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Specifications
Number of Resistors:
4
Number of Pins:
8
Tolerance:
±5%
Resistance:
39Ω
Power(Watts):
62.5mW
Temperature Coefficient:
±200ppm/℃
Mfr. Part #:
RTA02-4D390JTH
Package:
0402x4
Key Attributes
Model Number:
RTA02-4D390JTH
Product Description
RTA Series Thick Film Array Chip Resistors
The RTA series resistors are lead-free, halogen-free, and RoHS compliant thick film array chip resistors designed for general electronic applications. They offer reliable performance and are suitable for various general electronic uses.
Product Attributes
- Brand: RALEC
- Compliance: Lead-free, Halogen-free, RoHS
- Type: Thick Film Array Chip Resistors
Technical Specifications
| Type | Rated Power | Max. Rated Voltage | Max. Overload Voltage | T.C.R (ppm/) | Resistance Range | Number of Terminals | Number of Resistors | JUMPER (0) Rated Current | JUMPER (0) Resistance |
|---|---|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1 W | 25V | 50V | ±300 | 1R<10 | 4 | 2 | 1A | 25m MAX. |
| RTA02-4D (0402) | 1 W | 25V | 50V | ±300 | 1R<10 | 8 | 4 | 1A | 25m MAX. |
| RTA02-8D (0402) | 1 W | 25V | 50V | ±250 | 10R10M | 16 | 8 | 1A | -- |
| RTA03-2D (0603) | 1 W | 50V | 100V | ±200 | 10R10M | 4 | 2 | 1A | -- |
| RTA03-4D (0603) | 1 W | 50V | 100V | ±200 | 1R10M | 8 | 4 | 1A | 25m MAX. |
| RTA02-2C (0402) | 1 W | 25V | 50V | ±650 | 3R10 | 4 | 2 | 1A | -- |
| RTA02-4C (0402) | 1 W | 25V | 50V | ±400 | 1R<10 | 8 | 4 | 1A | -- |
Dimensions (mm)
| Type | L | W | H | L1 | L2 | P | Q |
|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1.00±0.10 | 1.00±0.10 | 0.30±0.05 | 0.15±0.10 | 0.25±0.10 | (0.67) | 0.33±0.10 |
| RTA02-4D (0402) | 2.00±0.10 | 1.00±0.10 | 0.40±0.10 | 0.20±0.10 | 0.25±0.10 | (0.50) | 0.30±0.10 |
| RTA02-8D (0402) | 4.00±0.20 | 1.60±0.10 | 0.40±0.10 | 0.30±0.15 | 0.30±0.10 | (0.50) | 0.25±0.10 |
| RTA03-2D (0603) | 1.60±0.15 | 1.60±0.15 | 0.45±0.10 | 0.30±0.15 | 0.30±0.15 | (0.80) | 0.60±0.10 |
| RTA03-4D (0603) | 3.20±0.20 | 1.60±0.15 | 0.50±0.10 | 0.30±0.15 | 0.30±0.15 | (0.80) | 0.50±0.10 |
| RTA02-2C (0402) | 1.00±0.10 | 1.00±0.10 | 0.30±0.10 | 0.18±0.10 | 0.25±0.10 | (0.50) | 0.30±0.10 |
| RTA02-4C (0402) | 2.00±0.10 | 1.00±0.10 | 0.40±0.10 | 0.15±0.10 | 0.25±0.10 | (0.50) | 0.30±0.10 |
Structure Diagram
D (Convex) Type
- 1. Ceramic substrate
- 2. Bottom inner electrode
- 3. Top inner electrode
- 4. Resistive layer
- 5. 1st Protective coating
- 6. 2nd Protective coating
- 7. Marking
- 8. Terminal inner electrode
- 9. Ni plating
- 10. Sn plating
C (Concave) Type
- 1. Ceramic substrate
- 2. Bottom inner electrode
- 3. Top inner electrode
- 4. Resistive layer
- 5. 1st Protective coating
- 6. 2nd Protective coating
- 7. Marking
- 8. Terminal inner electrode
- 9. Ni plating
- 10. Sn plating
Reliability Test Items
Electrical Performance Test
| Item | Conditions | Specifications |
|---|---|---|
| Temperature Coefficient of Resistance | TCR = (R2-R1) / R1(T2-T1) x 106 (R1: Resistance at room temp., R2: Resistance at -55 or +125, T1: Room temp., T2: -55 or +125) Ref: JIS-C5201-1 4.8 | Refer to 3. Specification Table |
| Short Time Overload | Apply 2.5 times rated voltage for 5 sec, rest for 30 min. Ref: JIS-C5201-1 4.13 | 0.5%, 1%: △R=±1.0%; 5%: △R=±2.0% |
| Insulation Resistance Test | Apply 100 VDC for 1 min between electrodes and protective coating/substrate. Ref: JIS-C5201-1 4.6 | ≥109 |
| Dielectric Withstand Voltage | Apply 300 VAC for 1 min between electrodes. Ref: JIS-C5201-1 4.7 | No short or burn |
| Intermittent Overload | 1 sec ON, 25 sec OFF at 2.5 times rated voltage, 10,000 cycles. Ref: JIS-C5201-1 4.13 | △R=±5.0% |
Mechanical Performance Test
| Item | Conditions | Specifications |
|---|---|---|
| Resistance to Solvent | Immerse in Isopropyl alcohol (20-25) for 5 min, rest for 48 hrs. Ref: JIS-C5201-1 4.29 | △R=±0.5% |
