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Specifications
Number of Resistors:
4
Number of Pins:
8
Tolerance:
±5%
Resistance:
68Ω
Power(Watts):
62.5mW
Temperature Coefficient:
±200ppm/℃
Mfr. Part #:
RTA03-4D680JTP
Package:
0603x4
Key Attributes
Model Number:
RTA03-4D680JTP
Product Description
RTA Series Thick Film Array Chip Resistors
The RTA series thick film array chip resistors are lead-free and halogen-free, compliant with RoHS regulations. They are designed for general electronic applications.
Product Attributes
- Brand: RALEC
- Certifications: RoHS compliant
Technical Specifications
| Type | Rated Power | Max. Rated Voltage | Max. Overload Voltage | T.C.R (ppm/) | Resistance Range | Number of Terminals | Number of Resistors | JUMPER (0) Rated Current | JUMPER (0) Resistance |
| RTA02-2D (0402) | 1 W | 25V | 50V | 300 | 1R<10 (D:0.5%) 10R10M (D:0.5%) 1R<10 (F:1%) 10R10M (F:1%) 1R<10 (J:5%) 10R10M (J:5%) | 4 | 2 | 1A | 25m MAX. |
| RTA02-4D (0402) | 1 W | 25V | 50V | 300 | 1R<10 (D:0.5%) 10R10M (D:0.5%) 1R<10 (F:1%) 10R10M (F:1%) 1R<10 (J:5%) 10R10M (J:5%) | 8 | 4 | 1A | 25m MAX. |
| RTA02-8D (0402) | 1 W | 25V | 50V | 250 | 10R10M (D:0.5%) 1R10M (F:1%) 1R10M (J:5%) | 16 | 8 | 1A | 50m MAX. |
| RTA03-2D (0603) | 1 W | 50V | 100V | 200 | 10R10M (D:0.5%) 1R10M (F:1%) 1R10M (J:5%) | 4 | 2 | 1A | 50m MAX. |
| RTA03-4D (0603) | 1 W | 50V | 100V | 200 | 22R470K (D:0.5%) 1R10M (F:1%) 1R10M (J:5%) | 8 | 4 | 1A | 25m MAX. |
| RTA02-2C (0402) | 1 W | 25V | 50V | 650 | 3R10 (D:0.5%) 10R<1M (D:0.5%) 3R<10 (F:1%) 10R1M (F:1%) 3R<10 (J:5%) 10R1M (J:5%) | 4 | 2 | 1A | 50m MAX. |
| RTA02-4C (0402) | 1 W | 25V | 50V | 400 | 1R<10 (D:0.5%) 10R1M (D:0.5%) 1R<10 (F:1%) 10R1M (F:1%) 1R<10 (J:5%) 10R1M (J:5%) | 8 | 4 | 1A | 50m MAX. |
Dimensions (mm)
| Type | L | W | H | L1 | L2 | P | Q |
| RTA02-2D (0402) | 1.000.10 | 1.000.10 | 0.300.05 | 0.150.10 | 0.250.10 | (0.67) | 0.330.10 |
| RTA02-4D (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.200.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-8D (0402) | 4.000.20 | 1.600.10 | 0.400.10 | 0.300.15 | 0.300.10 | (0.50) | 0.250.10 |
| RTA03-2D (0603) | 1.600.15 | 1.600.15 | 0.450.10 | 0.300.15 | 0.300.15 | (0.80) | 0.600.10 |
| RTA03-4D (0603) | 3.200.20 | 1.600.15 | 0.500.10 | 0.300.15 | 0.300.15 | (0.80) | 0.500.10 |
| RTA02-2C (0402) | 1.000.10 | 1.000.10 | 0.300.10 | 0.180.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-4C (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.150.10 | 0.250.10 | (0.50) | 0.300.10 |
Reliability Test Items
Electrical Performance Test:
| Item | Conditions | Specifications |
| Temperature Coefficient of Resistance | TCR = (R2-R1) / R1(T2-T1) 10 R1: Measured resistance at room temperature () R2: Measured resistance at -55 or +125 () T1: Room temperature () T2: -55 or +125 (). According to JIS-C5201-1 4.8 | Reference 3. Specification Table |
| Short Time Overload | Apply 2.5 times rated voltage for 5 seconds, rest for 30 minutes, then measure resistance change rate. (Rated voltage values refer to 3. Specification Table) According to JIS-C5201-1 4.13 | 0.5%, 1%: R=1.0% 5%: R=2.0% |
| Insulation Resistance Test | Apply 100 VDC between electrodes for 1 minute, measure insulation resistance between electrodes and protective layer, and electrodes and substrate. According to JIS-C5201-1 4.6 | 10 |
| Dielectric Withstand Voltage | Apply 300 VAC for 1 minute between electrodes. According to JIS-C5201-1 4.7 | No short circuit or burnout. |
| Intermittent Overload | Place in a constant temperature oven, apply 2.5 times rated voltage, 1 sec ON, 25 sec OFF, for 10,000 cycles. Rest for 60 minutes, then measure resistance change. According to JIS-C5201-1 4.13 | R=5.0% |
Mechanical Performance Test:
| Item | Conditions | Specifications |
| Resistance to Solvent | Immerse in 20~25 Isopropyl alcohol for 50.5 minutes, dry for 48 hrs, then measure resistance change rate. According to JIS-C5201-1 4.29 | R=0.5% |
| Solderability | Pre-treatment: Ageing in PCT at 105, 100% RH, 1.2210 pa for 4 hours. Cool to room temperature for 2 hours. Test Method: Solder pot test, immerse in 2355 solder for 20.5 seconds. Observe solder coverage under microscope. According to JIS-C5201-1 4.17 | Conductor solder coverage should be greater than 95%. |
