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Specifications
Number of Resistors:
4
Number of Pins:
8
Tolerance:
±5%
Resistance:
510Ω
Power(Watts):
62.5mW
Temperature Coefficient:
±200ppm/℃
Mfr. Part #:
RTA02-4D511JTH
Package:
0402x4
Key Attributes
Model Number:
RTA02-4D511JTH
Product Description
RTA Series Thick Film Array Chip Resistors
The RTA series resistors are lead-free, halogen-free, and RoHS compliant thick film array chip resistors designed for general electronic applications. They offer reliable performance and are suitable for various general electronic purposes.
Product Attributes
- Brand: RALEC
- Certifications: RoHS compliant, Lead-free, Halogen-free
Technical Specifications
| Type | Rated Power | Max. Rated Voltage | Max. Overload Voltage | T.C.R (ppm/) | Resistance Range | Number of Terminals | Number of Resistors | JUMPER (0) Rated Current | JUMPER (0) Resistance Max. |
|---|---|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1W | 25V | 50V | ±300 (1≥R<10), ±200 (10≥R≥10M) | 1≥R<10 (D:±0.5%, F:±1%), 10≥R≥10M (D:±0.5%, F:±1%, J:±5%) | 4 | 2 | 1A | 25m MAX. |
| RTA02-4D (0402) | 1W | 25V | 50V | ±300 (1≥R<10), ±200 (10≥R≥10M) | 1≥R<10 (D:±0.5%, F:±1%), 10≥R≥10M (D:±0.5%, F:±1%, J:±5%) | 8 | 4 | 1A | 25m MAX. |
| RTA02-8D (0402) | 1W | 25V | 50V | ±250 (10≥R≥10M) | 10≥R≥10M (D:±0.5%), 1≥R≥10M (F:±1%, J:±5%) | 16 | 8 | 1A | 50m MAX. |
| RTA03-2D (0603) | 1W | 50V | 100V | ±200 (10≥R≥10M) | 10≥R≥10M (D:±0.5%), 1≥R≥10M (F:±1%, J:±5%) | 4 | 2 | 1A | 50m MAX. |
| RTA03-4D (0603) | 1W | 50V | 100V | ±200 (22≥R≥470K) | 1≥R≥10M (D:±0.5%, F:±1%, J:±5%) | 8 | 4 | 1A | 25m MAX. |
| RTA02-2C (0402) | 1W | 25V | 50V | ±650 (3≥R≥10), ±200 (10≥R<1M) | 3≥R≥10 (D:±0.5%, F:±1%), 10≥R<1M (D:±0.5%, F:±1%, J:±5%) | 4 | 2 | 1A | 50m MAX. |
| RTA02-4C (0402) | 1W | 25V | 50V | ±400 (1≥R<10), ±200 (10≥R≥1M) | 1≥R<10 (D:±0.5%, F:±1%), 10≥R≥1M (D:±0.5%, F:±1%, J:±5%) | 8 | 4 | 1A | 50m MAX. |
Operating Temperature Range: -55 ~ +155
Power Derating Curve: Power can be adjusted according to the curve when ambient temperature exceeds 70 to 155.
Rated Voltage or Rated Current Calculation:
- For resistance values (1): E=(RP), where E is rated voltage, R is nominal resistance, P is rated power. If calculated value exceeds max rated voltage, use max rated voltage.
- For 0 values: I=(P/R), where I is rated current, P is rated power, R is nominal resistance. If calculated value exceeds max rated current, use max rated current.
Dimensions (mm)
| Type | L | W | H | L1 | L2 | P | Q |
|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1.00±0.10 | 1.00±0.10 | 0.30±0.05 | 0.15±0.10 | 0.25±0.10 | (0.67) | 0.33±0.10 |
| RTA02-4D (0402) | 2.00±0.10 | 1.00±0.10 | 0.40±0.10 | 0.20±0.10 | 0.25±0.10 | (0.50) | 0.30±0.10 |
| RTA02-8D (0402) | 4.00±0.20 | 1.60±0.10 | 0.40±0.10 | 0.30±0.15 | 0.30±0.10 | (0.50) | 0.25±0.10 |
| RTA03-2D (0603) | 1.60±0.15 | 1.60±0.15 | 0.45±0.10 | 0.30±0.15 | 0.30±0.15 | (0.80) | 0.60±0.10 |
| RTA03-4D (0603) | 3.20±0.20 | 1.60±0.15 | 0.50±0.10 | 0.30±0.15 | 0.30±0.15 | (0.80) | 0.50±0.10 |
| RTA02-2C (0402) | 1.00±0.10 | 1.00±0.10 | 0.30±0.10 | 0.18±0.10 | 0.25±0.10 | (0.50) | 0.30±0.10 |
| RTA02-4C (0402) | 2.00±0.10 | 1.00±0.10 | 0.40±0.10 | 0.15±0.10 | 0.25±0.10 | (0.50) | 0.30±0.10 |
Structure Diagram
D (Convex) Type: 1. Ceramic substrate, 2. 2nd Protective coating, 3. Bottom inner electrode, 4. Top inner electrode, 5. Terminal inner electrode, 6. Resistive layer, 7. 1st Protective coating, 8. Ni plating, 9. Sn plating, 10. Marking
C (Concave) Type: 1. Ceramic substrate, 2. 2nd Protective coating, 3. Bottom inner electrode, 4. Top inner electrode, 5. Terminal inner electrode, 6. Resistive layer, 7. 1st Protective coating, 8. Ni plating, 9. Sn plating, 10. Marking
Reliability Test Items
Electrical Performance Test
| Item | Conditions | Specifications |
|---|---|---|
| Temperature Coefficient of Resistance (TCR) | (R2-R1) / R1(T2-T1) 10 R1: Resistance at room temp. R2: Resistance at -55 or +125. T1: Room temp. T2: -55 or +125. Ref. JIS-C5201-1 4.8 | Refer to Specification Table |
