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quality Thick Film Array Chip Resistors RALEC RTA03-4D150JTP RoHS Compliant for Circuit Applications factory
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quality Thick Film Array Chip Resistors RALEC RTA03-4D150JTP RoHS Compliant for Circuit Applications factory
>
Specifications
Number of Resistors:
4
Number of Pins:
8
Tolerance:
±5%
Resistance:
15Ω
Power(Watts):
62.5mW
Temperature Coefficient:
±200ppm/℃
Mfr. Part #:
RTA03-4D150JTP
Package:
0603x4
Key Attributes
Model Number: RTA03-4D150JTP
Product Description

RTA Series Thick Film Array Chip Resistors

The RTA series resistors are lead-free, halogen-free, and RoHS compliant thick film array chip resistors designed for general electronic applications. They offer reliable performance and are available in various configurations to meet diverse design needs.

Product Attributes

  • Brand: RALEC
  • Origin: Not specified
  • Material: Thick film on ceramic substrate
  • Color: Not specified
  • Certifications: RoHS compliant

Technical Specifications

Type Rated Power Max. Rated Voltage Max. Overload Voltage T.C.R (ppm/) Resistance Range () Terminals Resistors Jumper (0) Rated Current Jumper (0) Resistance Max.
RTA02-2D (0402) 1 W 25V 50V 300 1R<10 (D:0.5%)
10R10M (D:0.5%)
1R<10 (F:1%)
10R10M (F:1%)
1R<10 (J:5%)
10R10M (J:5%)
4 2 1A 25m MAX.
RTA02-4D (0402) 1 W 25V 50V 300 1R<10 (D:0.5%)
10R10M (D:0.5%)
1R<10 (F:1%)
10R10M (F:1%)
1R<10 (J:5%)
10R10M (J:5%)
8 4 1A 25m MAX.
RTA02-8D (0402) 1 W 25V 50V 250 10R10M (D:0.5%)
10R10M (F:1%)
1R10M (J:5%)
16 8 1A 50m MAX.
RTA03-2D (0603) 1 W 50V 100V 200 10R10M (D:0.5%)
10R10M (F:1%)
1R10M (J:5%)
4 2 1A 50m MAX.
RTA03-4D (0603) 1 W 50V 100V 200 22R470K (D:0.5%)
1R10M (F:1%)
1R10M (J:5%)
8 4 1A 25m MAX.
RTA02-2C (0402) 1 W 25V 50V 650 3R10 (D:0.5%)
10R<1M (D:0.5%)
3R<10 (F:1%)
10R1M (F:1%)
3R<10 (J:5%)
10R1M (J:5%)
4 2 1A 50m MAX.
RTA02-4C (0402) 1 W 25V 50V 400 1R<10 (D:0.5%)
10R1M (D:0.5%)
1R<10 (F:1%)
10R1M (F:1%)
1R<10 (J:5%)
10R1M (J:5%)
8 4 1A 50m MAX.

Operating Temperature Range: -55 ~ +155

Power Derating Curve: Power can be adjusted according to the curve when ambient temperature exceeds 70 to 155.

Rated Voltage/Current Calculation: Formulas provided for calculating rated voltage (E=(RP)) and rated current (I=(P/R)) based on resistance and rated power, with limits set by maximum values in the specification table.

Dimensions (mm)

Type L W H L1 L2 P Q
RTA02-2D (0402) 1.000.10 1.000.10 0.300.05 0.150.10 0.250.10 (0.67) 0.330.10
RTA02-4D (0402) 2.000.10 1.000.10 0.400.10 0.200.10 0.250.10 (0.50) 0.300.10
RTA02-8D (0402) 4.000.20 1.600.10 0.400.10 0.300.15 0.300.10 (0.50) 0.250.10
RTA03-2D (0603) 1.600.15 1.600.15 0.450.10 0.300.15 0.300.15 (0.80) 0.600.10
RTA03-4D (0603) 3.200.20 1.600.15 0.500.10 0.300.15 0.300.15 (0.80) 0.500.10
RTA02-2C (0402) 1.000.10 1.000.10 0.300.10 0.180.10 0.250.10 (0.50) 0.300.10
RTA02-4C (0402) 2.000.10 1.000.10 0.400.10 0.150.10 0.250.10 (0.50) 0.300.10

Structure Diagram

Diagrams illustrating the construction for D (Convex) Type and C (Concave) Type resistors are provided, showing layers such as ceramic substrate, resistive layer, protective coatings, and electrodes.

