RTA Series Thick Film Array Chip Resistors
The RTA series resistors are lead-free, halogen-free, and RoHS compliant thick film array chip resistors designed for general electronic applications. They offer reliable performance and are available in various configurations to meet diverse design needs.
Product Attributes
- Brand: RALEC
- Origin: Not specified
- Material: Thick film on ceramic substrate
- Color: Not specified
- Certifications: RoHS compliant
Technical Specifications
| Type | Rated Power | Max. Rated Voltage | Max. Overload Voltage | T.C.R (ppm/) | Resistance Range () | Terminals | Resistors | Jumper (0) Rated Current | Jumper (0) Resistance Max. |
| RTA02-2D (0402) | 1 W | 25V | 50V | 300 | 1R<10 (D:0.5%) 10R10M (D:0.5%) 1R<10 (F:1%) 10R10M (F:1%) 1R<10 (J:5%) 10R10M (J:5%) | 4 | 2 | 1A | 25m MAX. |
| RTA02-4D (0402) | 1 W | 25V | 50V | 300 | 1R<10 (D:0.5%) 10R10M (D:0.5%) 1R<10 (F:1%) 10R10M (F:1%) 1R<10 (J:5%) 10R10M (J:5%) | 8 | 4 | 1A | 25m MAX. |
| RTA02-8D (0402) | 1 W | 25V | 50V | 250 | 10R10M (D:0.5%) 10R10M (F:1%) 1R10M (J:5%) | 16 | 8 | 1A | 50m MAX. |
| RTA03-2D (0603) | 1 W | 50V | 100V | 200 | 10R10M (D:0.5%) 10R10M (F:1%) 1R10M (J:5%) | 4 | 2 | 1A | 50m MAX. |
| RTA03-4D (0603) | 1 W | 50V | 100V | 200 | 22R470K (D:0.5%) 1R10M (F:1%) 1R10M (J:5%) | 8 | 4 | 1A | 25m MAX. |
| RTA02-2C (0402) | 1 W | 25V | 50V | 650 | 3R10 (D:0.5%) 10R<1M (D:0.5%) 3R<10 (F:1%) 10R1M (F:1%) 3R<10 (J:5%) 10R1M (J:5%) | 4 | 2 | 1A | 50m MAX. |
| RTA02-4C (0402) | 1 W | 25V | 50V | 400 | 1R<10 (D:0.5%) 10R1M (D:0.5%) 1R<10 (F:1%) 10R1M (F:1%) 1R<10 (J:5%) 10R1M (J:5%) | 8 | 4 | 1A | 50m MAX. |
Operating Temperature Range: -55 ~ +155
Power Derating Curve: Power can be adjusted according to the curve when ambient temperature exceeds 70 to 155.
Rated Voltage/Current Calculation: Formulas provided for calculating rated voltage (E=(RP)) and rated current (I=(P/R)) based on resistance and rated power, with limits set by maximum values in the specification table.
Dimensions (mm)
| Type | L | W | H | L1 | L2 | P | Q |
| RTA02-2D (0402) | 1.000.10 | 1.000.10 | 0.300.05 | 0.150.10 | 0.250.10 | (0.67) | 0.330.10 |
| RTA02-4D (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.200.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-8D (0402) | 4.000.20 | 1.600.10 | 0.400.10 | 0.300.15 | 0.300.10 | (0.50) | 0.250.10 |
| RTA03-2D (0603) | 1.600.15 | 1.600.15 | 0.450.10 | 0.300.15 | 0.300.15 | (0.80) | 0.600.10 |
| RTA03-4D (0603) | 3.200.20 | 1.600.15 | 0.500.10 | 0.300.15 | 0.300.15 | (0.80) | 0.500.10 |
| RTA02-2C (0402) | 1.000.10 | 1.000.10 | 0.300.10 | 0.180.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-4C (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.150.10 | 0.250.10 | (0.50) | 0.300.10 |
Structure Diagram
Diagrams illustrating the construction for D (Convex) Type and C (Concave) Type resistors are provided, showing layers such as ceramic substrate, resistive layer, protective coatings, and electrodes.
