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quality Thick Film Array Chip Resistors RALEC RTA03-4D302JTP Lead Free Halogen Free RoHS Compliant Electronic Components factory
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quality Thick Film Array Chip Resistors RALEC RTA03-4D302JTP Lead Free Halogen Free RoHS Compliant Electronic Components factory
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Specifications
Number of Resistors:
4
Number of Pins:
8
Tolerance:
±5%
Resistance:
3kΩ
Power(Watts):
62.5mW
Temperature Coefficient:
±200ppm/℃
Mfr. Part #:
RTA03-4D302JTP
Package:
0603x4
Key Attributes
Model Number: RTA03-4D302JTP
Product Description

RTA Series Thick Film Array Chip Resistors

The RTA series thick film array chip resistors are lead-free, halogen-free, and RoHS compliant, designed for general electronic applications. They offer a robust solution with various configurations for diverse circuit needs.

Product Attributes

  • Brand: RALEC
  • Certifications: RoHS compliant, Lead-free, Halogen-free
  • Material: Thick film resistive layer on ceramic substrate

Technical Specifications

Type Rated Power (W) Max. Rated Voltage (V) Max. Overload Voltage (V) T.C.R (ppm/) Resistance Range () Terminals Resistors JUMPER (0) Rated Current (A) JUMPER (0) Resistance (m MAX.)
RTA02-2D (0402) 1 25 50 300 (1R<10), 200 (10R10M) 1R<10, 10R10M 4 2 1 25
RTA02-4D (0402) 1 25 50 300 (1R<10), 200 (10R10M) 1R<10, 10R10M 8 4 1 25
RTA02-8D (0402) 1 25 50 250 (10R10M) 10R10M 16 8 - 50
RTA03-2D (0603) 1 50 100 200 (10R10M) 10R10M 4 2 - 50
RTA03-4D (0603) 1 50 100 200 (22R470K), 200 (1R10M) 22R470K, 1R10M 8 4 1 25
RTA02-2C (0402) 1 25 50 650 (3R10), 200 (10R<1M) 3R10, 10R1M 4 2 - 50
RTA02-4C (0402) 1 25 50 400 (1R<10), 200 (10R1M) 1R<10, 10R1M 8 4 - 50

Dimensions (mm)

Type L W H L1 L2 P Q
RTA02-2D (0402) 1.000.10 1.000.10 0.300.05 0.150.10 0.250.10 (0.67) 0.330.10
RTA02-4D (0402) 2.000.10 1.000.10 0.400.10 0.200.10 0.250.10 (0.50) 0.300.10
RTA02-8D (0402) 4.000.20 1.600.10 0.400.10 0.300.15 0.300.10 (0.50) 0.250.10
RTA03-2D (0603) 1.600.15 1.600.15 0.450.10 0.300.15 0.300.15 (0.80) 0.600.10
RTA03-4D (0603) 3.200.20 1.600.15 0.500.10 0.300.15 0.300.15 (0.80) 0.500.10
RTA02-2C (0402) 1.000.10 1.000.10 0.300.10 0.180.10 0.250.10 (0.50) 0.300.10
RTA02-4C (0402) 2.000.10 1.000.10 0.400.10 0.150.10 0.250.10 (0.50) 0.300.10

Structure Diagram

See attached images for D(Convex) Type and C(Concave) Type structure diagrams.

Reliability Test Items

Electrical Performance Test

Item Conditions Specifications
Temperature Coefficient of Resistance (TCR) According to JIS-C5201-1 4.8 Refer to 3. Specification Table
Short Time Overload Apply 2.5 times rated voltage for 5 seconds, rest for 30 mins. 0.5%, 1%: R=1.0%; 5%: R=2.0%
Insulation Resistance Test Apply 100 VDC for 1 minute between electrodes and protective layer/substrate. 109
Dielectric Withstand Voltage Apply 300 VAC for 1 minute between electrodes. No short circuit or burnout.
Intermittent Overload 1 sec ON, 25 sec OFF, 10,000 cycles. R=5.0%

Mechanical Performance Test

Item Conditions Specifications
Resistance to Solvent Immerse in Isopropyl alcohol (20-25) for 50.5 mins. R=0.5%
Solderability Pre-treatment: 4 hours aging at 105, 100% RH, 1.22105 pa. Test: Dip in 2355 solder for 20.5 seconds. Soldered area > 95%.
Resistance to Soldering Heat Test 1: Dip in 260+5/-0 solder for 10+1/-0 sec. Test 2: Dip in 260+5/-0 solder for 30+1/-0 sec. Test 1: R%=1.0%. Test 2: Soldered area > 95%, no underlying material visible at electrode edge.
Joint Strength of Solder (Bending Test) Apply force to the center of the test board (D=5mm). R%=1.0%

Environmental Test

Item Conditions Specifications
Resistance to Dry Heat 1555 for 10004 hr. 0.5%, 1%: R=1.0%; 5%: R=2.0%
Thermal Shock -55 (15 min) to +125 (15 min), 300 cycles. R=1.0%
Moisture Load Test 402, 90-95% RH, Rated voltage applied, 90 min ON, 30 min OFF, 1,000 hr. 0.5%, 1%: R=2.0%; 5%: R=3.0%
Load Life 702, Rated voltage applied, 90 min ON, 30 min OFF, 1,000 hr. 0.5%, 1%: R=2.0%; 5%: R=3.0%

Plating Thickness

  • Nickel Layer (Ni): 2m
  • Pure Tin Layer (Sn): 3m (Matte tin)

Technical Application Notes

  • Recommended Soldering Conditions: Lead Free IR-Reflow Soldering Profile (J-STD-020 compliant), Max temperature 260+5/-0 for 10 sec. Soldering Iron: 35010 within 3 seconds.
  • Recommended Land Pattern Design for Reflow Soldering is provided for various types.
  • Environmental Considerations: Product is for general electronic use. RALEC is not responsible for damages in special environments. Confirmation required for high temperature/humidity, corrosive gas environments (Cl2, H2S, NH3, SO2, NO2), non-verified liquids, or non-verified sealing/coating materials. Cleaning after soldering is recommended, even with no-clean flux.
  • Transient Overload: Be aware of potential functional loss due to transient overloads.
  • Handling and Operation: Avoid mechanical stress on resistor edges and protective layers. Be cautious of PCB bending during assembly. Operate within rated power limits. Consider pulsed load impacts. Evaluate and confirm in actual application for fail-safe design.

Storage and Handling Conditions

  • Storage: 255, 6015% RH for two years. Avoid corrosive environments (sea breeze, Cl2, H2S, NH3, SO2, NO2), direct sunlight, and condensation.
  • Handling: Ensure correct box orientation. Avoid dropping or crushing boxes to prevent damage to electrodes or the body.

Marking

Outer boxes are marked with Electronic Information Product Pollution Control Mark and Packaging Recycling Mark (for export to mainland China).

Disclaimer

RALEC disclaims liability for any errors or omissions in product information and reserves the right to make changes without notice. RALEC makes no warranties regarding fitness for a particular purpose or continued production. RALEC is not liable for any damages arising from the use of its products. Products are defined for general electronic use and not for automotive, medical life support, or applications where failure could cause injury. Technical advice is provided free of charge and at the buyer's risk.


2411221110_RALEC-RTA03-4D302JTP_C102662.pdf

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