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Specifications
Current - Saturation (Isat):
4.2A
Mfr. Part #:
CIGT252010LM1R0MNE
Package:
1008
Key Attributes
Model Number:
CIGT252010LM1R0MNE
Product Description
Product Overview
The CIGT252010LM1R0MNE is a small power inductor designed for mobile devices, featuring a monolithic structure for high reliability and a low DCR structure for high efficiency in power circuits. It is RoHS-compliant and halogen-free, making it suitable for applications in smartphones, tablet devices, wearable devices, and power converter modules.
Product Attributes
- Brand: CIGT
- Type: Metal Composite Thin Film Type
- Certifications: RoHS-regulated substances free, Halogen free
- Packaging: Embossed tape (E)
Technical Specifications
| Part No. | Size [inch/mm] | Thickness [mm] (max) | Inductance [uH] | Inductance tolerance (%) | DC Resistance [m] (max) | Rated DC Current (Isat) [A] (Typ.) | Rated DC Current (Irms) [A] (Typ.) | Absolute Maximum Voltage (DC) | Operating Temperature Range |
|---|---|---|---|---|---|---|---|---|---|
| CIGT252010LM1R0MNE | 1008 / 2520 | 1.0 | 1.0 | 20 | 50 | 4.2 | 3.5 | 20V | -40 to +125C (Including self-temperature rise) |
Dimensions (Unit: mm)
| Model | L (Max) | W (Typ) | T (Max) |
|---|---|---|---|
| CIGT252010LM1R0MNE | 1.0 | 1.0 | 1.0 |
Packaging Information
| Packaging Style | Quantity (pcs/reel) | Dimension [mm] |
|---|---|---|
| Embossed Taping | 3000 pcs | 2520 (2.5mm x 2.0mm) |
Reliability Tests
| Test Type | Condition | Acceptance Criteria |
|---|---|---|
| Drop Test | Random Free Fall test on concrete plate. 1 meter, 10 drops | No mechanical damage. Inductance change to be within 20% to the initial. |
| Terminal Adhesion Test | W(kgf) 0.5, TIME(sec) 101 | No indication of peeling shall occur on the terminal electrode. |
| Vibration Test | Solder the sample on PCB. Vibrate as apply 10~55Hz, 1.5mm amplitude for 2 hours in each of three(X,Y,Z) axis (total 6 hours). | No mechanical damage. Inductance change to be within 20% to the initial. |
| Bending Test | Bending Limit: 2mm. Test Speed: 1.0mm/sec. Keep the test board at the limit point in 5 sec. PCB thickness: 1.6mm | No mechanical damage. |
| High Temperature Loading Test | 852, Rated Current for 50012 hours. Measure after 24 hours at normal temp/humidity. | No mechanical damage. Inductance change to be within 20% to the initial. |
| Reflow Test | Peak 2605, 3 times | No mechanical damage. Inductance change to be within 20% to the initial. |
| High Temperature Test | Exposure at 1252 for 50012 hours. Measure after 24 hours at normal temp/humidity. | No mechanical damage. Inductance change to be within 20% to the initial. |
| High Temp. Humidity Resistance Loading Test | 852, 85%RH, Rated Current for 50012 hours. Measure after 24 hours at normal temp/humidity. | No mechanical damage. Inductance change to be within 20% to the initial. |
| High Temp. Humidity Resistance Test | 852, 85%RH, for 50012 hours. Measure after 24 hours at normal temp/humidity. | No mechanical damage. Inductance change to be within 20% to the initial. |
| Low Temperature Test | Exposure at -552 for 50012 hours. Measure after 24 hours at normal temp/humidity. | No mechanical damage. Inductance change to be within 20% to the initial. |
| Resistance to Soldering | After flux dip (41 sec), preheat (150180 for 23 min), immerse in solder (2605 for 10 0.5 seconds). | No mechanical damage. Remaining terminal Electrode: 75% min. Inductance change to be within 20% to the initial. |
| Thermal Shock (Temperature Cycle test) | Repeat 100 cycles: -403 for 30 min 853 for 30 min | No mechanical damage. Inductance change to be within 20% to the initial. |
| Solderability | After flux dip (41 sec), preheat (150180 for 23 min), immerse in solder (2455 for 41 seconds). | More than 90% of terminal electrode should be soldered newly. |
1810221224_Samsung-Electro-Mechanics-CIGT252010LM1R0MNE_C307632.pdf
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