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Specifications
Mfr. Part #:
HIXD25NR002J
Package:
2512
Key Attributes
Model Number:
HIXD25NR002J
Product Description
Product Overview
This Metal Current Sensing Chip Resistors-Type, specifically the 2512, 1206, and 0805 series, offers high power capabilities up to 3W with a low TCR of 50ppm/. Designed for reflow and wave soldering, these resistors feature halogen-free epoxy, lead-free plating, superior mechanical strength, and excellent high-frequency characteristics. They are RoHS compliant and suitable for various current sensing applications.
Product Attributes
- Brand: (Changzhou Pengke Electronics)
- Origin: China
- Material: Metal Alloy
- Certifications: RoHS compliant
Technical Specifications
| Product Category | Rated Power | Resistance Range | TCR | Operating Temperature Range | Resistance Tolerance | Insulation Resistance | Max. Operating Voltage |
| 2512 DD/XD | 2W/3W | 0mR 1m 1m<R 2m 2m<R 500m | 350ppm/ 100ppm/ 50 ppm/ | -55 ~ +170 | F: 1% G: 2% J: 5% | Over 100M | (P*R) |
| 1206 RC | 1W | 0mR 2m 2m<R 200m | 350ppm/ 50 ppm/ | F: 1% G: 2% J: 5% | |||
| 0805 RE | 0.5W | 5mR 15m | 50ppm/ | F: 1% G: 2% J: 5% |
| Series | L (mm) | W (mm) | T (mm) | A (mm) | DD/XD Electrode (mm) |
| 2512 | 6.40.20 | 3.20.20 | 0.80.20 | - | DD: 2.00.20 (R4 m) XD: 1.00.20 (R>0.5 m) |
| 1206 | 3.20.20 | 1.60.20 | 0.70.20 | 0.60.20 (0m R<10m) 0.450.20 (10m<R 200m) | - |
| 0805 | 2.00.10 | 1.250.10 | 0.50.20 | 0.350.20 | - |
| Project | Test Method | Specifications and Requirements |
| Temperature coefficient (TCR) | Measured at 25(T1, R1) and 125(T2, R2), TCR=(R2-R1)/R1T2-T1*10^6 | Refer to TCR specifications for physical features |
| Short Time Overload | 5 times rated power, maintain 5s | R 1%+0.05m |
| Insulation resistance | Apply 100V15V DC voltage between electrode and substrate, hold for 60 seconds, then measure | > 100 M |
| Withstand voltage | Apply AC voltage of maximum overload voltage value between electrode and substrate at approx. 100V/S, hold for 605s | No breakdown or arc |
| Solderability | 2455 tin bath, hold 2s0.5s | At least 95% of surface area of electrode shall be covered with new solder |
| Resistance to Soldering Heat | 2605 tin bath, hold 10s1s | R (0.5%+0.05m ), no visible damage |
| Bending test | Bending distance 2mm, hold time 60s5s | R0.5%+0.05m , no mechanical damage |
| Solvent resistance | Isopropanol (IPA) at 235 for 10 hours | No obvious damage to appearance |
| High Temperature Exposure | 1702, 1000H, stand for 1H | R (1.0%+0.05m ) |
| Low Temperature Exposure | -552, 1000H, stand for 1H | R (0.5%+0.05m ) |
| Rapid change of Temperature | -55 30 min ~ normal temp 5 min ~155 30 min, 1000 cycles | R (0.5%+0.05m ) |
| Load Life | 702, 1000 hours, rated power, 1.5 hours on / 0.5 hours off | R (1.0%+0.05m ) |
| Moisture with Load | 852, 85%3%RH, 1000 hours, rated power, 1.5 hours on / 0.5 hours off | R (1.0%+0.05m) |
2512101755_RVR-HIXD25NR002J_C53144953.pdf
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