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Specifications
Mfr. Part #:
CIM21J121NE
Key Attributes
Model Number:
CIM21J121NE
Product Description
Product Overview
This product line offers chip beads designed for EMI suppression, suitable for high-frequency applications in computers, printers, VCRs, TVs, and mobile phones. Key advantages include a perfect shape for automatic mounting with no directionality, excellent solderability, high heat resistance for both flow and reflow soldering, monolithic inorganic material construction for high reliability, and a closed magnetic circuit configuration that avoids crosstalk and is ideal for high-density PCBs.
Product Attributes
- Type: Chip Bead
- Series: CIB/CIM21 Series (2012/ EIA 0805)
- Construction: Monolithic inorganic material
- Magnetic Circuit: Closed magnetic circuit configuration
Technical Specifications
| Part No. | Thickness (mm) | Impedance () 25% @ 100MHz | DC Resistance () Max. | Rated Current (mA) Max. |
|---|---|---|---|---|
| CIB21P110 | 0.9 0.2 | 11 | 0.01 | 2000 |
| CIB21P150 | 0.9 0.2 | 15 | 0.01 | 2000 |
| CIB21P260 | 0.9 0.2 | 26 | 0.01 | 2000 |
| CIB21P300 | 0.9 0.2 | 30 | 0.05 | 2000 |
| CIB21P330 | 0.9 0.2 | 33 | 0.05 | 1500 |
| CIB21P470 | 0.9 0.2 | 47 | 0.05 | 1500 |
| CIM21U600 | 0.9 0.2 | 60 | 0.08 | 900 |
| CIM21U800 | 0.9 0.2 | 80 | 0.10 | 900 |
| CIM21U101 | 0.9 0.2 | 100 | 0.10 | 800 |
| CIM21U121 | 0.9 0.2 | 120 | 0.10 | 800 |
| CIM21U151 | 0.9 0.2 | 150 | 0.15 | 600 |
| CIM21U241 | 0.9 0.2 | 240 | 0.15 | 600 |
| CIM21U301 | 0.9 0.2 | 300 | 0.15 | 500 |
| CIM21U471 | 0.9 0.2 | 470 | 0.30 | 500 |
| CIM21U601 | 0.9 0.2 | 600 | 0.30 | 500 |
| CIM21U102 | 0.9 0.2 | 1000 (at 70MHz) | 0.40 | 500 |
| CIM21U202 | 0.9 0.2 | 2000 (at 70MHz) | 0.70 | 300 |
| CIB21J260 | 0.9 0.2 | 26 | 0.05 | 2000 |
| CIB21J300 | 0.9 0.2 | 30 | 0.05 | 2000 |
| CIB21J400 | 0.9 0.2 | 40 | 0.05 | 2000 |
| CIM21J600 | 0.9 0.2 | 60 | 0.08 | 900 |
| CIM21J800 | 0.9 0.2 | 80 | 0.08 | 1000 |
| CIM21J121 | 0.9 0.2 | 120 | 0.15 | 800 |
| CIM21J151 | 0.9 0.2 | 150 | 0.15 | 500 |
| CIM21J221 | 0.9 0.2 | 220 | 0.20 | 500 |
| CIM21J241 | 0.9 0.2 | 240 | 0.20 | 500 |
| CIM21J301 | 0.9 0.2 | 300 | 0.20 | 500 |
| CIM21J471 | 0.9 0.2 | 470 | 0.25 | 500 |
| CIM21J601 | 0.9 0.2 | 600 | 0.25 | 500 |
| CIM21J751 | 0.9 0.2 | 750 | 0.35 | 400 |
| CIM21J102 | 0.9 0.2 | 1000 | 0.35 | 500 |
| CIM21J152 | 0.9 0.2 | 1500 (at 70MHz) | 0.45 | 500 |
| CIM21J182 | 0.9 0.2 | 1800 (at 70MHz) | 0.45 | 500 |
| CIM21J202 | 0.9 0.2 | 2000 (at 70MHz) | 0.50 | 500 |
| CIM21J222 | 0.9 0.2 | 2200 (at 70MHz) | 0.70 | 300 |
| CIM21J252 | 0.9 0.2 | 2500 (at 50MHz) | 0.70 | 300 |
| CIM21K152 | 0.9 0.2 | 1500 | 0.45 | 300 |
| CIM21K252 | 0.9 0.2 | 2500 | 0.80 | 250 |
| CIM21N560 | 0.9 0.2 | 56 | 0.20 | 600 |
| CIM21N700 | 0.9 0.2 | 70 | 0.20 | 600 |
| CIM21N121 | 0.9 0.2 | 120 | 0.25 | 500 |
| CIM21N241 | 0.9 0.2 | 240 | 0.30 | 400 |
| Dimension [mm] | L | W | t | d |
|---|---|---|---|---|
| 21 | 2.0 0.2 | 1.25 0.2 | 0.9 0.2 | 0.5 +0.2 -0.3 |
| Recommended Land Pattern | |
|---|---|
| Minimum | 0.8~1.2mm |
| 0.9~1.6mm | |
| 0.6~1.2mm | |
| 0.6~1.2mm |
| Product Identification | Description |
|---|---|
| (1) | Chip Beads |
| (2) | M: Multi-layer type, B: Mono-layer type |
| (3) | Dimension |
| (4) | Material Code |
| (5) | Nominal impedance (800:80, 121:120) |
| (6) | Thickness option (N:Standard, A:Thinner than standard, B:Thicker than standard) |
| (7) | Packaging (C: paper tape, E: embossed tape) |
| Packaging Style | Quantity (pcs/reel) |
|---|---|
| Embossed Taping | 4,000 |
| Recommended Soldering Condition | |
|---|---|
| Reflow Soldering | |
| Flow Soldering |
2411041556_Samsung-Electro-Mechanics-CIM21J121NE_C19758061.pdf
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