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Specifications
Frequency Stability:
±20ppm
Voltage - Supply:
3.3V
Operating Temperature:
-40℃~+85℃
Frequency:
212.5MHz
Mfr. Part #:
535AB212M500DGR
Package:
SMD7050-6P
Key Attributes
Model Number:
535AB212M500DGR
Product Description
Skyworks Solutions Si535/536 Ultra Low Jitter Crystal Oscillator (XO)
The Si535/536 XO leverages Skyworks Solutions advanced DSPLL circuitry to deliver an ultra-low jitter clock at high-speed differential frequencies. Unlike traditional XOs that require a unique crystal for each output frequency, the Si535/536 uses a single fixed crystal to support a wide range of output frequencies. This IC-based approach ensures exceptional frequency stability and reliability from the crystal resonator. The DSPLL clock synthesis offers superior supply noise rejection, simplifying the generation of low jitter clocks in noisy environments common in communication systems. The Si535/536 IC-based XO is factory programmed, eliminating long lead times associated with custom oscillators.
Applications
- 10/40/100G data centers
- 10G Ethernet switches/routers
- Fibre channel/SAS/storage
- Enterprise servers
- Networking
- Telecommunications
Product Attributes
- Brand: Skyworks Solutions, Inc.
- Technology: DSPLL circuitry
- Package: Industry-standard 5 x 7 mm
- Compliance: Pb-free/RoHS-compliant
- Certifications: Meets MIL-STD-883 qualification test requirements
Technical Specifications
| Parameter | Symbol | Test Condition | Min | Typ | Max | Unit | Notes |
| Electrical Specifications | |||||||
| Supply Voltage | VDD | 3.3 V option | 2.97 | 3.3 | 3.63 | V | Selectable parameter specified by part number. |
| VDD | 2.5 V option | 2.25 | 2.5 | 2.75 | V | Selectable parameter specified by part number. | |
| Supply Current | IDD | Output enabled, LVPECL | 111 | 121 | mA | ||
| IDD | Output enabled, LVDS | 90 | 98 | mA | |||
| IDD | Tristate mode | 60 | 75 | mA | |||
| Output Enable (OE) | VIH | 0.75 x VDD | V | OE pin includes a 17 k pullup resistor to VDD. | |||
| VIL | 0.5 | V | OE pin includes a 17 k pullup resistor to VDD. | ||||
| Operating Temperature Range | TA | -40 | 85 | C | |||
| Frequency Characteristics | |||||||
| Nominal Frequency | fO | LVPECL/LVDS | 100 | 312.5 | MHz | See Section 3. "Ordering Information" for available frequencies. | |
| Initial Accuracy | fi | Measured at +25 C at time of shipping | 1.5 | ppm | |||
| Temperature Stability | -7 | +7 | ppm | Selectable parameter specified by part number. | |||
| -20 | +20 | ppm | Selectable parameter specified by part number. | ||||
| Aging (1st year) | fa | Frequency drift over first year | 3 | ppm | |||
| Aging (20 year) | fa | Frequency drift over 20 year life | 10 | ppm | |||
| Total Stability | Temp stability = 20 ppm | 31.5 | ppm | ||||
| Temp stability = 7 ppm | 20 | ppm | |||||
| Powerup Time | tOSC | TA = 40C to +85C | 10 | ms | Time from powerup or tristate mode to fO. | ||
| Output Levels and Symmetry | |||||||
| LVPECL Output Option | VO Mid-level | VDD 1.42 | VDD 1.25 | V | 50 to VDD 2.0 V. | ||
| VOD Swing (diff) | 1.1 | 1.9 | VPP | 50 to VDD 2.0 V. | |||
| VSE Swing (Single-ended) | 0.55 | 0.95 | VPP | 50 to VDD 2.0 V. | |||
| LVDS Output Option | VO Mid-level | 1.125 | 1.20 | 1.275 | V | Rterm = 100 (differential). | |
| VOD Swing (diff) | 0.5 | 0.7 | 0.9 | VPP | Rterm = 100 (differential). | ||
| Rise/Fall time | tR, tF | (20/80%) | 350 | ps | |||
| Symmetry (duty cycle) | SYM | Differential | 45 | 55 | % | ||
| Phase Jitter | |||||||
| Phase Jitter* (RMS) | J | 10 kHz to 1 MHz (data center) | 0.19 | 0.35 | ps | Applies to output frequencies: 156.25 MHz. | |
| J | 12 kHz to 20 MHz brickwall | 0.25 | 0.40 | ps | Applies to output frequencies: 156.25 MHz. | ||
| Period Jitter | |||||||
| Period Jitter* | JPER | RMS | 2 | ps | N = 1000 cycles. | ||
| JPER | Peak-to-Peak | 14 | ps | N = 1000 cycles. | |||
| Environmental Compliance | |||||||
| Mechanical Shock | MIL-STD-883, Method 2002 | ||||||
| Mechanical Vibration | MIL-STD-883, Method 2007 | ||||||
| Solderability | MIL-STD-883, Method 2003 | ||||||
| Gross & Fine Leak | MIL-STD-883, Method 1014 | ||||||
| Resistance to Solder Heat | MIL-STD-883, Method 2036 | ||||||
| Moisture Sensitivity Level | J-STD-020, MSL1 | ||||||
| Contact Pads | Gold over Nickel | ||||||
| Thermal Characteristics (Typical values TA = 25 C, VDD = 3.3 V) | |||||||
| Thermal Resistance Junction to Ambient | JA | Still Air | 84.6 | C/W | |||
| Thermal Resistance Junction to Case | JC | Still Air | 38.8 | C/W | |||
| Ambient Temperature | TA | -40 | 85 | C | |||
| Junction Temperature | TJ | 125 | C | ||||
| Absolute Maximum Ratings | |||||||
| Maximum Operating Temperature | TAMAX | 85 | C | Stresses beyond those listed may cause permanent damage. | |||
| Supply Voltage, 2.5/3.3 V Option | VDD | -0.5 | +3.8 | V | Stresses beyond those listed may cause permanent damage. | ||
| Input Voltage (any input pin) | VI | -0.5 | VDD + 0.3 | V | Stresses beyond those listed may cause permanent damage. | ||
| Storage Temperature | TS | -55 | +125 | C | Stresses beyond those listed may cause permanent damage. | ||
| ESD Sensitivity (HBM, per JESD22-A114) | ESD | 2500 | V | ||||
| Soldering Temperature (Pb-free profile) | TPEAK | 260 | C | Compliant with JEDEC J-STD-020C. | |||
| Soldering Temperature Time @ TPEAK (Pb-free profile) | tP | 20 | 40 | seconds | Compliant with JEDEC J-STD-020C. | ||
2508281722_SILICON-LABS-535AB212M500DGR_C2030239.pdf
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