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Specifications
Number of Resistors:
4
Number of Pins:
8
Tolerance:
±5%
Resistance:
47Ω
Power(Watts):
62.5mW
Temperature Coefficient:
±200ppm/℃
Mfr. Part #:
RTA02-4D470JTH
Package:
0402x4
Key Attributes
Model Number:
RTA02-4D470JTH
Product Description
RTA Series Thick Film Array Chip Resistors
The RTA series resistors are lead-free, halogen-free, and RoHS compliant thick film array chip resistors designed for general electronic applications. They offer reliable performance and are suitable for various general-purpose electronic uses.
Product Attributes
- Brand: RALEC
- Certifications: RoHS compliant, Lead-free, Halogen-free
Technical Specifications
| Type | Rated Power (W) | Max. Rated Voltage (V) | Max. Overload Voltage (V) | T.C.R (ppm/) | Resistance Range | Terminals | Resistors | JUMPER (0) Rated Current (A) | JUMPER (0) Resistance (m MAX.) |
|---|---|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1 W | 25V | 50V | 300 (1R<10), 200 (10R10M) | 1R<10, 10R10M | 4 | 2 | 1A | 25m MAX. |
| RTA02-4D (0402) | 1 W | 25V | 50V | 300 (1R<10), 200 (10R10M) | 1R<10, 10R10M | 8 | 4 | 1A | 25m MAX. |
| RTA02-8D (0402) | 1 W | 25V | 50V | 250 (10R10M) | 10R10M | 16 | 8 | 1A | 50m MAX. |
| RTA03-2D (0603) | 1 W | 50V | 100V | 200 (10R10M) | 10R10M | 4 | 2 | 1A | 50m MAX. |
| RTA03-4D (0603) | 1 W | 50V | 100V | 200 (22R470K), 200 (1R10M) | 22R470K, 1R10M | 8 | 4 | 1A | 25m MAX. |
| RTA02-2C (0402) | 1 W | 25V | 50V | 650 (3R10), 200 (10R<1M) | 3R10, 10R<1M | 4 | 2 | 1A | 50m MAX. |
| RTA02-4C (0402) | 1 W | 25V | 50V | 400 (1R<10), 200 (10R1M) | 1R<10, 10R1M | 8 | 4 | 1A | 50m MAX. |
Operating Temperature Range: -55 ~ +155
Power Derating: Power can be derated according to the curve when ambient temperature exceeds 70 to 155.
Rated Voltage/Current Calculation:
- For resistance 1: E=(RP) (E=Rated Voltage, R=Nominal Resistance, P=Rated Power)
- For resistance =0: I=(P/R) (I=Rated Current, P=Rated Power, R=Nominal Resistance)
Dimensions (mm)
| Type | L | W | H | L1 | L2 | P | Q |
|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1.000.10 | 1.000.10 | 0.300.05 | 0.150.10 | 0.250.10 | (0.67) | 0.330.10 |
| RTA02-4D (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.200.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-8D (0402) | 4.000.20 | 1.600.10 | 0.400.10 | 0.300.15 | 0.300.10 | (0.50) | 0.250.10 |
| RTA03-2D (0603) | 1.600.15 | 1.600.15 | 0.450.10 | 0.300.15 | 0.300.15 | (0.80) | 0.600.10 |
| RTA03-4D (0603) | 3.200.20 | 1.600.15 | 0.500.10 | 0.300.15 | 0.300.15 | (0.80) | 0.500.10 |
| RTA02-2C (0402) | 1.000.10 | 1.000.10 | 0.300.10 | 0.180.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-4C (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.150.10 | 0.250.10 | (0.50) | 0.300.10 |
Structure Diagram
D (Convex) Type: 1. Ceramic substrate, 2. 2nd Protective coating, 3. Bottom inner electrode, 4. Top inner electrode, 5. Resistive layer, 6. 1st Protective coating, 7. Ni plating, 8. Sn plating, 9. Terminal inner electrode, 10. Marking
C (Concave) Type: 1. Ceramic substrate, 2. 2nd Protective coating, 3. Bottom inner electrode, 4. Top inner electrode, 5. Resistive layer, 6. 1st Protective coating, 7. Ni plating, 8. Sn plating, 9. Terminal inner electrode, 10. Marking
Reliability Test Items
Electrical Performance Test
| Item | Conditions | Specifications |
|---|---|---|
| Temperature Coefficient of Resistance (TCR) | (R2-R1) / [R1(T2-T1)] 106 R1: Resistance at room temp. R2: Resistance at -55 or +125. T1: Room temp. T2: -55 or +125. Ref: JIS-C5201-1 4.8 | Refer to 3. Specification Table |
| Short Time Overload | Apply 2.5 times rated voltage for 5 sec, rest 30 min, then measure resistance change. Ref: JIS-C5201-1 4.13 | 0.5%, 1%: R=1.0%; 5%: R=2.0% |
| Insulation Resistance | Apply 100 VDC for 1 min between electrodes and protective layer/substrate. Ref: JIS-C5201-1 4.6 | 109 |
| Dielectric Withstand Voltage | Apply 300 VAC for 1 min between electrodes. Ref: JIS-C5201-1 4.7 | No short circuit or burning. |
