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quality Lead Free Halogen Free RALEC RTA02-2D150JTH RoHS Compliant Thick Film Chip Resistor Arrays for Electronics factory
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quality Lead Free Halogen Free RALEC RTA02-2D150JTH RoHS Compliant Thick Film Chip Resistor Arrays for Electronics factory
>
Specifications
Number of Resistors:
2
Number of Pins:
4
Tolerance:
±5%
Resistance:
15Ω
Power(Watts):
62.5mW
Temperature Coefficient:
±200ppm/℃
Mfr. Part #:
RTA02-2D150JTH
Package:
0402x2
Key Attributes
Model Number: RTA02-2D150JTH
Product Description

RTA Series Thick Film Chip Resistor Arrays

The RTA series resistors are lead-free, halogen-free, RoHS compliant thick film chip resistor arrays designed for general electronic applications. They offer reliability and performance suitable for a wide range of general electronic uses.

Product Attributes

  • Brand: RALEC
  • Certifications: RoHS compliant, Lead-free, Halogen-free

Technical Specifications

Type Rated Power Max. Rated Voltage Max. Overload Voltage T.C.R (ppm/) Resistance Range Number of Terminals Number of Resistors Rated Current (JUMPER 0) Max. Resistance (JUMPER 0)
RTA02-2D (0402) 1W 25V 50V 300 1R<10 (D:0.5%)
10R10M (D:0.5%)
1R<10 (F:1%)
10R10M (F:1%)
1R10M (J:5%)
10R10M (J:5%)
4 2 1A 25m MAX.
RTA02-4D (0402) 1W 25V 50V 300 1R<10 (D:0.5%)
10R10M (D:0.5%)
1R<10 (F:1%)
10R10M (F:1%)
1R10M (J:5%)
10R10M (J:5%)
8 4 1A 25m MAX.
RTA02-8D (0402) 1W 25V 50V 250 10R10M (D:0.5%)
1R10M (F:1%)
1R10M (J:5%)
16 8 1A 50m MAX.
RTA03-2D (0603) 1W 50V 100V 200 10R10M (D:0.5%)
1R10M (F:1%)
1R10M (J:5%)
4 2 1A 50m MAX.
RTA03-4D (0603) 1W 50V 100V 200 22R470K (D:0.5%)
1R10M (F:1%)
1R10M (J:5%)
8 4 1A 25m MAX.
RTA02-2C (0402) 1W 25V 50V 650 3R10 (D:0.5%)
10R<1M (D:0.5%)
3R<10 (F:1%)
10R1M (F:1%)
10R<1M (J:5%)
10R1M (J:5%)
4 2 1A 50m MAX.
RTA02-4C (0402) 1W 25V 50V 400 1R<10 (D:0.5%)
10R1M (D:0.5%)
1R<10 (F:1%)
10R1M (F:1%)
10R1M (J:5%)
10R1M (J:5%)
8 4 1A 50m MAX.

Dimensions (mm)

Type L W H L1 L2 P Q
RTA02-2D (0402) 1.000.10 1.000.10 0.300.05 0.150.10 0.250.10 (0.67) 0.330.10
RTA02-4D (0402) 2.000.10 1.000.10 0.400.10 0.200.10 0.250.10 (0.50) 0.300.10
RTA02-8D (0402) 4.000.20 1.600.10 0.400.10 0.300.15 0.300.10 (0.50) 0.250.10
RTA03-2D (0603) 1.600.15 1.600.15 0.450.10 0.300.15 0.300.15 (0.80) 0.600.10
RTA03-4D (0603) 3.200.20 1.600.15 0.500.10 0.300.15 0.300.15 (0.80) 0.500.10
RTA02-2C (0402) 1.000.10 1.000.10 0.300.10 0.180.10 0.250.10 (0.50) 0.300.10
RTA02-4C (0402) 2.000.10 1.000.10 0.400.10 0.150.10 0.250.10 (0.50) 0.300.10

Structure Diagram

Refer to the provided diagrams for detailed structural components of D (Convex) and C (Concave) types.

Reliability Test Items

Electrical Performance Test

Item Conditions Specifications
Temperature Coefficient of Resistance (TCR) (R2-R1) / (R1(T2-T1)) 10
R1: Resistance at room temperature ()
R2: Resistance at -55 or +125 ()
T1: Room temperature ()
T2: -55 or +125 ()
According to JIS-C5201-1 4.8
Short Time Overload Apply 2.5 times rated voltage for 5 seconds, rest for 30 minutes, then measure resistance change rate. (Rated voltage from Specification Table) 0.5%, 1%: R=1.0%
5%: R=2.0%
Insulation Resistance Test Apply 100 VDC between electrodes for 1 minute. Measure insulation resistance between electrodes and protective layer, and between electrodes and substrate. 10
Dielectric Withstand Voltage Apply 300 VAC for 1 minute between positive and negative electrodes. No short circuit or burn marks.
Intermittent Overload In an oven at constant temperature, apply 2.5 times rated voltage, 1 sec ON, 25 sec OFF, for 10,000 cycles. After resting for 60 minutes, measure resistance change. R=5.0%

