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Specifications
Current - Saturation (Isat):
2.3A
Mfr. Part #:
CIGT252010LM2R2MNE
Package:
1008
Key Attributes
Model Number:
CIGT252010LM2R2MNE
Product Description
Product Overview
The CIGT252010LM2R2MNE is a compact, monolithic metal composite power inductor designed for high reliability in mobile devices. It features a low DCR structure for high efficiency in power circuits and is free of RoHS-regulated substances and halogens. This inductor is suitable for applications such as smartphones, tablet devices, wearable devices, and power converter modules.
Product Attributes
- Brand: CIGT
- Type: Metal Composite Thin Film Type
- Certifications: RoHS-regulated substances free, Halogen free
Technical Specifications
| Model | Size (inch/mm) | Thickness (mm) | Inductance (uH) | Inductance Tolerance (%) | DC Resistance (m) (Typ.) | Rated DC Current (Isat) [A] (Typ.) | Rated DC Current (Irms) [A] (Typ.) | Absolute Maximum Voltage (DC) | Operating Temperature Range (C) |
|---|---|---|---|---|---|---|---|---|---|
| CIGT252010LM2R2MNE | 1008 / 2520 | 1.0 (Max) | 2.2 | 20 | 81 | 2.5 | 2.3 | 20V | -40 to +125 |
Packaging
Embossed Taping: 3000 pcs/reel
Reliability Test
| Test Type | Condition | Result |
|---|---|---|
| Drop Test | Random Free Fall test on concrete plate. 1 meter, 10 drops | No mechanical damage, Inductance change to be within 20% to the initial. |
| Terminal Adhesion Test | W(kgf): 0.5, TIME(sec): 101 | No indication of peeling shall occur on the terminal electrode. |
| Vibration Test | Solder the sample on PCB. Vibrate as apply 10~55Hz, 1.5mm amplitude for 2 hours in each of three(X,Y,Z) axis (total 6 hours). | No mechanical damage, Inductance change to be within 20% to the initial. |
| Bending Test | Bending Limit; 2mm, Test Speed; 1.0mm/sec. Keep the test board at the limit point in 5 sec. PCB thickness : 1.6mm | No mechanical damage |
| High Temperature Loading Test | 852, Rated Current for 50012 hours. Measure after 24 hours at normal temp/humidity. | No mechanical damage, Inductance change to be within 20% to the initial. |
| Reflow Test | Peak 2605, 3 times | No mechanical damage, Inductance change to be within 20% to the initial. |
| High Temperature Test | Solder the sample on PCB. Exposure at 1252 for 50012 hours. Measure after 24 hours at normal temp/humidity. | No mechanical damage, Inductance change to be within 20% to the initial. |
| High Temp. Humidity Resistance Loading Test | 852, 85%RH, Rated Current for 50012 hours. Measure after 24 hours at normal temp/humidity. | No mechanical damage, Inductance change to be within 20% to the initial. |
| High Temp. Humidity Resistance Test | 852, 85%RH, for 50012 hours. Measure after 24 hours at normal temp/humidity. | No mechanical damage, Inductance change to be within 20% to the initial. |
| Low Temperature Test | Solder the sample on PCB. Exposure at -552 for 50012 hours. Measure after 24 hours at normal temp/humidity. | No mechanical damage, Inductance change to be within 20% to the initial. |
| Resistance to Soldering | After being dipped in flux for 41 seconds, and preheated at 150180 for 23 min, the specimen shall be immersed in solder at 2605 for 10 0.5 seconds. Remaining terminal Electrode: 75% min. | No mechanical damage. Inductance change to be within 20% to the initial. |
| Thermal Shock (Temperature Cycle test) | Repeat 100 cycles: -403 for 30 min 853 for 30 min | No mechanical damage, Inductance change to be within 20% to the initial. |
| Solderability | After being dipped in flux for 41 seconds, and preheated at 150180 for 23 min, the specimen shall be immersed in solder at 2455 for 41 seconds. | More than 90% of terminal electrode should be soldered newly. |
2410121931_Samsung-Electro-Mechanics-CIGT252010LM2R2MNE_C307633.pdf
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