Samsung Chip Inductors and Beads
Samsung offers a comprehensive range of chip inductors and chip beads designed for EMI suppression and high-frequency applications. These components are manufactured in accordance with EU RoHS directives, ensuring compliance with restricted material regulations. The product line includes various series such as CIB/CIM for general EMI suppression, CIC/CIS for high current applications, and CIV for GHz noise suppression, along with power inductors (CIGT, CIG, CIH, CIL) and filters (Diplexer, Band Pass/Low Pass Filter). These components are suitable for a wide array of electronic devices, including computers, printers, VCRs, TVs, mobile phones, DSC, DVC, and PDAs, providing effective noise suppression and signal integrity.
- Brand: Samsung
- Compliance: EU RoHS directive
- Restricted Materials (Not Used): Cd, Pb, Hg, Cr6+, As, Br and compounds, PCB, asbestos
- Ozone Layer Depleting Substances (Not Used): Freon, Haron, 1-1-1 TCE, CCl4, HCFC
Chip Beads - CIB/CIM Series
Designed for EMI suppression, these chip beads offer effective noise reduction across a wide frequency range. The CIB series, featuring a mono-layer internal conductor, provides low impedance and DC resistance, while the CIM series, with a multilayered internal conductor, offers high impedance and excellent attenuation characteristics.
| Series | Type | Size Code (mm/inch) | Impedance Range () @100MHz | Effective Frequency Range |
|---|---|---|---|---|
| CIB | General Signal (monolayer) | 1608(0603) | 10-33 | 1MHz - 10GHz |
| CIB | General Signal (monolayer) | 2012(0805) | 11-47 | 1MHz - 10GHz |
| CIB | General Signal (monolayer) | 3216(1206) | 26-70 | 1MHz - 10GHz |
| CIB | General Signal (monolayer) | 3225(1210) | 31-60 | 1MHz - 10GHz |
| CIB | General Signal (monolayer) | 4516(1806) | 80-150 | 1MHz - 10GHz |
| CIM | High speed signal (multilayer) | 0603(0201) | 80-600 | 1MHz - 10GHz |
| CIM | High speed signal (multilayer) | 1005(0402) | 10-1000 | 1MHz - 10GHz |
| CIM | High speed signal (multilayer) | 1608(0603) | 80-2000 | 1MHz - 10GHz |
| CIM | High speed signal (multilayer) | 2012(0805) | 80-2000 | 1MHz - 10GHz |
| CIM | High speed signal (multilayer) | 3216(1206) | 10-600 | 1MHz - 10GHz |
| CIB | High Current | 1005(0402) | 10 | 1MHz - 10GHz |
| CIB | High Current | 0603(0201) | 120-240 | 1MHz - 10GHz |
| CIB | High Current | 1005(0402) | 30-1800 | 1MHz - 10GHz |
| CIB | High Current | 1608(0603) | 30-2500 | 1MHz - 10GHz |
| CIB | High Current | 2012(0805) | 26-2500 | 1MHz - 10GHz |
| CIB | High Current | 3216(1206) | 150-1500 | 1MHz - 10GHz |
| CIC | For High Current | 0603(0201) | 30-80 | 1MHz - 10GHz |
| CIC | For High Current | 1005(0402) | 75-220 | 1MHz - 10GHz |
| CIC | For High Current | 1608(0603) | 70-240 | 1MHz - 10GHz |
| CIC | For High Current | 2012(0805) | 70-240 | 1MHz - 10GHz |
| CIC | For High Current | 3216(1206) | 1500-2500 | 1MHz - 10GHz |
| CIC | For High Current | 4516(1806) | 1500-2500 | 1MHz - 10GHz |
| CIC | For High Current | 1005(0402) | 5-220 | 1MHz - 10GHz |
| CIC | For High Current | 1608(0603) | 47-470 | 1MHz - 10GHz |
| CIC | For High Current | 2012(0805) | 80-160 | 1MHz - 10GHz |
| CIC | For High Current | 3216(1206) | 30-120 | 1MHz - 10GHz |
| CIC | For High Current | 4516(1806) | 8-600 | 1MHz - 10GHz |
| CIS | For High Current | 1005(0402) | 60-600 | 1MHz - 10GHz |
| CIS | For High Current | 1608(0603) | 30-600 | 1MHz - 10GHz |
| CIS | For High Current | 1608(0603)~4516(1806) | 26-600 | 1MHz - 10GHz |
| CIS | For High Current | 2012(0805)~4516(1806) | 30-120 | 1MHz - 10GHz |
| CIS | For High Current | 1005(0402) | 30-240 | 1MHz - 10GHz |
| CIS | For High Current | 1608(0603) | 600-1000 | 1MHz - 10GHz |
| CIS | For High Current | 1608(0603)~4516(1806) | 1000-1800 | 1MHz - 10GHz |
| CIC | Bead | 0402(01005) | 30-120 | 1MHz - 10GHz |
| CIC | Bead | 0603(0201) | 30-120 | 1MHz - 10GHz |
Chip Inductors - CIGT, CIG, CIH, CIL Series
These series offer various types of inductors, including Metal Composite Thin Film Power Inductors, Metal Composite Power Inductors, Ferrite Multilayer Power Inductors, and General Inductors. They are designed for DC-DC converters and high-frequency applications.
