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Specifications
Number of Resistors:
4
Number of Pins:
8
Tolerance:
±5%
Resistance:
22Ω
Power(Watts):
62.5mW
Temperature Coefficient:
±200ppm/℃
Mfr. Part #:
RTA02-4D220JTH
Package:
0402x4
Key Attributes
Model Number:
RTA02-4D220JTH
Product Description
RTA Series Thick Film Array Chip Resistors
The RTA series resistors are lead-free, halogen-free, and RoHS compliant thick film array chip resistors designed for general electronic applications. They offer reliable performance and are suitable for a wide range of general electronic uses.
Product Attributes
- Brand: RALEC
- Certifications: RoHS compliant, Lead-free, Halogen-free
Technical Specifications
| Type | Rated Power | Max. Rated Voltage | Max. Overload Voltage | T.C.R (ppm/) | Resistance Range () | Number of Terminals | Number of Resistors | JUMPER (0) Rated Current | JUMPER (0) Resistance Max. |
|---|---|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1 W | 25V | 50V | 300 (1R<10), 200 (10R10M) | 1R<10, 10R10M | 4 | 2 | 1A | 25m MAX. |
| RTA02-4D (0402) | 1 W | 25V | 50V | 300 (1R<10), 200 (10R10M) | 1R<10, 10R10M | 8 | 4 | 1A | 25m MAX. |
| RTA02-8D (0402) | 1 W | 25V | 50V | 250 (10R10M) | 10R10M | 16 | 8 | 1A | 50m MAX. |
| RTA03-2D (0603) | 1 W | 50V | 100V | 200 (10R10M) | 10R10M | 4 | 2 | 1A | 50m MAX. |
| RTA03-4D (0603) | 1 W | 50V | 100V | 200 (22R470K), 200 (1R10M) | 22R470K, 1R10M | 8 | 4 | 1A | 25m MAX |
| RTA02-2C (0402) | 1 W | 25V | 50V | 650 (3R10), 200 (10R<1M) | 3R10, 10R1M | 4 | 2 | 1A | 50m MAX. |
| RTA02-4C (0402) | 1 W | 25V | 50V | 400 (1R<10), 200 (10R1M) | 1R<10, 10R1M | 8 | 4 | 1A | 50m MAX. |
Dimensions (mm)
| Type | L | W | H | L1 | L2 | P | Q |
|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1.000.10 | 1.000.10 | 0.300.05 | 0.150.10 | 0.250.10 | (0.67) | 0.330.10 |
| RTA02-4D (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.200.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-8D (0402) | 4.000.20 | 1.600.10 | 0.400.10 | 0.300.15 | 0.300.10 | (0.50) | 0.250.10 |
| RTA03-2D (0603) | 1.600.15 | 1.600.15 | 0.450.10 | 0.300.15 | 0.300.15 | (0.80) | 0.600.10 |
| RTA03-4D (0603) | 3.200.20 | 1.600.15 | 0.500.10 | 0.300.15 | 0.300.15 | (0.80) | 0.500.10 |
| RTA02-2C (0402) | 1.000.10 | 1.000.10 | 0.300.10 | 0.180.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-4C (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.150.10 | 0.250.10 | (0.50) | 0.300.10 |
Reliability Test Items
| Item | Conditions | Specifications |
|---|---|---|
| Temperature Coefficient of Resistance | TCR calculation based on JIS-C5201-1 4.8 | NA |
| Short Time Overload | 2.5x rated voltage for 5 sec, rest 30 min. (Ref. Spec. Table) | 0.5%, 1%: R=1.0%; 5%: R=2.0% |
| Insulation Resistance Test | 100 VDC for 1 min between electrodes and protective layer/substrate. (Ref. JIS-C5201-1 4.6) | 109 |
| Dielectric Withstand Voltage | 300 VAC for 1 min. (Ref. JIS-C5201-1 4.7) | No short or burning. |
| Intermittent Overload | 1 sec ON, 25 sec OFF at 2.5x rated voltage, 10,000 cycles. (Ref. JIS-C5201-1 4.13) | R=5.0% |
| Resistance to Solvent | Immersion in Isopropanol (20-25) for 50.5 min, rest 48 hrs. (Ref. JIS-C5201-1 4.29) | R=0.5% |
| Solderability | Pre-conditioning: 4 hrs at 105/100%RH/1.22105 pa. Test: Immersion in 2355 solder bath for 20.5 sec. (Ref. JIS-C5201-1 4.17) | Soldered area > 95%. |
| Resistance to Soldering Heat | Test 1: Immersion in 260+5/-0 solder bath for 10 sec+1/-0, rest 60 min. Test 2: Immersion in 260+5/-0 solder bath for 30 sec+1/-0, then clean. (Ref. JIS-C5201-1 4.18) | Test 1: R%=1.0%. Test 2: Soldered area > 95%, no underlayer visible at electrode edge. |
