Product Overview
The CIB/CIM05 Series (1005/EIA 0402) chip beads are designed for high-frequency EMI suppression. Featuring a monolithic inorganic material construction for high reliability and a closed magnetic circuit configuration to prevent crosstalk, these components are suitable for high-density PCBs. Their perfect shape for automatic mounting offers no directionality, coupled with excellent solderability and high heat resistance for flow or reflow soldering. Ideal for EMI prevention in computers, printers, VCRs, TVs, and mobile phones.
Product Attributes
- Type: Chip Bead
- Series: CIB/CIM05 Series (1005/EIA 0402)
- Construction: Monolithic inorganic material
- Magnetic Circuit: Closed
- Mounting: Suitable for automatic mounting, no directionality
- Solderability: Excellent
- Heat Resistance: High (for flow or reflow soldering)
Technical Specifications
| Part No. | Thickness (mm) | Impedance () 25% @ 100MHz | DC Resistance () Max. | Rated Current (mA) Max. |
|---|---|---|---|---|
| CIB05J100 | 0.5 0.05 | 10 | 0.05 | 1200 |
| CIM05U100 | 0.5 0.05 | 10 | 0.05 | 1200 |
| CIM05U300 | 0.5 0.05 | 30 | 0.10 | 700 |
| CIM05U600 | 0.5 0.05 | 60 | 0.15 | 600 |
| CIM05U800 | 0.5 0.05 | 80 | 0.20 | 600 |
| CIM05U121 | 0.5 0.05 | 120 | 0.25 | 600 |
| CIM05U221 | 0.5 0.05 | 220 | 0.35 | 500 |
| CIM05U241 | 0.5 0.05 | 240 | 0.35 | 400 |
| CIM05U301 | 0.5 0.05 | 300 | 0.45 | 400 |
| CIM05U471 | 0.5 0.05 | 470 | 0.55 | 300 |
| CIM05U601 | 0.5 0.05 | 600 | 0.60 | 300 |
| CIM05U102 | 0.5 0.05 | 1000 | 0.80 | 300 |
| CIM05J300 | 0.5 0.05 | 30 | 0.20 | 700 |
| CIM05J600 | 0.5 0.05 | 60 | 0.20 | 650 |
| CIM05J800 | 0.5 0.05 | 80 | 0.25 | 600 |
| CIM05J121 | 0.5 0.05 | 120 | 0.25 | 500 |
| CIM05J221 | 0.5 0.05 | 220 | 0.35 | 400 |
| CIM05J241 | 0.5 0.05 | 240 | 0.35 | 400 |
| CIM05J301 | 0.5 0.05 | 300 | 0.45 | 400 |
| CIM05J471 | 0.5 0.05 | 470 | 0.55 | 300 |
| CIM05J601 | 0.5 0.05 | 600 | 0.60 | 300 |
| CIM05J102 | 0.5 0.05 | 1000 | 0.80 | 250 |
| CIM05J152 | 0.5 0.05 | 1500 | 1.00 | 250 |
| CIM05J182 | 0.5 0.05 | 1800 | 1.40 | 200 |
| CIM05N750 | 0.5 0.05 | 75 | 0.35 | 300 |
| CIM05N121 | 0.5 0.05 | 120 | 0.55 | 300 |
| CIM05N221 | 0.5 0.05 | 220 | 0.80 | 200 |
| CIM05F050 | 0.5 0.05 | 5 | 0.08 | 500 |
| CIM05F100 | 0.5 0.05 | 10 | 0.10 | 300 |
| CIM05F220 | 0.5 0.05 | 22 | 0.20 | 300 |
| CIM05F470 | 0.5 0.05 | 47 | 0.35 | 300 |
| CIM05F750 | 0.5 0.05 | 75 | 0.40 | 300 |
| CIM05F121 | 0.5 0.05 | 120 | 0.55 | 300 |
| CIM05F221 | 0.5 0.05 | 220 | 0.80 | 200 |
| CIM05H800 | 0.5 0.05 | 80 | 0.20 | 450 |
| CIM05H121 | 0.5 0.05 | 120 | 0.25 | 400 |
| CIM05H601 | 0.5 0.05 | 600 | 0.80 | 200 |
Packaging
| Packaging Style | Quantity (pcs/reel) |
|---|---|
| Card Board Taping | 10,000 |
Recommended Soldering Conditions
REFLOW SOLDERING
Dimensions:
| Type | Dimension [mm] | L | W | t | d |
|---|---|---|---|---|---|
| Chip Bead | 05 | 1.0 0.05 | 0.5 0.05 | 0.5 0.05 | 0.25 0.1 |
Recommended Land Pattern:
| Dimension [mm] | L | W |
|---|---|---|
| 0.40~0.50 | 0.40~0.50 | 0.45~0.55 |
| 0.45~0.55 |
FLOW SOLDERING
Dimensions:
| Type | Dimension [mm] | L | W | t | d |
|---|---|---|---|---|---|
| Chip Bead | 05 | 1.0 0.05 | 0.5 0.05 | 0.5 0.05 | 0.25 0.1 |
Recommended Land Pattern:
| Dimension [mm] | L | W |
|---|---|---|
| 0.40~0.50 | 0.40~0.50 | 0.45~0.55 |
| 0.45~0.55 |
Product Identification
Part Number Structure: CIM05U121NC
- (1) Type: Chip Beads
- (2) Construction: M: Multi-layer type, B: Mono-layer type
- (3) Dimension: 05
- (4) Material Code
- (5) Nominal impedance (e.g., 100: 10, 121: 120)
- (6) Thickness option: N: Standard, A: Thinner than standard, B: Thicker than standard
- (7) Packaging: C: paper tape, E: embossed tape
2411041613_Samsung-Electro-Mechanics-CIM05N750NC_C19747889.pdf
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