| Series | Type | Size Code (mm/inch) | Inductance Range (H) |
|---|---|---|---|
| CIGT | Metal Composite Thin Film Power Inductor (DC-DC Converter) | 2012(0805) | 0.47-1.0 |
| CIGT | Metal Composite Thin Film Power Inductor (DC-DC Converter) | 2016(0806) | 0.47-2.2 |
| CIGT | Metal Composite Thin Film Power Inductor (DC-DC Converter) | 2016(0806) | 0.27-4.7 |
| CIGT | Metal Composite Thin Film Power Inductor (DC-DC Converter) | 2016(0806) | 0.47-4.7 |
| CIGT | Metal Composite Thin Film Power Inductor (DC-DC Converter) | 2016(0806) | 0.33-4.7 |
| CIGT | Metal Composite Thin Film Power Inductor (DC-DC Converter) | 2520(1008) | 0.47-2.2 |
| CIGT | Metal Composite Thin Film Power Inductor (DC-DC Converter) | 2520(1008) | 0.47-10 |
| CIG | Ferrite Multilayer Power Inductor (DC-DC Converter) | 1608(0603) | 0.47-4.7 |
| CIG | Ferrite Multilayer Power Inductor (DC-DC Converter) | 1608(0603) | 0.27-4.7 |
| CIG | Ferrite Multilayer Power Inductor (DC-DC Converter) | 2012(0805) | 0.47-4.7 |
| CIG | Ferrite Multilayer Power Inductor (DC-DC Converter) | 2520(1008) | 0.047-33 |
| CIG | Ferrite Multilayer Power Inductor (DC-DC Converter) | 2520(1008) | 0.047-33 |
| CIG | Ferrite Multilayer Power Inductor (DC-DC Converter) | 2012(0805) | 0.047-33 |
| CIG | Ferrite Multilayer Power Inductor (DC-DC Converter) | 2520(1008) | 0.6-100nH |
| CIG | Ferrite Multilayer Power Inductor (DC-DC Converter) | 2012(0805) | 2.5 |
| CIG | Ferrite Multilayer Power Inductor (DC-DC Converter) | 1608(0603) | 0.47-2.2 |
| CIL | General Inductor | 1005(0402) | 1-100nH |
| CIL | General Inductor | 1608(0603) | 1-270nH |
| CIL | General Inductor | 2012(0805) | 1-270nH |
| CIL | General Inductor | 3216(1206) | 1-100nH |
| CIH | High Frequency Inductor | 0402(01005) | 0.6-100nH |
| CIH | High Frequency Inductor | 0603(0201) | 0.6-100nH |
| CIH | High Frequency Inductor | 0603(0201) | 0.6-22nH |
| CIH | High Frequency Inductor | 0603(0201) | 0.4-47nH |
| CIH | High Frequency Inductor | 1005(0402) | 0.6-100nH |
| CIH | High Frequency Inductor | 1608(0603) | 0.6-100nH |
Filters - Diplexer, LC Filter, Band Pass/Low Pass Filter
Samsung provides Diplexers for frequency separation in mobile phones and wireless LAN, LC Filters, and Band Pass/Low Pass Filters utilizing proprietary RF design and LTCC fabrication technology for low loss and good attenuation characteristics.
| Series | Type | Size Code (mm/inch) |
|---|---|---|
| EMIC | 3-Terminal Capacitor (EMI Filter) | 1608(0603) |
| EMIC | 3-Terminal Capacitor (EMI Filter) | 2012(0805) |
| EMIC | 3-Terminal Capacitor (EMI Filter) | 3216(1206) |
| DX | Diplexer | 2012(0805) |
| LCB | LC Filter (Band Pass Filter) | 1608(0603) |
| LCB | LC Filter (Band Pass Filter) | 2012(0805) |
| LCB | LC Filter (Band Pass Filter) | 2520(1008) |
| CMFT | Common Mode Filter (Film type) | 0806(0302) |
| CMFT | Common Mode Filter (Film type) | 0605(0202) |
| CMFT | Common Mode Filter (Film type) | 0403(0101) |
Common Mode Filter - CMFT Series
These compact film-type common mode filters feature low DC resistance and are designed for high-speed interfaces like LVDS, IEEE1394, USB 2.0, MIPI, and S-ata2.
3-Terminal Capacitor - EMIC Series
The EMIC Series are three-terminal capacitors offering lower ESL characteristics and high performance at high-frequency ranges, effective for EMI prevention in digital equipment.
LC Filter - LCB Series
Chip LC filters utilizing proprietary RF design and LTCC fabrication technology, providing excellent low loss and good attenuation characteristics for applications like Bluetooth modules and Wireless LAN modules.
Diplexer - DX Series
Diplexers are used for separating specific frequencies in mobile phones and wireless LAN (11a/b/g), with different pin assignments available to suit various circuit designs.
Soldering Conditions
Samsung provides guidelines for flow and reflow soldering, including recommended temperatures and times to ensure proper component mounting.
Packaging
Components are available in various reel dimensions (7", 10", 13") with options for tape width and packaging material (Embossed, Cardboard).
Product Certifications
- ISO/TS 16949
- ISO 14001
- OHSAS 18001
- QC080000
- UL
- BSI EMS
- BSI OHS
2411010939_Samsung-Electro-Mechanics-CIB21P260NE_C19743483.pdf
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