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Specifications
Mfr. Part #:
CIV05U102NC
Key Attributes
Model Number:
CIV05U102NC
Product Description
Product Overview
The CIV Series Chip Beads are designed for high-frequency noise suppression in the GHz band, effectively mitigating noise generated by the high speeds and mass data storage of modern electronic appliances. These monolithic inorganic devices offer excellent solderability and high heat resistance, making them suitable for both flow and reflow soldering processes. Their construction ensures high reliability and are ideal for EMI prevention applications in computers, printers, VCRs, TVs, and mobile phones.
Product Attributes
- Type: Chip Beads
- Construction: Monolithic inorganic material
- Series: CIV Series
- Dimension Code: 05 (1005/ EIA 0402)
Technical Specifications
| Part No. | Impedance () 25% @ 100MHz | Impedance () 40% @ 1GHz | DC Resistance () Max. | Rated Current (mA) Max. | Dimension [mm] (L x W x t) | Dimension [mm] (d) |
|---|---|---|---|---|---|---|
| CIV05U601 | 600 | 1000 | 0.7 | 300 | 1.00.05 x 0.50.05 x 0.50.05 | 0.250.1 |
| CIV05U102 | 1000 | 1400 | 1.1 | 250 | 1.00.05 x 0.50.05 x 0.50.05 | 0.250.1 |
| CIV05J102 | 1000 | 2000 | 1.25 | 250 | 1.00.05 x 0.50.05 x 0.50.05 | 0.250.1 |
| CIV05J182 | 1800 | 2700 | 2.20 | 200 | 1.00.05 x 0.50.05 x 0.50.05 | 0.250.1 |
Packaging
| Packaging Style | Quantity (pcs/reel) |
|---|---|
| Card Board Taping | 4000 |
Recommended Land Pattern
- 0.40~0.50mm
- 0.40~0.50mm
- 0.45~0.55mm
- 0.45~0.55mm
Recommended Soldering Condition
- REFLOW SOLDERING
- FLOW SOLDERING
2411010939_Samsung-Electro-Mechanics-CIV05U102NC_C19737824.pdf
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