Product Overview
The Skyworks Si535/536 is an ultra-low jitter crystal oscillator (XO) utilizing advanced DSPLL circuitry to deliver high-speed differential clocks. Unlike traditional XOs, it uses a single fixed crystal to generate a wide range of output frequencies, offering superior frequency stability and reliability. Its IC-based design provides excellent supply noise rejection, simplifying clock generation in noisy communication system environments. The Si535/536 is factory programmed, reducing lead times for custom oscillators and is available in a 5 x 7 mm package.
Product Attributes
- Brand: Skyworks Solutions, Inc.
- Technology: DSPLL circuitry
- Package: 5 x 7 mm
- Compliance: Pb-free/RoHS-compliant
- Material: Gold over Nickel contact pads
Technical Specifications
| Parameter | Symbol | Test Condition | Min | Typ | Max | Unit | Notes | |
| Recommended Operating Conditions | ||||||||
| Supply Voltage (3.3 V option) | VDD | 2.97 | 3.3 | 3.63 | V | Selectable parameter specified by part number. | ||
| Supply Voltage (2.5 V option) | VDD | 2.25 | 2.5 | 2.75 | V | Selectable parameter specified by part number. | ||
| Supply Current (Output enabled, LVPECL) | IDD | 111 | 121 | mA | ||||
| Supply Current (Output enabled, LVDS) | IDD | 90 | 98 | mA | ||||
| Supply Current (Tristate mode) | IDD | 60 | 75 | mA | ||||
| Output Enable (OE) VIH | VIH | 0.75 x VDD | V | OE pin includes a 17 k pullup resistor to VDD. | ||||
| Output Enable (OE) VIL | VIL | 0.5 | V | OE pin includes a 17 k pullup resistor to VDD. | ||||
| Operating Temperature Range | TA | 40 | 85 | C | ||||
| CLK Output Frequency Characteristics | ||||||||
| Nominal Frequency | fO | LVPECL/LVDS | 100 | 312.5 | MHz | See Section 3. "Ordering Information" for available frequencies. | ||
| Initial Accuracy | fi | Measured at +25 C at time of shipping | 1.5 | ppm | ||||
| Temperature Stability (20 ppm option) | 20 | +20 | ppm | Selectable parameter specified by part number. | ||||
| Temperature Stability (7 ppm option) | 7 | +7 | ppm | Selectable parameter specified by part number. | ||||
| Aging (Frequency drift over first year) | fa | 3 | ppm | |||||
| Aging (Frequency drift over 20 year life) | fa | 10 | ppm | |||||
| Total Stability (Temp stability = 20 ppm) | 31.5 | |||||||
| Total Stability (Temp stability = 7 ppm) | 20 | |||||||
| Powerup Time | tOSC | TA = 40C to +85C | 10 | ms | Time from powerup or tristate mode to fO. | |||
| CLK Output Levels and Symmetry | ||||||||
| LVPECL Mid-level Output Voltage | VO | 50 to VDD 2.0 V | VDD 1.42 | VDD 1.25 | V | |||
| LVPECL Differential Voltage Swing | VOD | 1.1 | 1.9 | VPP | ||||
| LVPECL Single-ended Voltage Swing | VSE | 0.55 | 0.95 | VPP | ||||
| LVDS Mid-level Output Voltage | VO | Rterm = 100 (differential) | 1.125 | 1.20 | 1.275 | V | ||
| LVDS Differential Voltage Swing | VOD | Rterm = 100 (differential) | 0.5 | 0.7 | 0.9 | VPP | ||
| Rise/Fall time (20/80%) | tR, tF | 350 | ps | |||||
| Symmetry (duty cycle) Differential | SYM | 45 | 55 | % | ||||
| CLK Output Phase Jitter | ||||||||
| Phase Jitter* (RMS) | J | 10 kHz to 1 MHz (data center) | 0.19 | 0.35 | ps | Applies to output frequencies: 156.25 MHz. | ||
| Phase Jitter* (RMS) | J | 12 kHz to 20 MHz brickwall | 0.25 | 0.40 | ps | Applies to output frequencies: 156.25 MHz. | ||
| CLK Output Period Jitter | ||||||||
| Period Jitter* RMS | JPER | N = 1000 cycles | 2 | ps | ||||
| Period Jitter* Peak-to-Peak | JPER | N = 1000 cycles | 14 | ps | ||||
| Environmental Compliance | ||||||||
| Mechanical Shock | MIL-STD-883, Method 2002 | Meets requirements | ||||||
| Mechanical Vibration | MIL-STD-883, Method 2007 | Meets requirements | ||||||
| Solderability | MIL-STD-883, Method 2003 | Meets requirements | ||||||
| Gross & Fine Leak | MIL-STD-883, Method 1014 | Meets requirements | ||||||
| Resistance to Solder Heat | MIL-STD-883, Method 2036 | Meets requirements | ||||||
| Moisture Sensitivity Level | J-STD-020, MSL1 | Meets requirements | ||||||
| Thermal Characteristics (Typical values TA = 25 C, VDD = 3.3 V) | ||||||||
| Thermal Resistance Junction to Ambient | JA | Still Air | 84.6 | C/W | ||||
| Thermal Resistance Junction to Case | JC | Still Air | 38.8 | C/W | ||||
| Ambient Temperature | TA | 40 | 85 | C | ||||
| Junction Temperature | TJ | 125 | C | |||||
| Absolute Maximum Ratings | ||||||||
| Maximum Operating Temperature | TAMAX | 85 | C | Stresses beyond those listed may cause permanent damage. | ||||
| Supply Voltage, 2.5/3.3 V Option | VDD | 0.5 | +3.8 | V | Stresses beyond those listed may cause permanent damage. | |||
| Input Voltage (any input pin) | VI | 0.5 | VDD + 0.3 | V | Stresses beyond those listed may cause permanent damage. | |||
| Storage Temperature | TS | 55 | +125 | C | Stresses beyond those listed may cause permanent damage. | |||
| ESD Sensitivity (HBM, per JESD22-A114) | ESD | 2500 | V | |||||
| Soldering Temperature (Pb-free profile) | TPEAK | 260 | C | Compliant with JEDEC J-STD-020C. | ||||
| Soldering Temperature Time @ TPEAK (Pb-free profile) | tP | 20 | 40 | seconds | Compliant with JEDEC J-STD-020C. | |||
2508281722_SILICON-LABS-535AC150M000DGR_C2030291.pdf
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