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quality Metal Alloy Chip Resistors RVR HIRC12AR0045J 2512 1206 0805 Series with Low TCR 50ppm and High Power 3W factory
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quality Metal Alloy Chip Resistors RVR HIRC12AR0045J 2512 1206 0805 Series with Low TCR 50ppm and High Power 3W factory
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Specifications
Mfr. Part #:
HIRC12AR0045J
Package:
1206
Key Attributes
Model Number: HIRC12AR0045J
Product Description

Metal Current Sensing Chip Resistors - Type HI XD

This specification covers Metal Alloy Resistance 2512/1206/0805 series, offering high power up to 3W, low TCR as 50ppm/, and suitability for reflow and wave soldering. These resistors are halogen-free, lead-free plated, and exhibit superior mechanical and frequency characteristics, complying with RoHS standards. They are designed for current sensing applications.

Product Attributes

  • Brand: (Changzhou Pengke Electronics)
  • Origin: China
  • Material: Metal Alloy
  • Certifications: RoHS compliant, Halogen Free, Lead Free Plate

Technical Specifications

SeriesModelPowerResistance RangeTCRToleranceOperating Temp. RangeMax. Operating Voltage
2512DD/XD2W/3W0mR 1m350ppm/1%, 2%, 5% -55 ~ +170(P*R)
1m<R 2m100ppm/
2m<R 500m50 ppm/
1206RC1W0mR 2m350ppm/1%, 2%, 5% -55 ~ +170(P*R)
2m<R 200m50 ppm/
0805RE0.5W5mR 15m50ppm/1%, 2%, 5%-55 ~ +170(P*R)

Construction and Dimension

SeriesL (mm)W (mm)T (mm)A (mm)
25126.40.203.20.200.80.20DD:2.00.20 (R4 m) / XD:1.00.20 (R0.5 m)
12063.20.201.60.200.70.200m R<10m: 0.60.20 / 10m<R 200m: 0.450.20
08052.00.101.250.100.50.200.350.20

Land Pattern Dimensions

Seriesa (mm)b (mm)L (mm)
0805 RE1.511
1206 RC1.81.71.6
2512 XD42.14.1
2512 DD43.11.3

Reliability Tests

ProjectTest MethodSpecifications and Requirements
Temperature coefficient (TCR)Measured at 25(T1, R1) and 125(T2, R2)Refer to TCR specifications for physical features
Short Time Overload5 times rated power, maintain 5sR 1%+0.05m
Insulation resistanceApply 100V15V DC voltage between electrode and substrate, hold for 60 seconds, then measure> 100 M
Withstand voltageApply AC voltage of max overload voltage between electrode and substrate at approx. 100V/S, hold for 605sNo breakdown or arc
Solderability2455 tin tank, hold 2s0.5sAt least 95% of surface area of electrode shall be covered with new solder
Resistance to Soldering Heat2605 tin tank, hold for 10s1sR (0.5%+0.05m ), no visible damage
Bending testBending distance 2mm, hold time 60s5sR0.5%+0.05m , no mechanical damage
Solvent resistanceIsopropanol (IPA) at 235 for 10 hoursNo obvious damage to appearance
High Temperature Exposure1702, 1000HR (1.0%+0.05m )
Low Temperature Exposure-552, 1000HR (0.5%+0.05m )
Rapid change of Temperature-55 30 minutes ~ normal temperature 5 minutes ~155 30 minutes, 1000 cycles R (0.5%+0.05m )
Load Life702, 1000 hours, rated power, 1.5 hours on / 0.5 hours offR (1.0%+0.05m )
Moisture with Load852, 85%3%RH, 1000 hours, rated power, 1.5 hours on / 0.5 hours offR (1.0%+0.05m)

Tape Packaging Dimensions

SeriesA (mm)B (mm)C (mm)D (mm)E (mm)T1 (mm)T2 (mm)
08051782.0601.0131.02.00.5>229.01/
12061782.0601.0131.02.00.5>229.00.311.4 1.0
25121782.0601.0131.02.00.5>2213.0 0.315.4 1.0

Reel Dimensions

SeriesD (mm)C (mm)E (mm)T1 (mm)
080517860139.0
120617860139.0
2512178601313.0

Label Information

Packaging Quantity: 0805/1206: 5000pcs/Reel, 2512: 4000pcs/Reel. Labels shall be marked with: (1) Size, (2) Quantity, (3) LOT.NO., (4) Manufacturers name.

Recommended Reflow Soldering Profile

Solder: Sn96.5 / Ag3 / Cu0.5. Peak Temperature: 240~260, 10 sec. Pre-heating Zone: 150 to 200, 9030 sec. Soldering Zone: 230 or higher, 3010 sec.

Care Note for Storage and Handling

Storage: Temperature 5~35, Humidity 45~75% RH. Avoid direct sunlight, moisture, dust, and harmful gases. Storage life: 1 year. Handling: Avoid exceeding rated power. Use tweezers carefully to avoid damaging the product. Do not touch the product with a soldering tip during manual installation.


2512101755_RVR-HIRC12AR0045J_C53144883.pdf

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