RTA Series Thick Film Array Chip Resistors
The RTA series resistors are lead-free, halogen-free thick film array chip resistors that comply with RoHS directives. They are designed for general electronic applications.
Product Attributes
- Brand: RALEC
- Type: Thick Film Array Chip Resistors
- Compliance: RoHS, Lead-free, Halogen-free
Technical Specifications
| Type | Rated Power | Max. Rated Voltage | Max. Overload Voltage | T.C.R (ppm/) | Resistance Range | Number of Terminals | Number of Resistors | JUMPER (0) Rated Current | JUMPER (0) Resistance |
|---|---|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1W | 25V | 50V | 300 (1R<10), 200 (10R10M) | 1R<10, 10R10M | 4 | 2 | 1A | 25m MAX. |
| RTA02-4D (0402) | 1W | 25V | 50V | 300 (1R<10), 200 (10R10M) | 1R<10, 10R10M | 8 | 4 | 1A | 25m MAX. |
| RTA02-8D (0402) | 1W | 25V | 50V | 250 (10R10M) | 10R10M | 16 | 8 | 1A | 50m MAX. |
| RTA03-2D (0603) | 1W | 50V | 100V | 200 (10R10M) | 10R10M | 4 | 2 | 1A | 50m MAX. |
| RTA03-4D (0603) | 1W | 50V | 100V | 200 (22R470K), 200 (1R10M) | 22R470K, 1R10M | 8 | 4 | 1A | 25m MAX |
| RTA02-2C (0402) | 1W | 25V | 50V | 650 (3R10), 200 (10R<1M) | 3R10, 10R1M | 4 | 2 | 1A | 50m MAX. |
| RTA02-4C (0402) | 1W | 25V | 50V | 400 (1R<10), 200 (10R1M) | 1R<10, 10R1M | 8 | 4 | 1A | 50m MAX. |
Operating Temperature Range: -55 ~ 155
Power Derating Curve: Power can be adjusted according to the curve when ambient temperature exceeds 70 to 155.
Rated Voltage/Current Calculation:
- For resistance values 1: E=(RP), where E is rated voltage, R is nominal resistance, P is rated power. If calculated E exceeds max. rated voltage, use max. rated voltage.
- For resistance values =0 (JUMPER): I=(P/R), where I is rated current, P is rated power, R is nominal resistance. If calculated I exceeds max. rated current, use max. rated current.
Dimensions (mm)
| Type | L | W | H | L1 | L2 | P | Q |
|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1.000.10 | 1.000.10 | 0.300.05 | 0.150.10 | 0.250.10 | (0.67) | 0.330.10 |
| RTA02-4D (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.200.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-8D (0402) | 4.000.20 | 1.600.10 | 0.400.10 | 0.300.15 | 0.300.10 | (0.50) | 0.250.10 |
| RTA03-2D (0603) | 1.600.15 | 1.600.15 | 0.450.10 | 0.300.15 | 0.300.15 | (0.80) | 0.600.10 |
| RTA03-4D (0603) | 3.200.20 | 1.600.15 | 0.500.10 | 0.300.15 | 0.300.15 | (0.80) | 0.500.10 |
| RTA02-2C (0402) | 1.000.10 | 1.000.10 | 0.300.10 | 0.180.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-4C (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.150.10 | 0.250.10 | (0.50) | 0.300.10 |
Structure Diagram
D(Convex) Type: Ceramic substrate, 2nd Protective coating, Bottom inner electrode, Top inner electrode, Terminal inner electrode, Resistive layer, 1st Protective coating, Marking, Ni plating, Sn plating.
C(Concave) Type: Ceramic substrate, 2nd Protective coating, Bottom inner electrode, Top inner electrode, Terminal inner electrode, Resistive layer, 1st Protective coating, Marking, Ni plating, Sn plating.
