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quality Metal Alloy Chip Resistors RVR HIXD25LR330J 3W Power Low TCR and Excellent High Frequency Characteristics factory
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quality Metal Alloy Chip Resistors RVR HIXD25LR330J 3W Power Low TCR and Excellent High Frequency Characteristics factory
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Specifications
Mfr. Part #:
HIXD25LR330J
Package:
2512
Key Attributes
Model Number: HIXD25LR330J
Product Description

Product Overview

This document specifies the Approval Specification for Metal Current Sensing Chip Resistors, Type 2512/1206/0805 series. These resistors offer high power up to 3W, low TCR as 50ppm/, and are suitable for reflow and wave soldering. They feature Halogen Free Epoxy, Lead Free Plating, superior mechanical strength, excellent high-frequency characteristics, and are RoHS compliant. They are designed for current sensing applications.

Product Attributes

  • Brand: (Changzhou Pengke Electronics)
  • Origin: China (implied by address)
  • Material: Metal Alloy
  • Certifications: RoHS compliant, Halogen Free

Technical Specifications

SeriesModelPower (W)Resistance RangeTCR (ppm/)Tolerance (%)Operating Temp (C)Max Voltage (V)
2512DD/XD2W/3W0m R 1m3501, 2, 5-55 ~ +170(P*R)
1m < R 2m100
2m < R 500m50
1206RC1W0m R 2m3501, 2, 5-55 ~ +170(P*R)
2m < R 200m50
0805RE0.5W5m R 15m501, 2, 5-55 ~ +170(P*R)

Construction and Dimension (mm)

SeriesLWTA (DD/XD)
25126.40.203.20.200.80.20DD:2.00.20 (R4 m)
XD:1.00.20 (R0.5 m)
12063.20.201.60.200.70.20 (0m R<10m)
0.450.20 (10m<R 200m)
0.60.20
08052.00.101.250.100.50.200.350.20

Land Pattern Dimensions (mm)

SeriesabL
0805 RE1.511
1206 RC1.81.71.6
2512 XD42.14.1
2512 DD43.11.3

Reliability Tests

ProjectTest MethodSpecifications and Requirements
Temperature coefficient (TCR)Measured at 25(T1, R1) and 125(T2, R2)Refer to TCR specifications for physical features
Short Time Overload5 times rated power, maintain 5sR 1%+0.05m
Insulation resistanceApply 100V15V DC voltage between electrode and substrate, hold for 60 seconds> 100 M
Withstand voltageApply AC voltage of maximum overload voltage between electrode and substrateNo breakdown or arc
Solderability2455 tin tank, hold 2s0.5sAt least 95% of surface area of electrode shall be covered with new solder
Resistance to Soldering Heat2605 tin tank, hold for 10s1sR (0.5%+0.05m ), no visible damage
Bending testBending distance 2mm, hold time 60s5sR0.5%+0.05m , no mechanical damage
Solvent resistanceIsopropanol (IPA) at 235 for 10 hoursNo obvious damage to appearance
High Temperature Exposure1702, 1000HR (1.0%+0.05m )
Low Temperature Exposure-552, 1000HR (0.5%+0.05m )
Rapid change of Temperature-55 30 minutes ~ normal temperature 5 minutes ~155 30 minutes, 1000 cycles R (0.5%+0.05m )
Load Life702, 1000 hours, rated power, 1.5 hours on / 0.5 hours offR (1.0%+0.05m )
Moisture with Load852, 85%3%RH, 1000 hours, rated power, 1.5 hours on / 0.5 hours offR (1.0%+0.05m)

Tape Packaging Dimensions (mm)

SeriesABCDET1T2
08051782.0601.0131.02.00.5>229.01/
12061782.0601.0131.02.00.5>229.00.311.4 1.0
25121782.0601.0131.02.00.5>2213.0 0.315.4 1.0

Reel Dimensions (mm)

SeriesDCET1
080517860139.0
120617860139.0
2512178601313.0

Label Information

Packaging Quantity: 0805/1206: 5000pcs/Reel, 2512: 4000pcs/Reel. Labels shall be marked with: (1) Size, (2) Quantity, (3) LOT.NO., (4) Manufacturers name.

Recommended Reflow Soldering Profile

Solder: Sn96.5 / Ag3 / Cu0.5. Peak Temperature: 240~260, 10 sec. Pre-heating Zone: 150 to 200 , 9030 sec. Soldering Zone: 230 or higher, 3010 sec.

Care Note

Storage: Temperature 535, Relative Humidity 4575% RH. Avoid direct sunlight, moisture, dust, and harmful gases. Storage life: 1 year. Handling: Avoid exceeding rated power. Be careful when picking up with tweezers. Do not touch the product with the soldering tip during manual installation.


2512101755_RVR-HIXD25LR330J_C53144942.pdf

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