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quality Electronic chip bead Samsung Electro-Mechanics CIB31P700NE for EMI filtering and DC DC converter applications factory
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quality Electronic chip bead Samsung Electro-Mechanics CIB31P700NE for EMI filtering and DC DC converter applications factory
quality Electronic chip bead Samsung Electro-Mechanics CIB31P700NE for EMI filtering and DC DC converter applications factory
quality Electronic chip bead Samsung Electro-Mechanics CIB31P700NE for EMI filtering and DC DC converter applications factory
>
Specifications
Mfr. Part #:
CIB31P700NE
Key Attributes
Model Number: CIB31P700NE
Product Description

Samsung Components

Samsung Electro-Mechanics offers a comprehensive range of electronic components, including chip beads, chip inductors, filters, common mode filters, and 3-terminal capacitors. These components are designed for various applications, such as EMI suppression, high current handling, high-frequency noise suppression, and DC-DC converters. The product line is manufactured in accordance with EU RoHS directives, ensuring compliance with environmental regulations.

  • Brand: Samsung
  • Compliance: EU RoHS directive
  • Restricted Materials: Cd, Pb, Hg, Cr6+, As, Br and their compounds, PCB, asbestos are not used in packaging or products.
  • Ozone Layer Protection: ODS materials such as Freon, Haron, 1-1-1 TCE, CCl4, HCFC are not used in the fabrication process.
  • Certifications: Environmental certification list available on the last page of the catalog.

Product Categories

  • Chip Beads: CIB/CIM Series (For General), CIV Series (For GHz Noise suppression)
  • Chip Inductors: CIGT Series (Power Inductor), CIG Series (Power Inductor), CIH Series (High Frequency Inductor), CIL Series (General Inductor)
  • Filters: EMI Products, Diplexer, Band Pass/Low Pass Filter
  • Other Products: Common Mode Filter, 3-Terminal Capacitor

Technical Specifications - Chip Beads (CIB/CIM Series)

Type Series Size Code (mm/inch) Impedance Range () at 100MHz Effective Frequency Range
General CIB: monolayer
CIM: multilayer
1608 (0603) 10-33 1MHz - 10GHz
General CIB: monolayer
CIM: multilayer
2012 (0805) 11-47 1MHz - 10GHz
General CIB: monolayer
CIM: multilayer
3216 (1206) 26-70 1MHz - 10GHz
General CIB: monolayer
CIM: multilayer
3225 (1210) 31-60 1MHz - 10GHz
General CIB: monolayer
CIM: multilayer
4516 (1806) 80-150 1MHz - 10GHz
High speed signal CIM 0603 (0201) 80-600 1MHz - 10GHz
High speed signal CIM 1005 (0402) 10-1000 1MHz - 10GHz
High speed signal CIM 1608 (0603) 80-2000 1MHz - 10GHz
High speed signal CIM 2012 (0805) 80-2000 1MHz - 10GHz
High speed signal CIM 3216 (1206) 10-600 1MHz - 10GHz
High Current CIC 1005 (0402) 10 1MHz - 10GHz
High Current CIC 1608 (0603) 120-240 1MHz - 10GHz
High Current CIC 2012 (0805) 30-1800 1MHz - 10GHz
High Current CIC 3216 (1206) 30-2500 1MHz - 10GHz
High Current CIC 4516 (1806) 26-2500 1MHz - 10GHz
Ultra high current CIS 1005 (0402) 150-1500 1MHz - 10GHz
Ultra high current CIS 1608 (0603) 30-80 1MHz - 10GHz
Ultra high current CIS 1608 (0603) ~ 4516 (1806) 75-220 1MHz - 10GHz
Ultra high current CIS 2012 (0805) ~ 4516 (1806) 70-240 1MHz - 10GHz
Ultra high current CIS 2012 (0805) ~ 4516 (1806) 70-240 1MHz - 10GHz
GHz Noise suppression CIV 1005 (0402) 30-120 1MHz - 10GHz
GHz Noise suppression CIV 1005 (0402) 26-600 1MHz - 10GHz
GHz Noise suppression CIV 1005 (0402) 30-120 1MHz - 10GHz
GHz Noise suppression CIV 1608 (0603) 30-240 1MHz - 10GHz
GHz Noise suppression CIV 2012 (0805) ~ 4516 (1806) 600-1000 1MHz - 10GHz
GHz Noise suppression CIV 2012 (0805) ~ 4516 (1806) 1000-1800 1MHz - 10GHz
Bead CIC 0402 (01005) 30-120 1MHz - 10GHz
Bead CIC 0603 (0201) 30-120 1MHz - 10GHz

