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quality High Current Chip Bead Samsung Electro-Mechanics CIS10P221NC EIA 0603 Size for EMI Noise Suppression factory
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quality High Current Chip Bead Samsung Electro-Mechanics CIS10P221NC EIA 0603 Size for EMI Noise Suppression factory
quality High Current Chip Bead Samsung Electro-Mechanics CIS10P221NC EIA 0603 Size for EMI Noise Suppression factory
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Specifications
Mfr. Part #:
CIS10P221NC
Key Attributes
Model Number: CIS10P221NC
Product Description

Product Overview

The CIS10P Series chip beads are designed for high current EMI suppression, offering the smallest beads available for such applications. They are suitable for high current applications up to approximately 6A and are ideal for noise suppression in power lines. The series is available in EIA 0603 (1608) size with varying impedance and thickness options.

Product Attributes

  • Brand: CIS (Implied from Part No. and Series Name)
  • Series: CIS10P Series
  • Type: Chip Bead
  • Application: EMI Suppression, Noise Suppression in power line
  • Size: EIA 0603 (1608)
  • Packaging Options: C (paper tape), E (embossed tape)

Technical Specifications

Part No. Thickness (mm) Impedance () 25% @ 100MHz DC Resistance () Max. Rated Current (mA) Max.
CIS10P260AC 0.6 0.15 26 0.007 6000
CIS10P300AC 0.6 0.15 30 0.01 6000
CIS10P700AC 0.6 0.15 70 0.02 4000
CIS10P101AC 0.6 0.15 100 0.03 3000
CIS10P121AC 0.6 0.15 120 0.03 3000
CIS10P181AC 0.6 0.15 180 0.04 2500
CIS10P221NC 0.8 0.15 220 0.05 2500
CIS10P301NC 0.8 0.15 300 0.07 2000
CIS10P331NC 0.8 0.15 330 0.07 1700
CIS10P391NC 0.8 0.15 390 0.10 1200
CIS10P471NC 0.8 0.15 470 0.13 1500
CIS10P601NC 0.8 0.15 600 0.15 1300
Dimension Type Dimension [mm] (L) Dimension [mm] (W) Dimension [mm] (t) Dimension [mm] (d)
Chip Bead 1.6 0.15 0.8 0.15 0.6 0.15 0.8 0.15
Chip Bead 1.6 0.15 0.8 0.15 0.8 0.15 0.3 0.2
Packaging Style Quantity (pcs/reel)
Card Board Taping 4000

Recommended Soldering Condition: REFLOW SOLDERING, FLOW SOLDERING

Product Identification Code Breakdown:

  • (1) Chip Beads
  • (2) Ultra high current (~6A)
  • (3) Dimension
  • (4) Material Code
  • (5) Nominal impedance (e.g., 300: 30, 121: 120)
  • (6) Thickness option (N: Standard, A: Thinner than standard, B: Thicker than standard)
  • (7) Packaging (C: paper tape, E: embossed tape)

NOTICE: All specifications are subject to change without previous notice. Please contact with product representatives or engineers to check specifications.


2411041619_Samsung-Electro-Mechanics-CIS10P221NC_C19729367.pdf

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