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quality Chip Beads for EMI Suppression Samsung Electro-Mechanics CIM21J800NE High Heat Resistance Components factory
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quality Chip Beads for EMI Suppression Samsung Electro-Mechanics CIM21J800NE High Heat Resistance Components factory
quality Chip Beads for EMI Suppression Samsung Electro-Mechanics CIM21J800NE High Heat Resistance Components factory
quality Chip Beads for EMI Suppression Samsung Electro-Mechanics CIM21J800NE High Heat Resistance Components factory
>
Specifications
Mfr. Part #:
CIM21J800NE
Key Attributes
Model Number: CIM21J800NE
Product Description

Product Overview

The CIB/CIM21 Series are monolithic inorganic material chip beads designed for EMI suppression. They feature a closed magnetic circuit configuration, ensuring no crosstalk and suitability for high-density PCBs. These components are ideal for automatic mounting with no directionality and offer excellent solderability and high heat resistance for both flow and reflow soldering. Applications include high-frequency EMI prevention in computers, printers, VCRs, TVs, and mobile phones.

Product Attributes

  • Series: CIB/CIM21
  • Construction: Monolithic inorganic material
  • Magnetic Circuit: Closed configuration
  • Mounting: Suitable for automatic mounting, no directionality
  • Soldering: Excellent solderability, high heat resistance for flow or reflow soldering

Technical Specifications

Dimensions:

Type Dimension [mm] (L x W x t) d [mm]
Chip Bead 2.0 0.2 x 1.25 0.2 x 0.9 0.2 0.5 +0.2 -0.3

CIB21P Series:

Part No. Thickness (mm) Impedance () 25%@100MHz DC Resistance () Max. Rated Current (mA) Max.
CIB21P110 0.9 0.2 11 0.01 2000
CIB21P150 0.9 0.2 15 0.01 2000
CIB21P260 0.9 0.2 26 0.01 2000
CIB21P300 0.9 0.2 30 0.05 2000
CIB21P330 0.9 0.2 33 0.05 1500
CIB21P470 0.9 0.2 47 0.05 1500

CIM21U Series:

Part No. Thickness (mm) Impedance () 25%@100MHz DC Resistance () Max. Rated Current (mA) Max.
CIM21U600 0.9 0.2 60 0.08 900
CIM21U800 0.9 0.2 80 0.10 900
CIM21U101 0.9 0.2 100 0.10 800
CIM21U121 0.9 0.2 120 0.10 800
CIM21U151 0.9 0.2 150 0.15 600
CIM21U241 0.9 0.2 240 0.15 600
CIM21U301 0.9 0.2 300 0.15 500
CIM21U471 0.9 0.2 470 0.30 500
CIM21U601 0.9 0.2 600 0.30 500
CIM21U102 0.9 0.2 1000 (at 70MHz) 0.40 500
CIM21U202 0.9 0.2 2000 (at 70MHz) 0.70 300

CIB21J Series:

Part No. Thickness (mm) Impedance () 25%@100MHz DC Resistance () Max. Rated Current (mA) Max.
CIB21J260 0.9 0.2 26 0.05 2000
CIB21J300 0.9 0.2 30 0.05 2000
CIB21J400 0.9 0.2 40 0.05 2000
CIM21J600 0.9 0.2 60 0.08 900
CIM21J800 0.9 0.2 80 0.08 1000
CIM21J121 0.9 0.2 120 0.15 800
CIM21J151 0.9 0.2 150 0.15 500
CIM21J221 0.9 0.2 220 0.20 500
CIM21J241 0.9 0.2 240 0.20 500
CIM21J301 0.9 0.2 300 0.20 500
CIM21J471 0.9 0.2 470 0.25 500
CIM21J601 0.9 0.2 600 0.25 500
CIM21J751 0.9 0.2 750 0.35 400
CIM21J102 0.9 0.2 1000 0.35 500
CIM21J152 0.9 0.2 1500 (at 70MHz) 0.45 500
CIM21J182 0.9 0.2 1800 (at 70MHz) 0.45 500
CIM21J202 0.9 0.2 2000 (at 70MHz) 0.50 500
CIM21J222 0.9 0.2 2200 (at 70MHz) 0.70 300
CIM21J252 0.9 0.2 2500 (at 50MHz) 0.70 300

CIM21K Series:

Part No. Thickness (mm) Impedance () 25%@100MHz DC Resistance () Max. Rated Current (mA) Max.
CIM21K152 0.9 0.2 1500 0.45 300
CIM21K252 0.9 0.2 2500 0.80 250

CIM21N Series:

Part No. Thickness (mm) Impedance () 25%@100MHz DC Resistance () Max. Rated Current (mA) Max.
CIM21N560 0.9 0.2 56 0.20 600
CIM21N700 0.9 0.2 70 0.20 600
CIM21N121 0.9 0.2 120 0.25 500
CIM21N241 0.9 0.2 240 0.30 400

Product Identification Breakdown:

Code Description
(1) Chip Beads
(2) M: Multi-layer type, B: Mono-layer type
(3) Dimension
(4) Material Code
(5) Nominal impedance (e.g., 800: 80, 121: 120)
(6) Thickness option (N: Standard, A: Thinner than standard, B: Thicker than standard)
(7) Packaging (C: paper tape, E: embossed tape)

Packaging:

Packaging Style Quantity (pcs/reel)
Embossed Taping 4,000

Recommended Soldering Conditions:

Reflow Soldering

Flow Soldering


2411051837_Samsung-Electro-Mechanics-CIM21J800NE_C20594751.pdf

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