Reliability Test Items

Electrical Performance Tests

Item Conditions Specifications
Temperature Coefficient of Resistance (TCR) Measured at room temperature, -55, and +125. Formula: TCR = (R2-R1)/R1(T2-T1) 106 Refer to 3. Specification Table
Short Time Overload Apply 2.5 times rated voltage for 5 seconds. Rest for 30 minutes. Measure resistance change rate. 0.5%, 1%: R=1.0%
5%: R=2.0%
Insulation Resistance Apply 100 VDC for 1 minute between electrodes and between electrodes and substrate. 109
Dielectric Withstand Voltage Apply 300 VAC for 1 minute between electrodes. No short circuit or burn marks.
Intermittent Overload Apply 2.5 times rated voltage (1 sec ON, 25 sec OFF) for 10,000 cycles. Rest for 60 minutes. Measure resistance change. R=5.0%

Mechanical Performance Tests

Item Conditions Specifications
Resistance to Solvent Immerse in isopropyl alcohol (20-25) for 50.5 minutes. Rest for 48 hrs. Measure resistance change rate. R=0.5%
Solderability Pre-treatment: 4 hrs aging at 105, 100% RH, 1.22105 pa. Rest at room temp for 2 hrs. Test method: Immerse in solder bath (2355) for 20.5 seconds. Observe solder coverage. Conductor solder coverage > 95%.
Resistance to Soldering Heat Test 1: Immerse in solder bath (260+5/-0) for 10 sec+1/-0. Rest for 60 min. Measure resistance change rate. Test 2: Immerse in solder bath (260+5/-0) for 30 sec+1/-0. Clean. Observe solder coverage. Test 1: R%=1.0%
Test 2: Conductor solder coverage > 95%. No underlying material visible at electrode edges.
Joint Strength of Solder (Bending Test) Solder onto bending test board. Apply downward force at center of board (D=5mm). Measure resistance change rate under load. R%=1.0%

Environmental Tests

Item Conditions Specifications
Resistance to Dry Heat Place in oven at 1555 for 10004 hrs. Rest for 1 hr. Measure resistance change rate. 0.5%, 1%: R=1.0%
5%: R=2.0%
Thermal Shock Cycle between -55 (15 min) and +125 (15 min) for 300 cycles. Rest for 60 min. Measure resistance change rate. R=1.0%
Moisture Load Place in constant temperature/humidity chamber (402, 90-95% RH). Apply rated voltage (90 min ON, 30 min OFF) for 1,000 hrs. Rest for 60 min. Measure resistance change rate. 0.5%, 1%: R=2.0%
5%: R=3.0%
Load Life Place in oven at 702. Apply rated voltage (90 min ON, 30 min OFF) for 1,000 hrs. Rest for 60 min. Measure resistance change rate. 0.5%, 1%: R=2.0%
5%: R=3.0%

Plating Thickness

  • Nickel (Ni) Layer: 2m
  • Pure Tin (Sn) Layer: 3m (Matte tin)

Technical Application Notes

  • Recommended Soldering Conditions: Lead Free IR-Reflow Soldering Profile (J-STD-020 compliant, max temp 260+5/-0, 10 sec); Soldering Iron: 35010 within 3 seconds.
  • Recommended Land Pattern Design: Designs for various RTA types are provided, considering potential resistance value changes due to soldering area and volume.
  • Environmental Considerations: This product is for general electronic use. RALEC is not responsible for damages in special environments. Consult RALEC for applications in high temperature/humidity, corrosive atmospheres (Cl2, H2S, NH3, SO2, NO2), unverified liquids, or with unverified sealing/coating materials. Cleaning after soldering is recommended, even with no-clean flux.
  • Transient Overload: Be aware of potential function loss due to transient overloads.
  • Handling and Operation: Avoid mechanical stress on resistor edges and protective layers. Handle PCBs carefully to prevent bending-induced stress on resistors. Operate within rated power limits to avoid temperature rise and damage. Consider pulsed load impacts and implement fail-safe designs. Evaluate and confirm in actual application conditions.

Storage and Handling Conditions

  • Storage: 255, 6015% RH for two years.
  • Avoid harsh environments: sea breeze, corrosive gases (Cl2, H2S, NH3, SO2, NO2), direct sunlight, condensation.
  • Handle with care: ensure correct box orientation, avoid dropping or squeezing to prevent damage to electrodes or body.

Marking

Outer packaging will be marked with the Electronic Information Product Pollution Control Mark and the Packaging Recycling Mark for export to mainland China.

Attachment

  • Document Revision Record Table (QA-QR-027)

2411221110_RALEC-RTA03-4D150JTP_C458685.pdf

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