Product Overview
This document outlines the specifications for Metal Current Sensing Chip Resistors, Type 2512/1206/0805 series. These resistors offer high power capabilities up to 3W, low TCR as 50ppm/, and are suitable for reflow and wave soldering. They feature Halogen-Free Epoxy, Lead-Free Plating, superior mechanical strength, excellent high-frequency characteristics, and are RoHS compliant. Applications include current sensing in various electronic devices.
Product Attributes
- Brand: (Changzhou Pengke Electronics)
- Origin: China
- Material: Metal Alloy
- Certifications: RoHS compliant, Halogen Free
Technical Specifications
| Series | Type Designation | Dimensions (L x W x T) | Rated Power | Resistance Range | TCR (Typical) | Tolerance | Operating Temp. Range | Max. Operating Voltage | Insulation Resistance | |
| 2512 | HI XD 25 N Rxxx F/G/J | 6.40.20 x 3.20.20 x 0.80.20 mm | 2W/3W | 0m R 1m | 350ppm/ | 1%, 2%, 5% | -55 ~ +170 | (P*R) | Over 100M | |
| 1206 | HI RC 12 M Rxxx F/G/J | 3.20.20 x 1.60.20 x 0.70.20 mm | 1W | 0m R 2m | 350ppm/ | 1%, 2%, 5% | ||||
| 0805 | HI RE 08 B Rxxx F/G/J | 2.00.10 x 1.250.10 x 0.50.20 mm | 0.5W | 5m R 15m | 50ppm/ | 1%, 2%, 5% | ||||
| Note: Specific resistance values (Rxxx) and their corresponding TCRs vary. Refer to Type Designation section for details. For resistance values > 0.5m, XD type is used for 2512. For resistance values > 1m, DD type is used for 2512. | ||||||||||
Reliability Tests
| Project | Test Method | Specifications and Requirements |
| Temperature coefficient (TCR) | Measured at 25(T1, R1) and 125(T2, R2) | Refer to TCR specifications |
| Short Time Overload | 5 times rated power, maintain 5s | R 1%+0.05m |
| Insulation resistance | Apply 100V15V DC between electrode and substrate for 60s | > 100 M |
| Withstand voltage | Apply AC voltage of max overload voltage between electrode and substrate at approx. 100V/S, hold for 605s | No breakdown or arc |
| Solderability | 2455 tin tank, hold 2s0.5s | At least 95% of electrode surface area covered with new solder |
| Resistance to Soldering Heat | 2605 tin tank, hold for 10s1s | R (0.5%+0.05m ), no visible damage |
| Bending test | Bending distance 2mm, hold time 60s5s | R0.5%+0.05m , no mechanical damage |
| Solvent resistance | Isopropanol (IPA) at 235 for 10 hours | No obvious damage to appearance |
| High Temperature Exposure | 1702, 1000H | R (1.0%+0.05m ) |
| Low Temperature Exposure | -552, 1000H | R (0.5%+0.05m ) |
| Rapid change of Temperature | -55 30 min ~ normal temp 5 min ~155 30 min, 1000 cycles | R (0.5%+0.05m ) |
| Load Life | 702, 1000 hours, rated power, 1.5 hours on / 0.5 hours off | R (1.0%+0.05m ) |
| Moisture with Load | 852, 85%3%RH, 1000 hours, rated power, 1.5 hours on / 0.5 hours off | R (1.0%+0.05m) |
Recommended Reflow Soldering Profile
| Parameter | Specification |
| Solder | Sn96.5 / Ag3 / Cu0.5 |
| Peak Temperature | 240~260, 10 sec |
| Pre-heating Zone | 150 to 200 , 9030 sec |
| Soldering Zone | 230 or higher, 3010 sec |
Care Notes
Storage: Store in controlled temperature (535) and humidity (4575% RH). Avoid direct sunlight, moisture, dust, and harmful gases. Storage life: 1 year.
Handling: Avoid exceeding rated power. Handle with care using tweezers to prevent damage. Do not touch the product with a soldering tip during manual installation.
2509261615_RVR-HIRC12AR180F_C52015877.pdf
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