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Specifications
Current - Saturation (Isat):
2.6A
Mfr. Part #:
CIGT201610LM1R0MNE
Package:
0806
Key Attributes
Model Number:
CIGT201610LM1R0MNE
Product Description
Product Overview
The CIGT201610LM1R0MNE is a monolithic, small power inductor designed for mobile devices and power converter modules. It features a low DCR structure for high efficiency in power circuits and is built with a monolithic structure for high reliability. This inductor is free of RoHS-regulated substances and is halogen-free. Its applications include smart phones, tablet PCs, wearable devices, and power converter modules.
Product Attributes
- Brand: CIG (implied by product identification)
- Type: Metal Composite Thin Film Type
- Certifications: RoHS-regulated substances free, Halogen free
Technical Specifications
| Model | Type | Dimension [mm] (L x W) | Thickness [mm] (T) | Inductance [uH] (Typ.) | Inductance Tolerance (%) | DC Resistance [m] (Max.) | Rated DC Current (Isat) [A] (Typ.) | Rated DC Current (Irms) [A] (Typ.) | Absolute Maximum Voltage [V] | Operating Temperature Range [C] |
|---|---|---|---|---|---|---|---|---|---|---|
| CIGT201610LM1R0MNE | 0806/2016 | 2.0 x 1.6 | 1.0 | 1.0 | 20 | 72 | 0.8 | 0.8 | DC 20 | -40 to +125 |
Measurement Conditions:
- Inductance: Measured with a LCR meter 4991A (Agilent) or equivalent (Test Freq. 1MHz, Level 0.1V).
- DC Resistance: Measured with a Resistance HI-TESTER 3541 (HIOKI) or equivalent.
- Maximum allowable DC current (Isat): Defined when DC current flows and the initial value of inductance has decreased by 30% (Reference: ambient temperature is 2510).
- Allowable current of temperature rise (Irms): Specified when temperature of the inductor is raised 40 by DC current (Reference: ambient temperature is 2510).
Recommended Land Pattern (Unit: mm):
| A | B | C |
|---|---|---|
| 0.8 | 0.8 | 1.8 |
Recommended Soldering Condition:
- Reflow Soldering: Preheating Temperature 150 min., Temperature Differential T130, Soldering Time 3sec max., Peak 2605.
- Flow Soldering: Soldering Time 3sec max.
- Iron Soldering: Temperature of Soldering Iron Tip 280 max., 50W max.
Packaging:
- Embossed Taping Packaging Style
- Quantity: 3000 pcs/reel
Reliability Test Item:
| Test Item | Specified Value | Test Condition |
|---|---|---|
| Solderability | More than 90% of terminal electrode should be soldered newly. | After being dipped in flux for 41 seconds, and preheated at 150180 for 23 min, the specimen shall be immersed in solder at 2455 for 41 seconds. |
| Resistance to Soldering | No mechanical damage. Remaining terminal Electrode: 75% min. Inductance change to be within 20% to the initial. | After being dipped in flux for 41 seconds, and preheated at 150180 for 23 min, the specimen shall be immersed in solder at 2605 for 10 0.5 seconds. |
| Thermal Shock (Temperature Cycle test) | No mechanical damage Inductance change to be within 20% to the initial. | Repeat 100 cycles under the following conditions: -403 for 30 min 853 for 30 min |
| High Temp. Humidity Resistance Test | No mechanical damage Inductance change to be within 20% to the initial. | 852, 85%RH, for 50012 hours. Measure after 24 hours at normal temperature and humidity. |
| Low Temperature Test | No mechanical damage Inductance change to be within 20% to the initial. | Solder the sample on PCB. Exposure at -552 for 50012 hours. Measure after 24 hours at normal temperature and humidity. |
| High Temperature Test | No mechanical damage Inductance change to be within 20% to the initial. | Solder the sample on PCB. Exposure at 1252 for 50012 hours. Measure after 24 hours at normal temperature and humidity. |
| High Temp. Humidity Resistance Loading Test | No mechanical damage Inductance change to be within 20% to the initial. | 852, 85%RH, Rated Current for 50012 hours. Measure after 24 hours at normal temperature and humidity. |
| High Temperature Loading Test | No mechanical damage Inductance change to be within 20% to the initial. | 852, Rated Current for 50012 hours. Measure after 24 hours at normal temperature and humidity. |
| Reflow Test | No mechanical damage Inductance change to be within 20% to the initial. | Peak 2605, 3 times. |
| Vibration Test | No mechanical damage Inductance change to be within 20% to the initial. | Solder the sample on PCB. Vibrate as apply 10~55Hz, 1.5mm amplitude for 2 hours in each of three (X,Y,Z) axis (total 6 hours). |
| Bending Test | No mechanical damage | Bending Limit; 2mm. Test Speed; 1.0mm/sec. Keep the test board at the limit point in 5 sec. PCB thickness : 1.6mm |
| Drop Test | No mechanical damage Inductance change to be within 20% to the initial. | Random Free Fall test on concrete plate. 1 meter, 10 drops. |
| Terminal Adhesion Test | No indication of peeling shall occur on the terminal electrode. | W(kgf): 0.5, TIME(sec): 101 |
2410121931_Samsung-Electro-Mechanics-CIGT201610LM1R0MNE_C307628.pdf
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