Technical Specifications - Power Inductors (CIGT Series)

Type Series Size Code (mm/inch) Inductance Range (H)
Metal Composite Thin Film CIGT Series (DC-DC Converter) 2012 (0805) 0.47-1.0
Metal Composite Thin Film CIGT Series (DC-DC Converter) 2016 (0806) 0.47-2.2
Metal Composite Thin Film CIGT Series (DC-DC Converter) 2016 (0806) 0.27-4.7
Metal Composite Thin Film CIGT Series (DC-DC Converter) 2016 (0806) 0.47-4.7
Metal Composite Thin Film CIGT Series (DC-DC Converter) 2016 (0806) 0.33-4.7
Metal Composite Thin Film CIGT Series (DC-DC Converter) 2520 (1008) 0.47-2.2
Metal Composite Thin Film CIGT Series (DC-DC Converter) 2520 (1008) 0.47-10

Technical Specifications - Power Inductors (CIG Series)

Type Series Size Code (mm/inch) Inductance Range (H)
Ferrite Multilayer CIG10F (Low Profile) 1608 (0603) 0.47-4.7
Ferrite Multilayer CIG10W (Normal) 1608 (0603) 0.27-4.7
Ferrite Multilayer CIG2MW 2012 (0805) 0.47-4.7
Ferrite Multilayer CIG22L (Low Rdc) 2520 (1008) 0.047-33
Ferrite Multilayer CIG22H (High Current) 2520 (1008) 0.047-33
Ferrite Multilayer CIG21E (High Current Type) 2012 (0805) 0.047-33
Ferrite Multilayer CIG22B 2520 (1008) 0.6-100nH
Ferrite Multilayer CIG21L (Low Rdc) 2012 (0805) 0.47-2.2
Ferrite Multilayer CIG21F (Low Profile) 2012 (0805) 2.5
Ferrite Multilayer CIG10L (Low Rdc) 1608 (0603) 0.47-2.2
Ferrite Multilayer CIG22E (High Efficiency Type) 2520 (1008) 0.27-4.7

Technical Specifications - General Inductors (CIL Series)

Type Series Size Code (mm/inch) Inductance Range (nH)
General CIL 1005 (0402) 1-100
General CIL 1608 (0603) 1-270
General CIL 2012 (0805) 1-270
General CIL 3216 (1206) 1-270

Technical Specifications - High Frequency Inductors (CIH Series)

Type Series Size Code (mm/inch) Inductance Range (nH)
High Frequency CIH 0402 (01005) 0.6-100
High Frequency CIH 0603 (0201) 0.6-100
High Frequency CIH 0603 (0201) 0.6-22
High Frequency CIH 0603 (0201) 0.4-47

Technical Specifications - Filters

Type Series Size Code (mm/inch)
Diplexer DX 2012 (0805)
LC Filter LCB 1608 (0603)
LC Filter LCB 2012 (0805)
LC Filter LCB 2520 (1008)
EMI Filter 3-Terminal Capacitor EMIC 1608 (0603)
EMI Filter 3-Terminal Capacitor EMIC 2012 (0805)
EMI Filter 3-Terminal Capacitor EMIC 3216 (1206)
Common Mode Filter CMFT 0806 (0302)
Common Mode Filter CMFT 0605 (0202)
Common Mode Filter CMFT 0403 (0101)

Soldering Conditions

Samsung Electro-Mechanics provides guidelines for flow, reflow, and hand soldering to ensure optimal product performance and reliability.

Packaging

Components are available in various reel dimensions (7", 10", 13") and tape widths (8mm, 12mm), utilizing both embossed and paper tape packaging options.


2411010939_Samsung-Electro-Mechanics-CIB31P700NE_C19741130.pdf

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