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Specifications
Current - Saturation (Isat):
4.5A
Mfr. Part #:
CIGT252010LMR68MNE
Package:
1008
Key Attributes
Model Number:
CIGT252010LMR68MNE
Product Description
Product Overview
The CIGT252010LMR68MNE is a small power inductor designed for mobile devices, featuring a monolithic structure for high reliability and a low DCR structure for high efficiency in power circuits. It is suitable for applications in smartphones, tablet devices, wearable devices, and power converter modules. This inductor is free of RoHS-regulated substances and is halogen-free.
Product Attributes
- Brand: CIGT
- Type: Metal Composite Thin Film Type
- Certifications: RoHS-compliant, Halogen-free
Technical Specifications
| Model | Size [inch/mm] | Thickness [mm] (max) | Inductance [uH] | Inductance tolerance (%) | DC Resistance [m] (Typ.) | Rated DC Current (Isat) [A] (Typ.) | Rated DC Current (Irms) [A] (Typ.) | Absolute Maximum Voltage [V] | Operating Temperature Range [C] |
|---|---|---|---|---|---|---|---|---|---|
| CIGT252010LMR68MNE | 1008 / 2520 | 1.0 | 0.68 | 20 | 3.3 | 4.5 | 4.0 | 20 (DC) | -40 to +125 |
Packaging
| Type | Dimension [mm] | Quantity (pcs/reel) |
|---|---|---|
| Embossed Taping | 2.5 0.2 (L) x 2.0 0.2 (W) x 1.0 max (T) | 3000 |
Recommended Land Pattern (Unit: mm)
| A | B | C |
|---|---|---|
| 1.2 | 0.8 | 2.0 |
Soldering Conditions
| Method | Preheating Temperature | Temperature Differential (T) | Soldering Temperature | Soldering Time |
|---|---|---|---|---|
| REFLOW SOLDERING | 150 min. | 130 | Peak 2605 (Reflow Test) / 2455 (Solderability) | 3 times (Reflow Test) / 41 seconds (Solderability) |
| FLOW SOLDERING | N/A | N/A | 2605 | 10 0.5 seconds |
| SOLDERING IRON | N/A | N/A | 280 max. | 3sec max. |
Reliability Test Conditions
| Test Type | Condition | Inductance Change Limit | Mechanical Damage |
|---|---|---|---|
| Drop Test | 1 meter, 10 drops on concrete plate | 20% to initial | No mechanical damage |
| Terminal Adhesion Test | 0.5 W(kgf) for 101 sec | N/A | No indication of peeling |
| Vibration Test | 10~55Hz, 1.5mm amplitude for 2 hours/axis (X,Y,Z) | 20% to initial | No mechanical damage |
| Bending Test | Bending Limit: 2mm, Test Speed: 1.0mm/sec, Hold at limit for 5 sec (PCB thickness: 1.6mm) | N/A | No mechanical damage |
| High Temperature Loading Test | 852, Rated Current for 50012 hours | 20% to initial | No mechanical damage |
| Reflow Test | Peak 2605, 3 times | 20% to initial | No mechanical damage |
| High Temperature Test | 1252 for 50012 hours | 20% to initial | No mechanical damage |
| High Temp. Humidity Resistance Loading Test | 852, 85%RH, Rated Current for 50012 hours | 20% to initial | No mechanical damage |
| High Temp. Humidity Resistance Test | 852, 85%RH, for 50012 hours | 20% to initial | No mechanical damage |
| Low Temperature Test | -552 for 50012 hours | 20% to initial | No mechanical damage |
| Resistance to Soldering | Dipped in flux (41 sec), preheated (150180 for 23 min), immersed in solder (2605 for 10 0.5 sec) | 20% to initial | No mechanical damage. Remaining terminal Electrode: 75% min. |
| Thermal Shock (Temperature Cycle test) | -403 for 30 min 853 for 30 min, 100 cycles | 20% to initial | No mechanical damage |
| Solderability | Dipped in flux (41 sec), preheated (150180 for 23 min), immersed in solder (2455 for 41 sec) | N/A | More than 90% of terminal electrode should be soldered newly. |
1912111437_Samsung-Electro-Mechanics-CIGT252010LMR68MNE_C307636.pdf
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