Mechanical Performance Test

Item Conditions Specifications
Resistance to Solvent Immerse in 20~25 Isopropyl alcohol for 50.5 minutes, then dry for 48 hrs. Measure resistance change rate. R=0.5%
Solderability Pre-treatment: Ageing in PCT machine at 105, 100% RH, 1.2210 pa for 4 hours. Cool down for 2 hours at room temperature.
Test Method: Solder pot test. Immerse resistor in 2355 solder for 20.5 seconds. Observe solder coverage under microscope.
Conductor solder coverage should be greater than 95%.
Resistance to Soldering Heat Test Item 1 (Solder pot test): Immerse in 260+5/-0 solder pot for 10 sec+1/-0, rest for 60 minutes, then measure resistance change rate.
Test Item 2 (Solder pot test): Immerse in 260+5/-0 solder pot for 30+1/-0 seconds, then clean. Observe solder coverage under microscope.
Test Item 1: R%=1.0%
Test Item 2: Conductor solder coverage >95%. No underlying material visible at electrode edges.
Joint Strength of Solder (Bending Test) Solder resistor onto bending test board. Apply force to the center of the board. Measure resistance change rate under load. Downward depth (D): 5mm R%=1.0%

Environmental Test

Item Conditions Specifications
Resistance to Dry Heat Place in an oven at 1555 for 10004 hrs. Rest for 1 hr. Measure resistance change rate. 0.5%, 1%: R=1.0%
5%: R=2.0%
Thermal Shock Place in thermal shock chamber: -55 for 15 min, +125 for 15 min. Repeat for 300 cycles. Rest for 60 min. Measure resistance change rate. R=1.0%
Moisture Load Test Place in constant temperature and humidity chamber at 402, 90~95% RH. Apply rated voltage, 90 min ON, 30 min OFF, for 1,000 hrs. Rest for 60 min. Measure resistance change rate. 0.5%, 1%: R=2.0%
5%: R=3.0%
Load Life Place in an oven at 702. Apply rated voltage, 90 min ON, 30 min OFF, for 1,000 hrs. Rest for 60 min. Measure resistance change rate. 0.5%, 1%: R=2.0%
5%: R=3.0%

Plating Thickness

  • Nickel Layer (Ni): 2m
  • Pure Tin Layer (Sn): 3m (Matte tin)

Technical Application Notes

Recommended Soldering Conditions

  • Lead Free IR-Reflow Soldering Profile (Complies with J-STD-020): Max component temperature 260+5/-0 for 10 seconds.
  • Soldering Iron Method: Within 3 seconds at 35010.

Recommended Land Pattern Design (For Reflow Soldering)

Refer to diagrams for specific land pattern dimensions (A, B, P, Q1, Q2) for different RTA types.

Usage Environment Precautions

These products are for general electronic use. RALEC is not responsible for damages, costs, or losses incurred due to the use of these products in special environments. Confirmation with RALEC is required for other applications. Special environments include, but are not limited to: high temperature/humidity, corrosive gases (Cl2, H2S, NH3, SO2, NO2), non-verified liquids, sealing/coating with non-verified resins, and cleaning with water-soluble detergents after soldering (cleaning is recommended even with no-clean flux).

Transient Overload Precautions

Transient overloads may cause loss of function. Ensure manufacturing processes and storage prevent transient currents exceeding product specifications.

Handling and Processing Precautions

  • Avoid mechanical stress on resistor edges and protective layers.
  • Handle PCBs carefully during separation or support fixation to prevent mechanical stress on resistors due to PCB bending.
  • Operate within rated power limits. Exceeding rated power may cause damage due to temperature rise.
  • Set operating environment before applying significant load (pulse) impacts.

Evaluate and confirm in your actual application, and ensure fail-safe design for system safety.

Storage and Handling Conditions

  • Storage: 2 years under 255, 6015% RH.
  • Avoid harsh environments: sea wind, corrosive gases (Cl2, H2S, NH3, SO2, NO2), direct sunlight, condensation.
  • Maintain correct box orientation during handling and storage. Avoid dropping or crushing boxes to prevent damage to electrodes or the body.

Marking

Outer boxes for export to mainland China will be marked with the Electronic Information Product Pollution Control Mark and the Packaging Recycling Mark.

Attachments

  • Document Revision Record Table (QA-QR-027)

Legal Disclaimer

RALEC and its distributors/agents (collectively, "RALEC") assume no liability for any errors, inaccuracies, or incompleteness in product information (including specifications, data, images, and diagrams). RALEC may change or improve product information without notice. RALEC makes no commitment, warranty, or guarantee regarding the suitability of its products for special purposes or the continuous production of any product. To the maximum extent permitted by law, RALEC is not liable for: (i) any liability arising from the application or use of any RALEC product; (ii) any profit loss or direct, indirect, special, punitive, consequential, or incidental damages caused by or related to RALEC products; and (iii) any implied warranties, including fitness for a particular purpose, non-infringement, and merchantability. This product is defined for general electronic use and is not suitable for automotive electronics, medical life-support or life-sustaining equipment, or any application where failure of a RALEC product could cause injury or death. Any technical advice provided by RALEC for product application is free of charge, and RALEC assumes no obligation or liability for the results obtained. The buyer assumes all risks associated with adopting such advice. The buyer assumes all risks and liabilities arising from the use of RALEC products in combination with other materials or raw materials, or in any process, regardless of any oral or written technical explanation, advice, or other guidance provided by RALEC. The information provided is for product specification illustration only. RALEC reserves the right to modify this content without notice when products are not changed. Any product changes will be announced by ECN.


2411221110_RALEC-RTA02-2D150JTH_C881760.pdf

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