| Intermittent Overload | In oven, 2.5x rated voltage, 1 sec ON, 25 sec OFF, 10,000 cycles. Rest 60 min, measure resistance change. Ref: JIS-C5201-1 4.13 | R=5.0% |
Mechanical Performance Test
| Item | Conditions | Specifications |
|---|---|---|
| Resistance to Solvent | Immerse in Isopropyl alcohol (20~25) for 50.5 min, rest 48 hrs, measure resistance change. Ref: JIS-C5201-1 4.29 | R=0.5% |
| Solderability | Pre-treatment: 4 hrs aging at 105, 100% RH, 1.22105 pa. Test: Immerse in 2355 solder bath for 20.5 sec. Observe solder coverage. Ref: JIS-C5201-1 4.17 | Conductor tinning area >95%. |
| Resistance to Soldering Heat | Test 1: Immerse in 260+5/-0 solder bath for 10 sec+1/-0, rest 60 min, measure resistance change. Test 2: Immerse in 260+5/-0 solder bath for 30 sec+1/-0, clean, observe solder coverage. Ref: JIS-C5201-1 4.18 | Test 1: R%=1.0%. Test 2: Tinning area >95%, no underlying material visible at electrode edge. |
| Joint Strength of Solder (Flexibility Test) | Solder to flex test board, apply downward force (D=5mm) at center, measure resistance change. Ref: JIS-C5201-1 4.33 | R%=1.0% |
Environmental Test
| Item | Conditions | Specifications |
|---|---|---|
| Resistance to Dry Heat | In oven at 1555 for 10004 hr, rest 1 hr, measure resistance change. Ref: JIS-C5201-1 4.25 | 0.5%, 1%: R=1.0%; 5%: R=2.0% |
| Thermal Shock | -55 (15 min) to +125 (15 min), 300 cycles. Rest 60 min, measure resistance change. Ref: MIL-STD 202 Method 107 | R=1.0% |
| Moisture Load | 402, 90~95% RH. Rated voltage applied, 90 min ON, 30 min OFF, 1,000 hr. Rest 60 min, measure resistance change. Ref: JIS-C5201-1 4.24 | 0.5%, 1%: R=2.0%; 5%: R=3.0% |
| Load Life | 702 oven. Rated voltage applied, 90 min ON, 30 min OFF, 1,000 hr. Rest 60 min, measure resistance change. Ref: JIS-C5201-1 4.25 | 0.5%, 1%: R=2.0%; 5%: R=3.0% |
Plating Thickness
- Nickel Layer (Ni): 2m
- Pure Tin Layer (Sn): 3m (Matte tin)
Technical Application Notes
- Recommended Soldering Conditions:
- Lead Free IR-Reflow Soldering Profile (Complies with J-STD-020): Max component temp 260+5/-0, 10 sec.
- Soldering Iron Method: 35010 within 3 sec.
- Recommended Land Pattern Design (For Reflow Soldering): Resistance value may vary slightly based on solder area and amount. Consider potential resistance decrease or increase during circuit design.
- Usage Environment Precautions: This product is for general electronic use. RALEC is not responsible for damages, costs, or losses due to use in special environments. Confirmation with RALEC is required for other applications. Special environments include (but are not limited to): high temperature/humidity, corrosive gases (Cl2, H2S, NH3, SO2, NO2), unverified liquids, unverified sealing/coating materials, and cleaning with water-soluble detergents after soldering (cleaning is recommended even with no-clean flux).
- Transient Overload Precautions: Transient overloads may cause loss of function. Avoid applying transient currents higher than product specifications during manufacturing and storage.
- Handling and Processing Precautions: Ensure resistor edges and protective layers are free from mechanical stress damage. Handle PCBs carefully to avoid mechanical stress on resistors from board bending. Operate within rated power limits; exceeding limits can cause damage due to temperature rise. Set operating environment if resistors will experience significant pulse load impacts. Evaluate and confirm in your actual application, ensuring fail-safe design for system safety.
Storage and Handling Conditions
- Storage: 2 years under 255, 6015% RH.
- Avoid adverse environments: sea breeze, corrosive gases (Cl2, H2S, NH3, SO2, NO2), direct sunlight, condensation.
- Handle and store with correct box orientation. Avoid dropping or squeezing to prevent damage to electrodes or body.
Marking (for export to Mainland China)
- Electronic Information Product Pollution Control Mark
- Packaging Recycling Mark
2411221110_RALEC-RTA02-4D470JTH_C102637.pdf
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