTL-1.8 Output Voltage VOH VTT + 0.375 V 4
SSTL-1.8 Output Voltage VOL VTT 0.375 V 4
SSTL-2.5 Output Voltage VOH VTT + 0.48 V 4
SSTL-2.5 Output Voltage VOL VTT 0.48 V 4
SSTL-3.3 Output Voltage VOH VTT + 0.48 V 5
SSTL-3.3 Output Voltage VOL VTT 0.48 V 5
Powerup Time From VDD crosses min spec supply 2 ms
OE Deassertion to Clk Stop 250 3 x TCLK ns
Return from Output Driver Stopped Mode 250 3 x TCLK ns
Return From Tri-State Time 12 3 x TCLK s
Return From Powerdown Time 2 ms
Period Jitter (1-sigma) Non-CMOS 1 2 ps RMS
Period Jitter (1-sigma) CMOS, CL = 7 pF 1 3 ps RMS
Integrated Phase Jitter 1.0 MHz min(20 MHz, 0.4 x FOUT), non-CMOS 0.6 1 ps RMS
Integrated Phase Jitter 1.0 MHz min(20 MHz, 0.4 x FOUT), CMOS format 0.7 1.5 ps RMS
Package Dimensions A 0.80 0.85 0.90 mm
Package Dimensions A1 0.00 0.03 0.05 mm
Package Dimensions b 0.59 0.64 0.69 mm
Package Dimensions D 3.20 BSC.
Package Dimensions E 4.00 BSC.
Package Dimensions e 1.27 BSC.
Package Dimensions L 0.95 1.00 1.05 mm
Package Dimensions L1 0.00 0.05 0.10 mm
Package Dimensions aaa 0.10 mm
Package Dimensions bbb 0.10 mm
Package Dimensions ccc 0.08 mm
Package Dimensions ddd 0.10 mm
Package Dimensions eee 0.05 mm
Pad Connections 1 OE
Pad Connections 2 NCMake no external connection to this pin
Pad Connections 3 GND
Pad Connections 4 Output
Pad Connections 5 Complementary Output
Pad Connections 6 VDD
Environmental Compliance Mechanical Shock MIL-STD-883, Method 2002.4
Environmental Compliance Mechanical Vibration MIL-STD-883, Method 2007.3
Environmental Compliance Resistance to Soldering Heat MIL-STD-202, 260 C for 8 seconds
Environmental Compliance Solderability MIL-STD-883, Method 2003.8
Environmental Compliance Damp Heat IEC 68-2-3
Environmental Compliance Moisture Sensitivity Level J-STD-020, MSL 3

2508281723_SKYWORKS-500DABB156M250ACH_C17572588.pdf

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