| Resistance to Soldering Heat | Test Item 1 (Solder pot test): Immerse in 260+5/-0 solder pot for 10 seconds +1/-0. Rest for 60 minutes, then measure resistance change rate. Test Item 2 (Solder pot test): Immerse in 260+5/-0 solder pot for 30 seconds +1/-0. Clean, then observe solder coverage under microscope. According to JIS-C5201-1 4.18 | Test Item 1: (1) Resistance change rate R%=1.0% Test Item 2: (1) Conductor solder coverage should be greater than 95%. (2) No underlying material (e.g., white substrate) should be visible at the electrode edges. |
| Joint Strength of Solder | Bending test: Solder chip resistor onto bending test board, apply force at the center of the board. Measure resistance change rate under load. Depression depth (D): D=5mm. According to JIS-C5201-1 4.33 | R%=1.0% |
Environmental Test:
| Item | Conditions | Specifications |
| Resistance to Dry Heat | Place in 1555 oven for 10004 hr. Cool for 1 hr, then measure resistance change rate. According to JIS-C5201-1 4.25 | 0.5%, 1%: R=1.0% 5%: R=2.0% |
| Thermal Shock | Place in thermal shock chamber: -55 for 15 min, +125 for 15 min, repeat for 300 cycles. Cool for 60 min, then measure resistance change rate. Test Conditions: Min Temp -555, Max Temp 1255, Temperature dwell time 15 min. According to MIL-STD 202 Method 107 | R=1.0% |
| Moisture Load Test | Place in constant temperature and humidity chamber at 402, 90~95% RH. Apply rated voltage, 90 min ON, 30 min OFF, for 1,000 hr. Cool for 60 min, then measure resistance change rate. According to JIS-C5201-1 4.24 | 0.5%, 1%: R=2.0% 5%: R=3.0% |
| Load Life | Place in 702 oven, apply rated voltage, 90 min ON, 30 min OFF, for 1,000 hrs. Cool for 60 min, then measure resistance change rate. According to JIS-C5201-1 4.25 | 0.5%, 1%: R=2.0% 5%: R=3.0% |
Plating Thickness
- Nickel Layer (Ni) Thickness: 2m
- Pure Tin Layer (Tin): 3m
- Plating is matte tin.
Technical Application Notes
Recommended Soldering Conditions:
- Lead Free IR-Reflow Soldering Profile (Compliant with J-STD-020): Component max temperature resistance 260+5/-0, 10 seconds.
- Soldering Iron Method: 35010 within 3 seconds.
Recommended Land Pattern Design (For Reflow Soldering):
| Type | A | B | P | Q1 | Q2 |
| RTA02-2D | 0.50 | 2.00 | 0.67 | 0.33 | 0.34 |
| RTA02-4D | 0.50 | 2.00 | 0.50 | 0.28 | 0.22 |
| RTA02-8D | 1.00 | 2.60 | 0.50 | 0.25 | 0.25 |
| RTA03-2D | 1.00 | 2.60 | 0.80 | 0.40 | 0.40 |
| RTA03-4D | 1.00 | 2.60 | 0.80 | 0.40 | 0.40 |
| RTA02-2C | 0.50 | 2.00 | 0.50 | 0.28 | 0.22 |
| RTA02-4C | 0.50 | 2.00 | 0.50 | 0.28 | 0.22 |
Usage Environment Precautions: This product is for general electronic applications. RALEC is not responsible for any damages, costs, or losses incurred due to the use of this product in special environments. Confirmation with RALEC is required for other applications. If intended for special environments or conditions (including but not limited to high temperature/humidity, corrosive atmospheres like sea breeze, Cl2, H2S, NH3, SO2, NO2; use in unverified liquids; sealing or coating with unverified resins; cleaning with water-soluble detergents after soldering), product characteristics and reliability must be individually approved.
Transient Overload Precautions: This product may lose functionality due to transient overload. Be mindful of manufacturing processes and storage to avoid transient currents exceeding product specifications.
Handling and Operation Precautions:
- Ensure resistor edges and protective layers are free from mechanical stress damage during operation.
- Handle printed circuit boards (PCBs) with care when separating or fixing them to support structures, as PCB bending can cause mechanical stress on resistors.
- Resistors must be used within their rated power range. Exceeding rated power can lead to temperature rise and equipment damage.
- If resistors are likely to experience significant load (pulse) impacts, the operating environment must be set up before use. Evaluate and confirm in your actual implementation, and ensure system safety with fail-safe design.
Storage and Handling Conditions
- Storage environment: 255, 6015% RH. Valid for two years.
- Avoid harsh environments such as sea breeze, corrosive gases (Cl2, H2S, NH3, SO2, NO2), direct sunlight, and condensation.
- Ensure correct box orientation during handling and storage. Do not drop or squeeze boxes to prevent damage to electrodes or the body.
Labeling for Electronic Information Products (for export to Mainland China)
- Environmental Protection Mark for Electronic Information Products
- Packaging Recycling Mark
2411221110_RALEC-RTA03-4D680JTP_C458667.pdf
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