| Short Time Overload | Apply 2.5 times rated voltage for 5 sec, rest 30 min, measure resistance change. Ref. JIS-C5201-1 4.13 | 0.5%, 1%: △R=±1.0%; 5%: △R=±2.0% |
| Insulation Resistance Test | Apply 100 VDC for 1 min between electrodes and protective layer/substrate. Ref. JIS-C5201-1 4.6 | 10 |
| Dielectric Withstand Voltage | Apply 300 VAC for 1 min between electrodes. Ref. JIS-C5201-1 4.7 | No short circuit or burning |
| Intermittent Overload | 1 sec ON, 25 sec OFF at 2.5 times rated voltage for 10,000 cycles. Rest 60 min, measure resistance change. Ref. JIS-C5201-1 4.13 | △R=±5.0% |
Mechanical Performance Test
| Item | Conditions | Specifications |
|---|---|---|
| Resistance to Solvent | Immerse in Isopropyl alcohol at 20~25 for 5 min, rest 48 hrs, measure resistance change. Ref. JIS-C5201-1 4.29 | △R=±0.5% |
| Solderability | Pre-treatment: 4 hrs aging at 105, 100% RH, 1.2210 pa. Test: Immerse in 235±5 solder bath for 2 sec. Observe solder coverage. Ref. JIS-C5201-1 4.17 | Conductor solder coverage >95% |
| Resistance to Soldering Heat | Test 1: Immerse in 260+5/-0 solder bath for 10 sec, rest 60 min, measure resistance change. Test 2: Immerse in 260+5/-0 solder bath for 30 sec, clean, observe solder coverage. Ref. JIS-C5201-1 4.18 | Test 1: △R=±1.0%. Test 2: Conductor solder coverage >95%. No underlying material visible at electrode edge. |
| Joint Strength of Solder | Bending test: Apply 5mm downward force at center of test board. Measure resistance change. Ref. JIS-C5201-1 4.33 | △R=±1.0% |
Environmental Test
| Item | Conditions | Specifications |
|---|---|---|
| Resistance to Dry Heat | Place in oven at 155±5 for 1000 hr, rest 1 hr, measure resistance change. Ref. JIS-C5201-1 4.25 | 0.5%, 1%: △R=±1.0%; 5%: △R=±2.0% |
| Thermal Shock | -55 for 15 min, +125 for 15 min, 300 cycles. Rest 60 min, measure resistance change. Ref. MIL-STD 202 Method 107 | △R=±1.0% |
| Moisture Load | 40±2, 90-95% RH. 90 min ON, 30 min OFF at rated voltage for 1000 hr. Rest 60 min, measure resistance change. Ref. JIS-C5201-1 4.24 | 0.5%, 1%: △R=±2.0%; 5%: △R=±3.0% |
| Load Life | 70±2 oven. 90 min ON, 30 min OFF at rated voltage for 1000 hr. Rest 60 min, measure resistance change. Ref. JIS-C5201-1 4.25 | 0.5%, 1%: △R=±2.0%; 5%: △R=±3.0% |
Plating Thickness
- Nickel Layer (Ni): 2m
- Pure Tin Layer (Sn): 3m (Matte tin)
Technical Application Notes
- Recommended Soldering Conditions:
- Lead Free IR-Reflow Soldering Profile (J-STD-020): Max temp 260+5/-0, 10 sec.
- Soldering Iron Method: 35010 within 3 seconds.
- Recommended Land Pattern Design (For Reflow Soldering): Design should consider potential resistance value changes due to soldering area and amount.
- Usage Environment Precautions: This product is for general electronic use. RALEC is not responsible for damages in special environments. Consult RALEC for specific applications. Special environments include high temperature/humidity, corrosive gases (Cl2, H2S, NH3, SO2, NO2), unverified liquids, unverified sealing/coating materials, and cleaning with water-soluble detergents (even for no-clean flux).
- Transient Overload Precautions: Avoid transient currents exceeding product specifications during manufacturing and storage.
- Handling and Operation Precautions:
- Protect resistor edges and protective coating from mechanical stress.
- Handle PCBs carefully to avoid bending that can cause mechanical stress on resistors.
- Operate within rated power limits; exceeding limits can cause damage due to temperature rise.
- Set operating environment appropriately for pulsed load conditions.
- Evaluate and confirm in actual application, ensuring fail-safe design for system safety.
Storage and Handling Conditions
- Storage: 2 years under 255, 6015% RH.
- Avoid adverse environments: sea breeze, corrosive gases (Cl2, H2S, NH3, SO2, NO2), direct sunlight, condensation.
- Handle boxes with correct orientation; avoid dropping or squeezing to prevent damage to electrodes or body.
Labeling for Electronic Information Products (for export to China)
- Electronic Information Product Pollution Control Mark
- Packaging Recycling Mark
2411221110_RALEC-RTA02-4D511JTH_C2991338.pdf
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