Reliability Test Items
Electrical Performance Test
| Item | Conditions | Specifications |
|---|---|---|
| Temperature Coefficient of Resistance (TCR) | JIS-C5201-1 4.8 | Refer to Specification Table |
| Short Time Overload | Apply 2.5x rated voltage for 5 sec. Rest 30 min. Measure resistance change. (Refer to Specification Table for rated voltage) JIS-C5201-1 4.13 | 0.5%, 1%: R=1.0%; 5%: R=2.0% |
| Insulation Resistance Test | Apply 100 VDC for 1 min. Measure insulation resistance between electrodes and protective layer/substrate. JIS-C5201-1 4.6 | 109 |
| Dielectric Withstand Voltage | Apply 300 VAC for 1 min. JIS-C5201-1 4.7 | No short circuit or burn |
| Intermittent Overload | 1 sec ON, 25 sec OFF at 2.5x rated voltage in oven. 10,000 cycles. Rest 60 min. Measure resistance change. JIS-C5201-1 4.13 | R=5.0% |
Mechanical Performance Test
| Item | Conditions | Specifications |
|---|---|---|
| Resistance to Solvent | Immerse in Isopropyl alcohol (20-25) for 50.5 min. Rest 48 hrs. Measure resistance change. JIS-C5201-1 4.29 | R=0.5% |
| Solderability | Pre-treatment: 4 hrs aging at 105, 100% RH, 1.22105 pa. Rest 2 hrs at room temp. Test: Dip in 2355 solder bath for 20.5 sec. Observe solder coverage. JIS-C5201-1 4.17 | Conductor solder coverage >95% |
| Resistance to Soldering Heat | Test 1: Dip in 260+5/-0 solder bath for 10 sec+1/-0. Rest 60 min. Measure resistance change. Test 2: Dip in 260+5/-0 solder bath for 30 sec+1/-0. Clean. Observe solder coverage. JIS-C5201-1 4.18 | Test 1: R%=1.0%. Test 2: Conductor solder coverage >95%. No underlayer visible at electrode edge. |
| Joint Strength of Solder (Flexibility Test) | Solder to flex test board. Apply downward force at center of board (D=5mm). Measure resistance change. JIS-C5201-1 4.33 | R%=1.0% |
Environmental Test
| Item | Conditions | Specifications |
|---|---|---|
| Resistance to Dry Heat | 10004 hrs in oven at 1555. Rest 1 hr. Measure resistance change. JIS-C5201-1 4.25 | 0.5%, 1%: R=1.0%; 5%: R=2.0% |
| Thermal Shock | -55 (15 min) to +125 (15 min), 300 cycles. Rest 60 min. Measure resistance change. MIL-STD 202 Method 107 | R=1.0% |
| Moisture Load Test | 402, 90-95% RH. 90 min ON, 30 min OFF at rated voltage. 1,000 hrs. Rest 60 min. Measure resistance change. JIS-C5201-1 4.24 | 0.5%, 1%: R=2.0%; 5%: R=3.0% |
| Load Life | 702 oven. 90 min ON, 30 min OFF at rated voltage. 1,000 hrs. Rest 60 min. Measure resistance change. JIS-C5201-1 4.25 | 0.5%, 1%: R=2.0%; 5%: R=3.0% |
Plating Thickness
- Nickel Layer (Ni): 2m
- Pure Tin Layer (Sn): 3m
- Pure Tin plating is matte tin.
Technical Application Notes (Recommendations)
- Recommended Soldering Conditions:
- Lead Free IR-Reflow Soldering Profile (J-STD-020): Max component temp 260+5/-0, 10 sec.
- Soldering Iron Method: 35010 within 3 seconds.
- Recommended Land Pattern Design (For Reflow Soldering): Adjustments may be needed based on soldering area and amount.
- Usage Environment Precautions: Not recommended for special environments (high temp/humidity, corrosive gases, unverified liquids, unverified resins/coatings). Contact RALEC for confirmation. Cleaning after soldering is recommended, even with no-clean flux.
- Transient Overload Precautions: Avoid transient currents exceeding product specifications during manufacturing and storage.
- Handling and Processing Precautions: Protect resistor edges and protective coating from mechanical stress. Avoid bending PCBs which can stress resistors. Operate within rated power; exceeding it can cause damage. Consider pulsed load impacts. Evaluate and confirm in actual application for fail-safe design.
Storage and Handling Conditions
- Storage: 2 years under 255, 6015% RH.
- Avoid: Sea breeze, corrosive gases (Cl2, H2S, NH3, SO2, NO2), direct sunlight, condensation.
- Handling: Ensure correct box orientation. Do not drop or crush boxes.
Marking
Outer box marked with Electronic Information Product Pollution Control Mark and Packaging Recycling Mark for export to Mainland China.
Attachment
- Document Revision Record Table (QA-QR-027)
Legal Disclaimer
RALEC and its distributors/agents (collectively "RALEC") assume no liability for errors, inaccuracies, or incompleteness in product information. RALEC may change information without notice. RALEC makes no commitment regarding suitability for special purposes or continued production. To the maximum extent permitted by law, RALEC is not liable for any application/use of its products, lost profits, direct/indirect/special/punitive/consequential/incidental damages, or any implied warranties (fitness for particular purpose, non-infringement, merchantability). This product is defined for general electronic use, not for automotive, medical life-support/sustaining devices, or any application where failure could cause injury/death. Technical advice is provided free of charge; RALEC bears no obligation or liability for its use. Buyer assumes all risks for combining RALEC products with other materials or implementing them in processes. RALEC reserves the right to modify content without notice; product changes will be announced via ECN.
2411221029_RALEC-RTA01-2D000JTH_C304947.pdf
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