Product Overview
The Skyworks Si500D is a differential output silicon oscillator designed for high-reliability applications. This quartz-free, MEMS-free, and PLL-free solution offers a wide frequency range from 0.9 to 200 MHz with excellent temperature stability (20 ppm) and low jitter (<1.5 ps rms). It provides high immunity to shock and vibration, making it suitable for demanding environments. The Si500D is footprint compatible with industry-standard 3.2 x 5.0 mm XOs and is available in various output formats including CMOS, SSTL, LVPECL, LVDS, and HCSL. It supports multiple supply voltages (1.8, 2.5, or 3.3 V) and offers low power consumption. Features like driver stopped, tri-state, or powerdown operation enhance its versatility. The Si500D is RoHS compliant and offers short lead times.
Product Attributes
- Brand: Skyworks Solutions, Inc.
- Material: All-silicon oscillator
- Certifications: RoHS compliant
- Package Type: 6-pad, 3.2 x 4.0 mm SMD
- Origin: Skyworks Proprietary Information
Technical Specifications
| Parameter | Condition | Min | Typ | Max | Units |
|---|---|---|---|---|---|
| Frequency Range | 0.9 | 200 | MHz | ||
| Frequency Stability (Temperature) | 0 to +70 C | 10 | ppm | ||
| Frequency Stability (Temperature) | 0 to +85 C | 20 | ppm | ||
| Total Stability | 0 to +70 C operation | 150 | ppm | ||
| Total Stability | 0 to +85 C operation | 250 | ppm | ||
| Operating Temperature | Commercial | 0 | 70 | C | |
| Operating Temperature | Extended commercial | 0 | 85 | C | |
| Storage Temperature | 55 | +125 | C | ||
| Supply Voltage | 1.8 V option | 1.71 | 1.98 | V | |
| Supply Voltage | 2.5 V option | 2.25 | 2.75 | V | |
| Supply Voltage | 3.3 V option | 2.97 | 3.63 | V | |
| Supply Current | LVPECL | 34.0 | 36.0 | mA | |
| Supply Current | Low Power LVPECL | 19.3 | 22.2 | mA | |
| Supply Current | LVDS | 14.9 | 16.5 | mA | |
| Supply Current | HCSL | 25.3 | 29.3 | mA | |
| Supply Current | Differential CMOS (3.3 V, 10 pF, 200 MHz) | 33 | 36 | mA | |
| Supply Current | Differential CMOS (3.3 V, 1 pF, 40 MHz) | 16 | mA | ||
| Supply Current | Differential SSTL-3.3 | 24.5 | 27.7 | mA | |
| Supply Current | Differential SSTL-2.5 | 24.3 | 26.7 | mA | |
| Supply Current | Differential SSTL-1.8 | 22.2 | 25 | mA | |
| Supply Current | Tri-State | 9.7 | 10.7 | mA | |
| Supply Current | Powerdown | 1.0 | 1.9 | mA | |
| Output Symmetry | VDIFF = 0 | 46 13 ns/TCLK | 54 + 13 ns/TCLK | % | |
| Rise and Fall Times (20/80%) | LVPECL/LVDS | 460 | ps | ||
| Rise and Fall Times (20/80%) | HCSL/Differential SSTL | 800 | ps | ||
| Rise and Fall Times (20/80%) | Differential CMOS, 15 pF, >80 MHz | 1.1 | 1.6 | ns | |
| Powerup Time | From VDD min spec | 2 | ms | ||
| OE Deassertion to Clk Stop | 250 + 3 x TCLK | ns | |||
| Return from Output Driver Stopped Mode | 250 + 3 x TCLK | ns | |||
| Return From Tri-State Time | 12 + 3 x TCLK | s | |||
| Return From Powerdown Time | 2 | ms | |||
| Period Jitter (1-sigma) | Non-CMOS | 1 | 2 | ps RMS | |
| Period Jitter (1-sigma) | CMOS, CL = 7 pF | 1 | 3 | ps RMS | |
| Integrated Phase Jitter | 1.0 MHz min(20 MHz, 0.4 x FOUT), non-CMOS | 0.6 | 1 | ps RMS | |
| Integrated Phase Jitter | 1.0 MHz min(20 MHz, 0.4 x FOUT), CMOS format | 0.7 | 1.5 | ps RMS | |
| Package Dimensions (mm) | A | 0.80 | 0.85 | 0.90 | mm |
| Package Dimensions (mm) | A1 | 0.00 | 0.03 | 0.05 | mm |
| Package Dimensions (mm) | b | 0.59 | 0.64 | 0.69 | mm |
| Package Dimensions (mm) | D | 3.20 | BSC. | BSC. | |
| Package Dimensions (mm) | E | 4.00 | BSC. | BSC. | |
| Package Dimensions (mm) | e | 1.27 | BSC. | BSC. | |
| Package Dimensions (mm) | L | 0.95 | 1.00 | 1.05 | mm |
| Package Dimensions (mm) | L1 | 0.00 | 0.05 | 0.10 | mm |
| Package Dimensions (mm) | aaa | 0.10 | mm | ||
| Package Dimensions (mm) | bbb | 0.10 | mm | ||
| Package Dimensions (mm) | ccc | 0.08 | mm | ||
| Package Dimensions (mm) | ddd | 0.10 | mm | ||
| Package Dimensions (mm) | eee | 0.05 | mm | ||
| Pad Connections | 1 | OE | |||
| Pad Connections | 2 | NCMake no external connection to this pin | |||
| Pad Connections | 3 | GND | |||
| Pad Connections | 4 | Output | |||
| Pad Connections | 5 | Complementary Output | |||
| Pad Connections | 6 | VDD | |||
| Environmental Compliance | Mechanical Shock | MIL-STD-883, Method 2002.4 | |||
| Environmental Compliance | Mechanical Vibration | MIL-STD-883, Method 2007.3 | |||
| Environmental Compliance | Resistance to Soldering Heat | MIL-STD-202, 260 C for 8 seconds | |||
| Environmental Compliance | Solderability | MIL-STD-883, Method 2003.8 | |||
| Environmental Compliance | Damp Heat | IEC 68-2-3 | |||
| Environmental Compliance | Moisture Sensitivity Level | J-STD-020, MSL 3 |
2508281723_SKYWORKS-500DEAA18M4320ACF_C17669662.pdf
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