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Specifications
Power(Watts):
2W
Resistance:
20mΩ
Type:
Alloy Resistor
Tolerance:
±1%
Mfr. Part #:
HIXD25LR020F
Package:
2512
Key Attributes
Model Number:
HIXD25LR020F
Product Description
Product Overview
This document specifies the Approval Specification for Metal Current Sensing Chip Resistors, Type 2512/1206/0805 series. These resistors offer high power capabilities up to 3W, low TCR down to 50ppm/, and are suitable for reflow and wave soldering. They feature Halogen Free Epoxy, Lead Free Plating, superior mechanical strength, excellent high-frequency characteristics, and are RoHS compliant. Applications include current sensing in various electronic devices.
Product Attributes
- Brand: (Changzhou Pengke Electronics)
- Origin: China
- Material: Metal Alloy Resistance
- Certifications: RoHS compliant
Technical Specifications
| Series | Type Designation | Size | Power Rating | Resistance Range | TCR | Tolerance | Operating Temp. Range | Max. Operating Voltage | Insulation Resistance |
| 2512 | HI XD 25 N R001 F | 2512 | 2W/3W | 0m R 1m | 350ppm/ | 1% (F), 2% (G), 5% (J) | -55 ~ +170 | (P*R) | Over 100M |
| 1m < R 2m | 100ppm/ | ||||||||
| 2m < R 500m | 50 ppm/ | ||||||||
| 1206 | HI RC 1206 L R010 F | 1206 | 1W | 0m R 2m | 350ppm/ | 1% (F), 2% (G), 5% (J) | -55 ~ +170 | (P*R) | Over 100M |
| 2m < R 200m | 50 ppm/ | ||||||||
| 0805 | HI RE 0805 B R100 F | 0805 | 0.5W | 5m R 15m | 50ppm/ | 1% (F), 2% (G), 5% (J) | -55 ~ +170 | (P*R) | Over 100M |
Electrical Specifications
| Item | Test Method | Specifications and Requirements |
| Temperature coefficient (TCR) | Measured at 25(T1, R1) and 125(T2, R2), TCR=(R2-R1)/(R1(T2-T1))*10^6 | Refer to TCR specifications for physical features |
| Short Time Overload | 5 times rated power, maintain 5s | R 1%+0.05m |
| Insulation resistance | Apply 100V15V DC voltage between electrode and substrate, hold for 60 seconds | > 100 M |
| Withstand voltage | Apply AC voltage with effective value of max overload voltage at approx. 100V/S, hold for 605s | No breakdown or arc |
| Solderability | 2455 tin bath, hold 2s0.5s | At least 95% of electrode surface area covered with new solder |
| Resistance to Soldering Heat | 2605 tin bath, hold for 10s1s | R (0.5%+0.05m ), no visible damage |
| Bending test | Bending distance 2mm, hold time 60s5s | R0.5%+0.05m , no mechanical damage |
| Solvent resistance | Isopropanol (IPA) at 235 for 10 hours | No obvious damage to appearance |
| High Temperature Exposure | 1702, 1000H | R (1.0%+0.05m ) |
| Low Temperature Exposure | -552, 1000H | R (0.5%+0.05m ) |
| Rapid change of Temperature | -55 30 min ~ normal temp 5 min ~155 30 min, 1000 cycles | R (0.5%+0.05m ) |
| Load Life | 702, 1000 hours, rated power, 1.5 hours on / 0.5 hours off | R (1.0%+0.05m ) |
| Moisture with Load | 852, 85%3%RH, 1000 hours, rated power, 1.5 hours on / 0.5 hours off | R (1.0%+0.05m) |
2509261615_RVR-HIXD25LR020F_C52015936.pdf
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