<
>
Specifications
Number of Resistors:
4
Number of Pins:
8
Tolerance:
±5%
Resistance:
15kΩ
Power(Watts):
62.5mW
Temperature Coefficient:
±200ppm/℃
Mfr. Part #:
RTA02-4D153JTH
Package:
0402x4
Key Attributes
Model Number:
RTA02-4D153JTH
Product Description
RTA Series Thick Film Array Chip Resistors
The RTA series resistors are lead-free, halogen-free thick film array chip resistors that comply with RoHS directives. Designed for general electronic applications, these resistors offer reliable performance.
Product Attributes
- Brand: RALEC
- Certifications: RoHS compliant
- Material: Thick Film
- Type: Array Chip Resistors
Technical Specifications
| Type | Rated Power | Max. Rated Voltage | Max. Overload Voltage | T.C.R (ppm/) | Resistance Range | Number of Terminals | Number of Resistors | JUMPER (0) Rated Current | JUMPER (0) Resistance |
|---|---|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1 W | 25V | 50V | 300 | 1R<10 | 4 | 2 | 1A | 25m MAX. |
| RTA02-4D (0402) | 1 W | 25V | 50V | 300 | 1R<10 | 8 | 4 | 1A | 25m MAX. |
| RTA02-8D (0402) | 1 W | 25V | 50V | 250 | 10R10M | 16 | 8 | 1A | 50m MAX. |
| RTA03-2D (0603) | 1 W | 50V | 100V | 200 | 10R10M | 4 | 2 | 1A | 50m MAX. |
| RTA03-4D (0603) | 1 W | 50V | 100V | 200 | 1R10M | 8 | 4 | 1A | 25m MAX |
| RTA02-2C (0402) | 1 W | 25V | 50V | 650 | 3R10 | 4 | 2 | 1A | 50m MAX. |
| RTA02-4C (0402) | 1 W | 25V | 50V | 400 | 1R<10 | 8 | 4 | 1A | 50m MAX. |
Dimensions (mm)
| Type | L | W | H | L1 | L2 | P | Q |
|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1.000.10 | 1.000.10 | 0.300.05 | 0.150.10 | 0.250.10 | (0.67) | 0.330.10 |
| RTA02-4D (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.200.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-8D (0402) | 4.000.20 | 1.600.10 | 0.400.10 | 0.300.15 | 0.300.10 | (0.50) | 0.250.10 |
| RTA03-2D (0603) | 1.600.15 | 1.600.15 | 0.450.10 | 0.300.15 | 0.300.15 | (0.80) | 0.600.10 |
| RTA03-4D (0603) | 3.200.20 | 1.600.15 | 0.500.10 | 0.300.15 | 0.300.15 | (0.80) | 0.500.10 |
| RTA02-2C (0402) | 1.000.10 | 1.000.10 | 0.300.10 | 0.180.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-4C (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.150.10 | 0.250.10 | (0.50) | 0.300.10 |
Structure Diagram
See attached images for D(Convex) Type and C(Concave) Type structure diagrams.
Reliability Test Items
Electrical Performance Tests
| Item | Conditions | Specifications |
|---|---|---|
| Temperature Coefficient of Resistance | TCR (ppm/) = (R2-R1)/R1(T2-T1) 106 R1: Room temp. resistance, R2: -55 or +125 resistance, T1: Room temp., T2: -55 or +125 | According to JIS-C5201-1 4.8 |
| Short Time Overload | Apply 2.5x rated voltage for 5 sec, rest 30 min. | 0.5%, 1%: R=1.0%; 5%: R=2.0% |
| Insulation Resistance | Apply 100 VDC for 1 min between electrodes and protective layer/substrate. | 109 |
| Dielectric Withstand Voltage | Apply 300 VAC for 1 min between electrodes. | No short circuit or burn. |
| Intermittent Overload | 1 sec ON, 25 sec OFF, 10,000 cycles at 2.5x rated voltage. | R=5.0% |
Mechanical Performance Tests
| Item | Conditions | Specifications |
|---|---|---|
| Resistance to Solvent | Immerse in Isopropyl alcohol at 20~25 for 50.5 min, rest 48 hrs. | R=0.5% |
| Solderability | Pre-treatment: 4 hrs aging at 105, 100% RH, 1.22105 pa. Test: Immerse in 2355 solder bath for 20.5 sec. | Soldered area >95%. |
| Resistance to Soldering Heat | Test 1: Immerse in 260+5/-0 solder bath for 10 sec+1/-0, rest 60 min. Test 2: Immerse in 260+5/-0 solder bath for 30 sec+1/-0, clean. | Test 1: R%=1.0%. Test 2: Soldered area >95%, no underlying material visible at electrode edge. |
| Joint Strength of Solder | Bending test: Apply 5mm downward force at center of PCB. | R%=1.0% |
Environmental Tests
| Item | Conditions | Specifications |
|---|---|---|
| Resistance to Dry Heat | 10004 hr at 1555. | 0.5%, 1%: R=1.0%; 5%: R=2.0% |
| Thermal Shock | 300 cycles: -55 (15 min) to +125 (15 min). | R=1.0% |
| Moisture Load | 1000 hr at 402, 90~95% RH, 90 min ON / 30 min OFF with rated voltage. | 0.5%, 1%: R=2.0%; 5%: R=3.0% |
| Load Life | 1000 hr at 702, 90 min ON / 30 min OFF with rated voltage. | 0.5%, 1%: R=2.0%; 5%: R=3.0% |
Plating Thickness
- Nickel Layer (Ni): 2m
- Pure Tin Layer (Sn): 3m (Matte Tin)
Application Notes
- Recommended Soldering Conditions: Lead Free IR-Reflow (J-STD-020 compliant, max temp 260+5/-0 for 10 sec), Soldering Iron: 35010 within 3 sec.
- Recommended Land Pattern Design: Refer to diagrams for specific types.
- Environmental Considerations: Not recommended for high humidity, corrosive environments (sea breeze, Cl2, H2S, NH3, SO2, NO2), unverified liquids, unverified sealing/coating materials, or with water-based cleaning agents after soldering.
- Transient Overload: Avoid transient overloads exceeding product specifications.
- Handling: Protect edges and protective layers from mechanical stress. Avoid bending of PCB. Operate within rated power. Consider pulse load impacts. Evaluate and confirm in actual application for safety.
Storage and Handling Conditions
- Storage: 255, 6015% RH for up to two years.
- Avoid: Corrosive environments, direct sunlight, condensation.
- Handling: Maintain correct box orientation, avoid dropping or squeezing.
Labeling (for export to China)
- Electronic Information Product Pollution Control Mark
- Packaging Recycling Mark
2411221110_RALEC-RTA02-4D153JTH_C458626.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
