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quality Metal Alloy Chip Resistors RVR HIXD25NR240J Suitable for Reflow Soldering and High Power Applications factory
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quality Metal Alloy Chip Resistors RVR HIXD25NR240J Suitable for Reflow Soldering and High Power Applications factory
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Specifications
Mfr. Part #:
HIXD25NR240J
Package:
2512
Key Attributes
Model Number: HIXD25NR240J
Product Description

Metal Current Sensing Chip Resistors - Type HI XD

These metal alloy resistors are designed for high-power applications, offering superior mechanical and frequency characteristics. They are suitable for reflow and wave soldering processes and are RoHS compliant. Key advantages include high mechanical strength, excellent frequency performance, and halogen-free construction.

Product Attributes

  • Brand: (PENGKE)
  • Origin: (Changzhou)
  • Material: Metal Alloy
  • Certifications: RoHS compliant, Halogen Free

Technical Specifications

Product Category Size Rated Power Resistance Range TCR (ppm/) Operating Temperature Range Resistance Tolerance Max. Operating Voltage (V)
2512 DD/XD 2512 2W/3W 0m R 1m 350 -55 ~ +170 1%, 2%, 5% (P*R)
1m < R 2m 100
2m < R 500m 50
1206 RC 1206 1W 0m R 2m 350 -55 ~ +170 1%, 2%, 5% (P*R)
2m < R 200m 50
0805 RE 0805 0.5W 5m R 15m 50 -55 ~ +170 1%, 2%, 5% (P*R)

Dimensions (mm)

Category L W T A (DD/XD)
2512 6.40.20 3.20.20 0.80.20 DD:2.00.20 (R4 m)
XD:1.00.20 (R0.5 m)
1206 3.20.20 1.60.20 0.70.20 0m R<10m: 0.60.20
10m
0805 2.00.10 1.250.10 0.50.20 0.350.20

Land Pattern Dimensions (mm)

Category a b L
0805 RE 1.5 1 1
1206 RC 1.8 1.7 1.6
2512 XD 4 2.1 4.1
2512 DD 4 3.1 1.3

Reliability Tests

Project Test Method Specifications and Requirements
Temperature coefficient (TCR) Measured at 25(T1, R1) and 125(T2, R2), TCR=(R2-R1)/(R1(T2-T1))*10^6 Refer to TCR specifications for physical features
Short Time Overload 5 times rated power, maintain 5s R (1%+0.05m)
Insulation resistance Apply 100V15V DC voltage between electrode and substrate, hold for 60 seconds > 100 M
Withstand voltage Apply AC voltage of maximum overload voltage between electrode and substrate at approx. 100V/S, hold for 605s No breakdown or arc
Solderability 2455 tin tank, hold 2s0.5s At least 95% of electrode surface area shall be covered with new solder
Resistance to Soldering Heat 2605 tin tank, hold for 10s1s R (0.5%+0.05m ), no visible damage
Bending test Bending distance 2mm, hold time 60s5s R(0.5%+0.05m ), no mechanical damage
Solvent resistance Isopropanol (IPA) at 235 for 10 hours No obvious damage to appearance
High Temperature Exposure 1702, 1000H R (1.0%+0.05m )
Low Temperature Exposure -552, 1000H R (0.5%+0.05m )
Rapid change of Temperature -55 30 min ~ normal temperature 5 min ~155 30 min, 1000 cycles R (0.5%+0.05m )
Load Life 702, 1000 hours, rated power, 1.5 hours on / 0.5 hours off R (1.0%+0.05m )
Moisture with Load 852, 85%3%RH, 1000 hours, rated power, 1.5 hours on / 0.5 hours off R (1.0%+0.05m)

Tape Packaging Dimensions (mm)

Type A B C D E T1 T2
0805 1782.0 601.0 131.0 2.00.5 >22 9.01 /
1206 1782.0 601.0 131.0 2.00.5 >22 9.00.3 11.4 1.0
2512 1782.0 601.0 131.0 2.00.5 >22 13.0 0.3 15.4 1.0

Reel Dimensions (mm)

See image/diagram for Reel Dimensions D, C, E, T1. Label information is also provided.

Label Information

  • Quantity: 0805/1206: 5000pcs/Reel, 2512: 4000pcs/Reel
  • Markings: Size, Quantity, LOT.NO., Manufacturers name

Recommended Reflow Soldering Profile

  • Solder: Sn96.5 / Ag3 / Cu0.5
  • Peak Temperature: 240~260, 10 sec
  • Pre-heating Zone: 150 to 200 , 9030 sec
  • Soldering Zone: 230 or higher, 3010 sec

Care Notes

  • Storage: Temperature 535, Relative Humidity 4575% RH. Avoid direct sunlight, moisture, dust, and harmful gases. Storage life: 1 year.
  • Handling: Avoid exceeding rated power. Handle with care to prevent damage to protective layer or resistance body. Do not touch product with soldering tip during manual installation.

2512101755_RVR-HIXD25NR240J_C53144983.pdf

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