| Joint Strength of Solder | Bending test: Apply 5mm downward force at center of test board. (Ref. JIS-C5201-1 4.33) | R%=1.0% |
| Resistance to Dry Heat | 10004 hrs at 1555. (Ref. JIS-C5201-1 4.25) | 0.5%, 1%: R=1.0%; 5%: R=2.0% |
| Thermal Shock | 300 cycles: -55 (15 min) to +125 (15 min). (Ref. MIL-STD 202 Method 107) | R=1.0% |
| Moisture Load Test | 1000 hrs at 402 / 90-95% RH, 90 min ON / 30 min OFF with rated voltage. (Ref. JIS-C5201-1 4.24) | 0.5%, 1%: R=2.0%; 5%: R=3.0% |
| Load Life | 1000 hrs at 702, 90 min ON / 30 min OFF with rated voltage. (Ref. JIS-C5201-1 4.25) | 0.5%, 1%: R=2.0%; 5%: R=3.0% |
Plating Thickness
- Nickel Layer (Ni): 2m
- Pure Tin Layer (Sn): 3m (Matte tin)
Technical Application Notes
Recommended Soldering Conditions:
- Lead Free IR-Reflow Soldering Profile (Compliant with J-STD-020): Max component temperature 260+5/-0 for 10 seconds.
- Soldering Iron Method: Within 3 seconds at 35010.
Recommended Land Pattern Design (For Reflow Soldering):
| Type | A | B | P | Q1 | Q2 |
|---|---|---|---|---|---|
| RTA02-2D | 0.50 | 2.00 | 0.67 | 0.33 | 0.34 |
| RTA02-4D | 0.50 | 2.00 | 0.50 | 0.28 | 0.22 |
| RTA02-8D | 1.00 | 2.60 | 0.50 | 0.25 | 0.25 |
| RTA03-2D | 1.00 | 2.60 | 0.80 | 0.40 | 0.40 |
| RTA03-4D | 1.00 | 2.60 | 0.80 | 0.40 | 0.40 |
| RTA02-2C | 0.50 | 2.00 | 0.50 | 0.28 | 0.22 |
| RTA02-4C | 0.50 | 2.00 | 0.50 | 0.28 | 0.22 |
Environmental Considerations:
- This product is for general electronic use. RALEC is not responsible for damages, costs, or losses resulting from the use of this product in special environments. Confirmation with RALEC is required for other applications.
- Special environments include, but are not limited to: high temperature/humidity, corrosive atmospheres (Cl2, H2S, NH3, SO2, NO2), non-verified liquids, unverified sealing/coating materials, and cleaning with water-soluble detergents after soldering (even for no-clean flux).
Transient Overload Precautions:
- The product may lose functionality due to transient overload. Take care during manufacturing and storage to avoid transient currents exceeding product specifications.
Handling and Operation Precautions:
- Ensure resistor edges and protective layers are free from mechanical stress damage during operation.
- Handle PCBs with care when separating or fixing them to support structures, as PCB bending can cause mechanical stress on the resistors.
- Resistors must be used within their rated power range. Exceeding the rated power can lead to temperature rise and equipment damage.
- If resistors are expected to receive significant pulsed load impacts, the operating environment must be set up before use.
- Evaluate and confirm product usage in your specific application, ensuring fail-safe design for system safety.
Storage and Handling Conditions
- Storage environment: 255, 6015% RH. Shelf life: 2 years.
- Avoid harsh environments such as sea breeze, corrosive gases (Cl2, H2S, NH3, SO2, NO2), direct sunlight, and condensation.
- Maintain correct box orientation during handling and storage. Do not drop or squeeze boxes to prevent damage to electrodes or the body.
Labeling
Outer boxes for export to mainland China will be labeled with the following marks:
- Electronic Information Product Pollution Control Mark
- Packaging Recycling Mark
2411221110_RALEC-RTA02-4D220JTH_C102632.pdf
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