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Specifications
Mfr. Part #:
CIM05U601NC
Key Attributes
Model Number:
CIM05U601NC
Product Description
Product Overview
The CIB/CIM05 Series (1005/EIA 0402) chip beads are designed for EMI suppression in a variety of electronic devices. Featuring a monolithic inorganic material construction for high reliability and a closed magnetic circuit configuration to prevent crosstalk, these components are ideal for high-density PCBs. Their perfect shape ensures suitability for automatic mounting without directionality, and they offer excellent solderability and high heat resistance for both flow and reflow soldering processes. Applications include computers, printers, VCRs, TVs, and mobile phones.
Product Attributes
- Type: Chip Bead
- Series: CIB/CIM05
- Standard Size: 1005/EIA 0402
- Construction: Monolithic inorganic material
- Magnetic Circuit: Closed
- Mounting: Suitable for automatic mounting, no directionality
- Solderability: Excellent
- Heat Resistance: High (for flow or reflow soldering)
Technical Specifications
| Part No. | Thickness (mm) | Impedance () 25% @ 100MHz | DC Resistance () Max. | Rated Current (mA) Max. |
|---|---|---|---|---|
| CIB05J100 | 0.5 0.05 | 10 | 0.05 | 1200 |
| CIM05U100 | 0.5 0.05 | 10 | 0.05 | 1200 |
| CIM05U300 | 0.5 0.05 | 30 | 0.10 | 700 |
| CIM05U600 | 0.5 0.05 | 60 | 0.15 | 600 |
| CIM05U800 | 0.5 0.05 | 80 | 0.20 | 600 |
| CIM05U121 | 0.5 0.05 | 120 | 0.25 | 600 |
| CIM05U221 | 0.5 0.05 | 220 | 0.35 | 500 |
| CIM05U241 | 0.5 0.05 | 240 | 0.35 | 400 |
| CIM05U301 | 0.5 0.05 | 300 | 0.45 | 400 |
| CIM05U471 | 0.5 0.05 | 470 | 0.55 | 300 |
| CIM05U601 | 0.5 0.05 | 600 | 0.60 | 300 |
| CIM05U102 | 0.5 0.05 | 1000 | 0.80 | 300 |
| CIM05J300 | 0.5 0.05 | 30 | 0.20 | 700 |
| CIM05J600 | 0.5 0.05 | 60 | 0.20 | 650 |
| CIM05J800 | 0.5 0.05 | 80 | 0.25 | 600 |
| CIM05J121 | 0.5 0.05 | 120 | 0.25 | 500 |
| CIM05J221 | 0.5 0.05 | 220 | 0.35 | 400 |
| CIM05J241 | 0.5 0.05 | 240 | 0.35 | 400 |
| CIM05J301 | 0.5 0.05 | 300 | 0.45 | 400 |
| CIM05J471 | 0.5 0.05 | 470 | 0.55 | 300 |
| CIM05J601 | 0.5 0.05 | 600 | 0.60 | 300 |
| CIM05J102 | 0.5 0.05 | 1000 | 0.80 | 250 |
| CIM05J152 | 0.5 0.05 | 1500 | 1.00 | 250 |
| CIM05J182 | 0.5 0.05 | 1800 | 1.40 | 200 |
| CIM05N750 | 0.5 0.05 | 75 | 0.35 | 300 |
| CIM05N121 | 0.5 0.05 | 120 | 0.55 | 300 |
| CIM05N221 | 0.5 0.05 | 220 | 0.80 | 200 |
| CIM05F050 | 0.5 0.05 | 5 | 0.08 | 500 |
| CIM05F100 | 0.5 0.05 | 10 | 0.10 | 300 |
| CIM05F220 | 0.5 0.05 | 22 | 0.20 | 300 |
| CIM05F470 | 0.5 0.05 | 47 | 0.35 | 300 |
| CIM05F750 | 0.5 0.05 | 75 | 0.40 | 300 |
| CIM05F121 | 0.5 0.05 | 120 | 0.55 | 300 |
| CIM05F221 | 0.5 0.05 | 220 | 0.80 | 200 |
| CIM05H800 | 0.5 0.05 | 80 | 0.20 | 450 |
| CIM05H121 | 0.5 0.05 | 120 | 0.25 | 400 |
| CIM05H601 | 0.5 0.05 | 600 | 0.80 | 200 |
Packaging
| Packaging Style | Quantity (pcs/reel) |
|---|---|
| Card Board Taping | 10,000 |
Recommended Soldering Conditions
Reflow Soldering
| Dimension | L (mm) | W (mm) | t (mm) | d (mm) |
|---|---|---|---|---|
| 05 | 1.0 0.05 | 0.5 0.05 | 0.5 0.05 | 0.25 0.1 |
Flow Soldering
| Dimension | L (mm) | W (mm) | t (mm) | d (mm) |
|---|---|---|---|---|
| 05 | 1.0 0.05 | 0.5 0.05 | 0.5 0.05 | 0.25 0.1 |
Recommended Land Pattern
| Dimension | L (mm) | W (mm) | t (mm) | d (mm) |
|---|---|---|---|---|
| 05 | 1.0 0.05 | 0.5 0.05 | 0.5 0.05 | 0.25 0.1 |
2411041613_Samsung-Electro-Mechanics-CIM05U601NC_C19732499.pdf
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