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Specifications
Current - Saturation (Isat):
1.4A
Mfr. Part #:
CIGW201610GL4R7MLE
Package:
0806
Key Attributes
Model Number:
CIGW201610GL4R7MLE
Product Description
Product Overview
The CIGW201610GL4R7MLE is a small power inductor designed for mobile devices and power converter modules. It features a monolithic structure for high reliability and a low DCR structure for high efficiency in power circuits. This inductor is free of RoHS-regulated substances and is halogen-free, making it suitable for applications in smartphones, tablets, and wearable devices.
Product Attributes
- Brand: CIG (implied by product code)
- Type: Metal Composite Wire Wound Type
- Structure: Monolithic
- Certifications: RoHS-regulated substances free, Halogen free
Technical Specifications
| Model | Type | Dimension (L x W x T) [mm] | Inductance [uH] | Inductance Tolerance (%) | DC Resistance [m] (Typ.) | Rated DC Current (Isat) [A] (Max.) | Rated DC Current (Irms) [A] (Typ.) | Absolute Maximum Voltage [V] | Operating Temperature Range [C] |
|---|---|---|---|---|---|---|---|---|---|
| CIGW201610GL4R7MLE (0806/2016) | Metal Composite Wire Wound | 2.0 x 1.6 x 1.0 | 4.7 | 20 | 200 | 1.4 | 1.6 | 20 | -40 to +125 |
Packaging Information
| Packaging Style | Quantity (pcs/reel) | Dimension [mm] (L x W x T) |
|---|---|---|
| Embossed Taping | 3000 | 2.00.2 x 1.60.2 x 1.0 max |
Recommended Land Pattern (Unit: mm)
| A | B | C |
|---|---|---|
| 0.8 | 0.8 | 1.8 |
Product Identification Breakdown
CIG W 2016 10 GL 4R7 M L E
- (1) Power Inductor
- (2) Type (W: Metal Composite Wire Wound Type)
- (3) Dimension (2016: 2.0mm 1.6 mm)
- (4) Thickness (10: 1.0mm)
- (5) Remark (Characterization Code)
- (6) Inductance (4R7: 4.7 uH)
- (7) Tolerance (M: 20%)
- (8) Internal Code
- (9) Packaging (C: paper tape, E: embossed tape)
Reliability Test Items
| Reliability Test Item | Specified Value | Test Condition |
|---|---|---|
| Solderability | More than 90% of terminal electrode should be soldered newly. | After being dipped in flux for 41 seconds, and preheated at 150180 for 23 min, the specimen shall be immersed in solder at 2455 for 41 seconds. |
| Resistance to Soldering | No mechanical damage. Remaining terminal Electrode: 75% min. Inductance change to be within 20% to the initial. | After being dipped in flux for 41 seconds, and preheated at 150180 for 23 min, the specimen shall be immersed in solder at 2605 for 10 0.5 seconds. |
| Thermal Shock (Temperature Cycle test) | No mechanical damage Inductance change to be within 20% to the initial. | Repeat 100 cycles under the following conditions. -403 for 30 min 853 for 30 min |
| High Temp. Humidity Resistance Test | No mechanical damage Inductance change to be within 20% to the initial. | 852, 85%RH, for 50012 hours. Measure the test items after leaving at normal temperature and humidity for 24 hours. |
| Low Temperature Test | No mechanical damage Inductance change to be within 20% to the initial. | Solder the sample on PCB. Exposure at -552 for 50012 hours. Measure the test items after leaving at normal temperature and humidity for 24hours. |
| High Temperature Test | No mechanical damage Inductance change to be within 20% to the initial. | Solder the sample on PCB. Exposure at 1252 for 50012 hours. Measure the test items after leaving at normal temperature and humidity for 24hours. |
| High Temp. Humidity Resistance Loading Test | No mechanical damage Inductance change to be within 20% to the initial. | 852, 85%RH, Rated Current for 50012 hours. Measure the test items after leaving at normal temperature and humidity for 24 hours. |
| High Temperature Loading Test | No mechanical damage Inductance change to be within 20% to the initial. | 852, Rated Current for 50012 hours. Measure the test items after leaving at normal temperature and humidity for 24 hours. |
| Reflow Test | No mechanical damage Inductance change to be within 20% to the initial. | Peak 2605, 3 times. |
| Vibration Test | No mechanical damage Inductance change to be within 20% to the initial. | Solder the sample on PCB. Vibrate as apply 10~55Hz, 1.5mm amplitude for 2 hours in each of three(X,Y,Z) axis (total 6 hours). |
| Bending Test | No mechanical damage. | Bending Limit; 2mm. Test Speed; 1.0mm/sec. Keep the test board at the limit point in 5 sec. PCB thickness : 1.6mm. |
| Drop Test | No mechanical damage Inductance change to be within 20% to the initial. | Random Free Fall test on concrete plate. 1 meter, 10 drops. |
| Terminal Adhesion Test | No indication of peeling shall occur on the terminal electrode. | W(kgf) 0.5, TIME(sec) 101. |
Recommended Soldering Conditions
| Method | Details |
|---|---|
| REFLOW SOLDERING | Preheating Temperature 150min. Temperature Differential T130. Peak 2605, 3 times. |
| FLOW SOLDERING | Soldering Time 3sec max. Wattage 50W max. |
| IRON SOLDERING | Temperature of Soldering Iron Tip 280max. Soldering Time 3sec max. Wattage 50W max. |
2506301511_Samsung-Electro-Mechanics-CIGW201610GL4R7MLE_C5596329.pdf
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