Product Overview
This document specifies the Approval Specification for Metal Current Sensing Chip Resistors, Type HI XD. These resistors are designed for high-power applications up to 3W with low TCR as 50ppm/. They are suitable for reflow and wave soldering, feature halogen-free epoxy, lead-free plating, superior mechanical strength, and excellent high-frequency characteristics, complying with RoHS standards.
Product Attributes
- Brand: (Changzhou Pengke Electronics)
- Origin: China
- Material: Metal Alloy Resistance
- Certifications: RoHS compliant, Halogen Free
Technical Specifications
| Series | Product Code Example | Size | Rated Power | Resistance Range | TCR | Operating Temperature Range | Resistance Tolerance | Insulation Resistance | Max. Operating Voltage |
| 2512 DD/XD | HI XD 25 N R001 F | 2512 | 2W/3W | 0mR 1m 1m<R 2m 2m<R 500m | 350ppm/ 100ppm/ 50 ppm/ | -55 ~ +170 | F:1% G:2% J:5% | Over 100M | (P*R) |
| 1206 RC | HI RC 12 1W R010 F | 1206 | 1W | 0mR 2m 2m<R 200m | 350ppm/ 50 ppm/ | F:1% G:2% J:5% | |||
| 0805 RE | HI RE 08 0.5W R100 F | 0805 | 0.5W | 5mR 15m | 50ppm/ | F:1% G:2% J:5% |
Construction and Dimension (mm)
| Series | L | W | T | A (Electrode) |
| 2512 | 6.40.20 | 3.20.20 | 0.80.20 | DD:2.00.20 (R4 m) XD:1.00.20 (R0.5 m) |
| 1206 | 3.20.20 | 1.60.20 | 0.70.20 (0m R<10m) 0.450.20 (10m<R 200m) | 0.60.20 |
| 0805 | 2.00.10 | 1.250.10 | 0.50.20 | 0.350.20 |
Land Pattern Dimensions (mm)
| Series | a | b | L |
| 0805 RE | 1.5 | 1 | 1 |
| 1206 RC | 1.8 | 1.7 | 1.6 |
| 2512 XD | 4 | 2.1 | 4.1 |
| 2512 DD | 4 | 3.1 | 1.3 |
Reliability Tests
| Project | Test Method | Specifications and Requirements |
| Temperature coefficient (TCR) | Measured at 25(T1, R1) and 125(T2, R2) | Refer to TCR specifications for physical features |
| Short Time Overload | 5 times rated power, maintain 5s | R 1%+0.05m |
| Insulation resistance | Apply 100V15V DC voltage between electrode and substrate, hold for 60 seconds | > 100 M |
| Withstand voltage | Apply AC voltage of maximum overload voltage between electrode and substrate at approx. 100V/S, hold for 605s | No breakdown or arc |
| Solderability | 2455 tin tank, hold 2s0.5s | At least 95% of surface area of electrode shall be covered with new solder |
| Resistance to Soldering Heat | 2605 tin tank, hold for 10s1s | R (0.5%+0.05m ), no visible damage |
| Bending test | Bending distance 2mm, hold time 60s5s | R0.5%+0.05m , no mechanical damage |
| Solvent resistance | Isopropanol (IPA) at 235 for 10 hours | No obvious damage to appearance |
| High Temperature Exposure | 1702, 1000H | R (1.0%+0.05m ) |
| Low Temperature Exposure | -552, 1000H | R (0.5%+0.05m ) |
| Rapid change of Temperature | -55 30 min ~ normal temp 5 min ~155 30 min, 1000 cycles | R (0.5%+0.05m ) |
| Load Life | 702, 1000 hours, rated power, 1.5 hours on / 0.5 hours off | R (1.0%+0.05m ) |
| Moisture with Load | 852, 85%3%RH, 1000 hours, rated power, 1.5 hours on / 0.5 hours off | R (1.0%+0.05m) |
Tape Packaging Dimensions (mm)
| Series | A | B | C | D | E | T1 | T2 |
| 0805 | 1782.0 | 601.0 | 131.0 | 2.00.5 | >22 | 9.01 | / |
| 1206 | 1782.0 | 601.0 | 131.0 | 2.00.5 | >22 | 9.00.3 | 11.4 1.0 |
| 2512 | 1782.0 | 601.0 | 131.0 | 2.00.5 | >22 | 13.0 0.3 | 15.4 1.0 |
Reel Dimensions (mm)
| Series | D | C | E | T1 |
| 0805 | 178 | 60 | 13 | 9.0 |
| 1206 | 178 | 60 | 13 | 9.0 |
| 2512 | 178 | 60 | 13 | 13.0 |
Label Information
Packaging Quantity: 0805/1206: 5000pcs/Reel, 2512: 4000pcs/Reel. The label shall be marked with: Size, Quantity, LOT.NO., Manufacturers name.
Recommended Reflow Soldering Profile
Solder: Sn96.5 / Ag3 / Cu0.5. Peak Temperature: 240~260, 10 sec. Pre-heating Zone: 150 to 200, 9030 sec. Soldering Zone: 230 or higher, 3010 sec.
Care Note
Storage: Store in a controlled environment (temperature 535, relative humidity 4575% RH), avoid direct sunlight, moisture, dust, and harmful gases. Storage life: 1 year.
Handling: Avoid exceeding rated power. Use tweezers carefully to prevent damage. Do not touch the product with the soldering tip during manual installation.
2509261615_RVR-HIRC12AR003F_C52015848.pdf
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