| Solderability | Pre-conditioning: 4 hrs at 105, 100% RH, 1.22x105 Pa. Test: Immerse in 235±5 solder bath for 2 sec. Ref: JIS-C5201-1 4.17 | Soldered area > 95% |
| Resistance to Soldering Heat | Test 1: Immerse in 260+5/-0 solder bath for 10 sec. Test 2: Immerse in 260+5/-0 solder bath for 30 sec. Ref: JIS-C5201-1 4.18 | Test 1: △R=±1.0%. Test 2: Soldered area > 95%, no under-layer visible at electrode edge. |
| Joint Strength of Solder | Bending test: Apply 5mm deflection. Ref: JIS-C5201-1 4.33 | △R=±1.0% |
Environmental Test
| Item | Conditions | Specifications |
|---|---|---|
| Resistance to Dry Heat | 1000 hrs at 155±5. Ref: JIS-C5201-1 4.25 | 0.5%, 1%: △R=±1.0%; 5%: △R=±2.0% |
| Thermal Shock | -55 (15 min) to +125 (15 min), 300 cycles. Ref: MIL-STD 202 Method 107 | △R=±1.0% |
| Moisture Load Test | 40±2, 90-95% RH, rated voltage applied, 90 min ON / 30 min OFF, 1000 hrs. Ref: JIS-C5201-1 4.24 | 0.5%, 1%: △R=±2.0%; 5%: △R=±3.0% |
| Load Life | 70±2, rated voltage applied, 90 min ON / 30 min OFF, 1000 hrs. Ref: JIS-C5201-1 4.25 | 0.5%, 1%: △R=±2.0%; 5%: △R=±3.0% |
Plating Thickness
- Nickel Layer (Ni): ≥2m
- Pure Tin Layer (Sn): ≥3m (Matte tin)
Technical Application Notes
Recommended Soldering Conditions
- Lead Free IR-Reflow Soldering Profile: Conforms to J-STD-020. Max component temperature: 260+5/-0, 10 sec.
- Soldering Iron Method: 350±10 within 3 seconds.
Recommended Land Pattern Design (For Reflow Soldering)
| Type | A | B | P | Q1 | Q2 |
|---|---|---|---|---|---|
| RTA02-2D | 0.50 | 2.00 | 0.67 | 0.33 | 0.34 |
| RTA02-4D | 0.50 | 2.00 | 0.50 | 0.28 | 0.22 |
| RTA02-8D | 1.00 | 2.60 | 0.50 | 0.25 | 0.25 |
| RTA03-2D | 1.00 | 2.60 | 0.80 | 0.40 | 0.40 |
| RTA03-4D | 1.00 | 2.60 | 0.80 | 0.40 | 0.40 |
| RTA02-2C | 0.50 | 2.00 | 0.50 | 0.28 | 0.22 |
| RTA02-4C | 0.50 | 2.00 | 0.50 | 0.28 | 0.22 |
Environmental Usage Precautions
This product is for general electronic use. RALEC is not responsible for any damage, costs, or losses caused by using this product in special environments. Confirmation with RALEC is required for other applications. Customers intending to use this product in special environments or conditions (including but not limited to high temperature/humidity, corrosive atmospheres like sea breeze, Cl2, H2S, NH3, SO2, NO2, unverified liquids, unverified resins/coatings, or using water-soluble cleaning agents after soldering) must have product characteristics and reliability individually approved.
Transient Overload Precautions
This product may experience functional loss due to transient overload. Exercise caution in manufacturing and storage to avoid transient currents exceeding product specifications.
Handling and Operation Precautions
- Ensure resistor edges and protective coating are free from mechanical stress damage during operation.
- Handle Printed Circuit Boards (PCBs) carefully when separating or fixing them to support structures, as PCB bending can cause mechanical stress on resistors.
- Resistors must be used within their rated power range. Exceeding the rated value can lead to temperature rise and potential equipment damage.
- If the resistor is likely to experience significant load (pulse) impacts, the operating environment must be set up before use.
Evaluate and confirm the product in your actual application state, and ensure system safety with fail-safe design.
Storage and Handling Conditions
- Storage life: 2 years under 25±5, 60±15% RH.
- Avoid harsh environments during storage, such as sea breeze, corrosive gases (Cl2, H2S, NH3, SO2, NO2), direct sunlight, and condensation, as they may affect product performance and solderability.
- Ensure correct orientation of the packaging during handling and storage. Avoid dropping or squeezing the package, which may damage the product's electrodes or body.
Labeling for Electronic Information Products (for export to mainland China)
- China RoHS Mark
- Recycling Symbol
2411221110_RALEC-RTA02-4D390JTH_C102636.pdf
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