Reliability Test Items
Electrical Performance Tests
| Item | Conditions | Specifications |
| Temperature Coefficient of Resistance (TCR) | Measured at room temperature, -55, and +125. Formula: TCR = (R2-R1)/R1(T2-T1) 106 | Refer to 3. Specification Table |
| Short Time Overload | Apply 2.5 times rated voltage for 5 seconds. Rest for 30 minutes. Measure resistance change rate. | 0.5%, 1%: R=1.0% 5%: R=2.0% |
| Insulation Resistance | Apply 100 VDC for 1 minute between electrodes and between electrodes and substrate. | 109 |
| Dielectric Withstand Voltage | Apply 300 VAC for 1 minute between electrodes. | No short circuit or burn marks. |
| Intermittent Overload | Apply 2.5 times rated voltage (1 sec ON, 25 sec OFF) for 10,000 cycles. Rest for 60 minutes. Measure resistance change. | R=5.0% |
Mechanical Performance Tests
| Item | Conditions | Specifications |
| Resistance to Solvent | Immerse in isopropyl alcohol (20-25) for 50.5 minutes. Rest for 48 hrs. Measure resistance change rate. | R=0.5% |
| Solderability | Pre-treatment: 4 hrs aging at 105, 100% RH, 1.22105 pa. Rest at room temp for 2 hrs. Test method: Immerse in solder bath (2355) for 20.5 seconds. Observe solder coverage. | Conductor solder coverage > 95%. |
| Resistance to Soldering Heat | Test 1: Immerse in solder bath (260+5/-0) for 10 sec+1/-0. Rest for 60 min. Measure resistance change rate. Test 2: Immerse in solder bath (260+5/-0) for 30 sec+1/-0. Clean. Observe solder coverage. | Test 1: R%=1.0% Test 2: Conductor solder coverage > 95%. No underlying material visible at electrode edges. |
| Joint Strength of Solder (Bending Test) | Solder onto bending test board. Apply downward force at center of board (D=5mm). Measure resistance change rate under load. | R%=1.0% |
Environmental Tests
| Item | Conditions | Specifications |
| Resistance to Dry Heat | Place in oven at 1555 for 10004 hrs. Rest for 1 hr. Measure resistance change rate. | 0.5%, 1%: R=1.0% 5%: R=2.0% |
| Thermal Shock | Cycle between -55 (15 min) and +125 (15 min) for 300 cycles. Rest for 60 min. Measure resistance change rate. | R=1.0% |
| Moisture Load | Place in constant temperature/humidity chamber (402, 90-95% RH). Apply rated voltage (90 min ON, 30 min OFF) for 1,000 hrs. Rest for 60 min. Measure resistance change rate. | 0.5%, 1%: R=2.0% 5%: R=3.0% |
| Load Life | Place in oven at 702. Apply rated voltage (90 min ON, 30 min OFF) for 1,000 hrs. Rest for 60 min. Measure resistance change rate. | 0.5%, 1%: R=2.0% 5%: R=3.0% |
Plating Thickness
- Nickel (Ni) Layer: 2m
- Pure Tin (Sn) Layer: 3m (Matte tin)
Technical Application Notes
- Recommended Soldering Conditions: Lead Free IR-Reflow Soldering Profile (J-STD-020 compliant, max temp 260+5/-0, 10 sec); Soldering Iron: 35010 within 3 seconds.
- Recommended Land Pattern Design: Designs for various RTA types are provided, considering potential resistance value changes due to soldering area and volume.
- Environmental Considerations: This product is for general electronic use. RALEC is not responsible for damages in special environments. Consult RALEC for applications in high temperature/humidity, corrosive atmospheres (Cl2, H2S, NH3, SO2, NO2), unverified liquids, or with unverified sealing/coating materials. Cleaning after soldering is recommended, even with no-clean flux.
- Transient Overload: Be aware of potential function loss due to transient overloads.
- Handling and Operation: Avoid mechanical stress on resistor edges and protective layers. Handle PCBs carefully to prevent bending-induced stress on resistors. Operate within rated power limits to avoid temperature rise and damage. Consider pulsed load impacts and implement fail-safe designs. Evaluate and confirm in actual application conditions.
Storage and Handling Conditions
- Storage: 255, 6015% RH for two years.
- Avoid harsh environments: sea breeze, corrosive gases (Cl2, H2S, NH3, SO2, NO2), direct sunlight, condensation.
- Handle with care: ensure correct box orientation, avoid dropping or squeezing to prevent damage to electrodes or body.
Marking
Outer packaging will be marked with the Electronic Information Product Pollution Control Mark and the Packaging Recycling Mark for export to mainland China.
Attachment
- Document Revision Record Table (QA-QR-027)
2411221110_RALEC-RTA03-4D150JTP_C458685.pdf
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