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Specifications
Number of Resistors:
4
Number of Pins:
8
Tolerance:
±5%
Resistance:
4.7kΩ
Power(Watts):
62.5mW
Temperature Coefficient:
±200ppm/℃
Mfr. Part #:
RTA02-4D472JTH
Package:
0402x4
Key Attributes
Model Number:
RTA02-4D472JTH
Product Description
RTA Series Thick Film Array Chip Resistors
The RTA series resistors are lead-free, halogen-free, and RoHS compliant thick film array chip resistors designed for general electronic applications. They offer reliable performance and are suitable for various general-purpose electronic circuits.
Product Attributes
- Brand: RALEC
- Compliance: RoHS, Lead-free, Halogen-free
Technical Specifications
| Type | Rated Power | Max. Rated Voltage | Max. Overload Voltage | T.C.R (ppm/) | Resistance Range | Number of Terminals | Number of Resistors | Rated Current (JUMPER 0) | Max. Resistance (JUMPER 0) |
|---|---|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1W | 25V | 50V | 300 (1R<10), 200 (10R10M) | 1R<10, 10R10M | 4 | 2 | 1A | 25m MAX. |
| RTA02-4D (0402) | 1W | 25V | 50V | 300 (1R<10), 200 (10R10M) | 1R<10, 10R10M | 8 | 4 | 1A | 25m MAX. |
| RTA02-8D (0402) | 1W | 25V | 50V | 250 (10R10M) | 10R10M | 16 | 8 | 1A | 50m MAX. |
| RTA03-2D (0603) | 1W | 50V | 100V | 200 (10R10M) | 10R10M | 4 | 2 | 1A | 50m MAX. |
| RTA03-4D (0603) | 1W | 50V | 100V | 200 (22R470K), 200 (1R10M) | 22R470K, 1R10M | 8 | 4 | 1A | 25m MAX. |
| RTA02-2C (0402) | 1W | 25V | 50V | 650 (3R10), 200 (10R<1M) | 3R10, 10R1M | 4 | 2 | 1A | 50m MAX. |
| RTA02-4C (0402) | 1W | 25V | 50V | 400 (1R<10), 200 (10R1M) | 1R<10, 10R1M | 8 | 4 | 1A | 50m MAX. |
Dimensions (mm)
| Type | L | W | H | L1 | L2 | P | Q |
|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1.000.10 | 1.000.10 | 0.300.05 | 0.150.10 | 0.250.10 | (0.67) | 0.330.10 |
| RTA02-4D (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.200.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-8D (0402) | 4.000.20 | 1.600.10 | 0.400.10 | 0.300.15 | 0.300.10 | (0.50) | 0.250.10 |
| RTA03-2D (0603) | 1.600.15 | 1.600.15 | 0.450.10 | 0.300.15 | 0.300.15 | (0.80) | 0.600.10 |
| RTA03-4D (0603) | 3.200.20 | 1.600.15 | 0.500.10 | 0.300.15 | 0.300.15 | (0.80) | 0.500.10 |
| RTA02-2C (0402) | 1.000.10 | 1.000.10 | 0.300.10 | 0.180.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-4C (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.150.10 | 0.250.10 | (0.50) | 0.300.10 |
Reliability Test Summary
| Item | Conditions | Specifications |
|---|---|---|
| Temperature Coefficient of Resistance | JIS-C5201-1 4.8 | NA |
| Short Time Overload | JIS-C5201-1 4.13 | 0.5%, 1%: R=1.0%; 5%: R=2.0% |
| Insulation Resistance | JIS-C5201-1 4.6 | 109 |
| Dielectric Withstand Voltage | JIS-C5201-1 4.7 | No short circuit or burn-out |
| Intermittent Overload | JIS-C5201-1 4.13 | R=5.0% |
| Resistance to Solvent | JIS-C5201-1 4.29 | R=0.5% |
| Solderability | JIS-C5201-1 4.17 | Soldered area > 95% |
| Resistance to Soldering Heat | JIS-C5201-1 4.18 | Test 1: R%=1.0%; Test 2: Soldered area > 95%, no underlying material visible at electrode edge |
| Joint Strength of Solder | JIS-C5201-1 4.33 | R%=1.0% |
| Resistance to Dry Heat | JIS-C5201-1 4.25 | 0.5%, 1%: R=1.0%; 5%: R=2.0% |
| Thermal Shock | MIL-STD 202 Method 107 | R=1.0% |
| Loading Life in Moisture | JIS-C5201-1 4.24 | 0.5%, 1%: R=2.0%; 5%: R=3.0% |
| Load Life | JIS-C5201-1 4.25 | 0.5%, 1%: R=2.0%; 5%: R=3.0% |
Plating Thickness
- Nickel Layer (Ni): 2m
- Pure Tin Layer (Sn): 3m (Matte Tin)
Technical Application Notes
- Recommended Soldering Conditions: Lead Free IR-Reflow Soldering (J-STD-020 compliant), Max temperature 260+5/-0 for 10 seconds; Soldering Iron: 35010 within 3 seconds.
- Recommended Land Pattern Design for Reflow Soldering is provided.
- Environmental Considerations: Not recommended for use in high temperature/humidity, corrosive environments (sea breeze, Cl2, H2S, NH3, SO2, NO2), unverified liquids, or with unverified sealing/coating materials. Cleaning after soldering is recommended, even with no-clean flux.
- Transient Overload: Be mindful of transient overloads that can cause functional loss.
- Handling and Operation: Avoid mechanical stress on edges and protective layers. Be cautious of PCB bending. Operate within rated power limits. Consider pulse load impacts. Evaluate and confirm in actual application for fail-safe design.
Storage and Handling Conditions
- Storage: 255, 6015% RH for two years.
- Avoid: Harsh environments such as corrosive gases, direct sunlight, condensation.
- Handling: Ensure correct box orientation. Do not drop or crush boxes to prevent damage to electrodes or the body.
2411221110_RALEC-RTA02-4D472JTH_C102638.pdf
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