Product Overview
The CIB/CIM05 Series (1005/EIA 0402) chip beads are designed for high-frequency EMI prevention in a variety of electronic devices including computers, printers, VCRs, TVs, and mobile phones. These monolithic inorganic material construction components offer high reliability with a closed magnetic circuit configuration that avoids crosstalk, making them suitable for high-density PCBs. Their perfect shape allows for automatic mounting without directionality, and they exhibit excellent solderability and high heat resistance for both flow and reflow soldering.
Product Attributes
- Type: Chip Bead
- Series: CIB/CIM05 Series
- Standard Size: 1005/EIA 0402
- Construction: Monolithic inorganic material
- Magnetic Circuit: Closed configuration
- Mounting: Suitable for automatic mounting, no directionality
- Solderability: Excellent
- Heat Resistance: High, suitable for flow or reflow soldering
Technical Specifications
| Part No. | Thickness (mm) | Impedance () 25% @ 100MHz | DC Resistance () Max. | Max. Rated Current (mA) |
|---|---|---|---|---|
| CIB05J100 | 0.5 0.05 | 10 | 0.05 | 1200 |
| CIM05U100 | 0.5 0.05 | 10 | 0.05 | 1200 |
| CIM05U300 | 0.5 0.05 | 30 | 0.10 | 700 |
| CIM05U600 | 0.5 0.05 | 60 | 0.15 | 600 |
| CIM05U800 | 0.5 0.05 | 80 | 0.20 | 600 |
| CIM05U121 | 0.5 0.05 | 120 | 0.25 | 600 |
| CIM05U221 | 0.5 0.05 | 220 | 0.35 | 500 |
| CIM05U241 | 0.5 0.05 | 240 | 0.35 | 400 |
| CIM05U301 | 0.5 0.05 | 300 | 0.45 | 400 |
| CIM05U471 | 0.5 0.05 | 470 | 0.55 | 300 |
| CIM05U601 | 0.5 0.05 | 600 | 0.60 | 300 |
| CIM05U102 | 0.5 0.05 | 1000 | 0.80 | 300 |
| CIM05J300 | 0.5 0.05 | 30 | 0.20 | 700 |
| CIM05J600 | 0.5 0.05 | 60 | 0.20 | 650 |
| CIM05J800 | 0.5 0.05 | 80 | 0.25 | 600 |
| CIM05J121 | 0.5 0.05 | 120 | 0.25 | 500 |
| CIM05J221 | 0.5 0.05 | 220 | 0.35 | 400 |
| CIM05J241 | 0.5 0.05 | 240 | 0.35 | 400 |
| CIM05J301 | 0.5 0.05 | 300 | 0.45 | 400 |
| CIM05J471 | 0.5 0.05 | 470 | 0.55 | 300 |
| CIM05J601 | 0.5 0.05 | 600 | 0.60 | 300 |
| CIM05J102 | 0.5 0.05 | 1000 | 0.80 | 250 |
| CIM05J152 | 0.5 0.05 | 1500 | 1.00 | 250 |
| CIM05J182 | 0.5 0.05 | 1800 | 1.40 | 200 |
| CIM05N750 | 0.5 0.05 | 75 | 0.35 | 300 |
| CIM05N121 | 0.5 0.05 | 120 | 0.55 | 300 |
| CIM05N221 | 0.5 0.05 | 220 | 0.80 | 200 |
| CIM05F050 | 0.5 0.05 | 5 | 0.08 | 500 |
| CIM05F100 | 0.5 0.05 | 10 | 0.10 | 300 |
| CIM05F220 | 0.5 0.05 | 22 | 0.20 | 300 |
| CIM05F470 | 0.5 0.05 | 47 | 0.35 | 300 |
| CIM05F750 | 0.5 0.05 | 75 | 0.40 | 300 |
| CIM05F121 | 0.5 0.05 | 120 | 0.55 | 300 |
| CIM05F221 | 0.5 0.05 | 220 | 0.80 | 200 |
| CIM05H800 | 0.5 0.05 | 80 | 0.20 | 450 |
| CIM05H121 | 0.5 0.05 | 120 | 0.25 | 400 |
| CIM05H601 | 0.5 0.05 | 600 | 0.80 | 200 |
Packaging
| Packaging Style | Quantity (pcs/reel) |
|---|---|
| Card Board Taping | 10,000 |
Recommended Soldering Conditions
Reflow Soldering
Dimensions (mm): L: 1.0 0.05, W: 0.5 0.05, t: 0.5 0.05, d: 0.25 0.1
Recommended Land Pattern Dimensions:
- 0.40~0.50mm
- 0.40~0.50mm
- 0.45~0.55mm
- 0.45~0.55mm
Flow Soldering
Dimensions (mm): L: 1.0 0.05, W: 0.5 0.05, t: 0.5 0.05, d: 0.25 0.1
Recommended Land Pattern Dimensions:
- 0.40~0.50mm
- 0.40~0.50mm
- 0.45~0.55mm
- 0.45~0.55mm
2411041613_Samsung-Electro-Mechanics-CIM05J102NC_C19743525.pdf
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