RTA Series Thick Film Chip Resistor Arrays
The RTA series are lead-free, halogen-free thick film chip resistor arrays that comply with RoHS regulations. These resistors are designed for general electronic applications.
Product Attributes
- Brand: RALEC
- Certifications: RoHS compliant
Technical Specifications
| Type | Rated Power | Max. Rated Voltage | Max. Overload Voltage | T.C.R (ppm/) | Resistance Range () | Number of Terminals | Number of Resistors | Rated Current (JUMPER) | Max. Resistance (JUMPER) |
| RTA02-2D (0402) | 1 W | 25V | 50V | 300 | 1R<10 (D:0.5%), 10R10M (D:0.5%), 1R<10 (F:1%), 10R10M (F:1%), 10R10M (J:5%) | 4 | 2 | 1A | 25m MAX. |
| RTA02-4D (0402) | 1 W | 25V | 50V | 300 | 1R<10 (D:0.5%), 10R10M (D:0.5%), 1R<10 (F:1%), 10R10M (F:1%), 10R10M (J:5%) | 8 | 4 | 1A | 25m MAX. |
| RTA02-8D (0402) | 1 W | 25V | 50V | 250 | 10R10M (D:0.5%), 1R10M (F:1%), 10R10M (J:5%) | 16 | 8 | 1A | 50m MAX. |
| RTA03-2D (0603) | 1 W | 50V | 100V | 200 | 10R10M (D:0.5%), 1R10M (F:1%), 10R10M (J:5%) | 4 | 2 | 1A | 50m MAX. |
| RTA03-4D (0603) | 1 W | 50V | 100V | 200 | 22R470K (D:0.5%), 1R10M (D:0.5%), 1R10M (F:1%), 1R10M (J:5%) | 8 | 4 | 1A | 25m MAX. |
| RTA02-2C (0402) | 1 W | 25V | 50V | 650 | 3R10 (D:0.5%), 3R<10 (F:1%), 10R<1M (F:1%), 10R1M (J:5%) | 4 | 2 | 1A | 50m MAX. |
| RTA02-4C (0402) | 1 W | 25V | 50V | 400 | 1R<10 (D:0.5%), 1R<10 (F:1%), 10R1M (F:1%), 10R1M (J:5%) | 8 | 4 | 1A | 50m MAX. |
Dimensions (mm)
| Type | L | W | H | L1 | L2 | P | Q |
| RTA02-2D (0402) | 1.000.10 | 1.000.10 | 0.300.05 | 0.150.10 | 0.250.10 | (0.67) | 0.330.10 |
| RTA02-4D (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.200.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-8D (0402) | 4.000.20 | 1.600.10 | 0.400.10 | 0.300.15 | 0.300.10 | (0.50) | 0.250.10 |
| RTA03-2D (0603) | 1.600.15 | 1.600.15 | 0.450.10 | 0.300.15 | 0.300.15 | (0.80) | 0.600.10 |
| RTA03-4D (0603) | 3.200.20 | 1.600.15 | 0.500.10 | 0.300.15 | 0.300.15 | (0.80) | 0.500.10 |
| RTA02-2C (0402) | 1.000.10 | 1.000.10 | 0.300.10 | 0.180.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-4C (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.150.10 | 0.250.10 | (0.50) | 0.300.10 |
Structure Diagram
D (Convex) Type
1. Ceramic substrate, 2. 2nd Protective coating, 3. Bottom inner electrode, 4. Top inner electrode, 5. Terminal inner electrode, 6. Resistive layer, 7. 1st Protective coating, 8. Ni plating, 9. Sn plating, 10. Marking
C (Concave) Type
1. Ceramic substrate, 2. 2nd Protective coating, 3. Bottom inner electrode, 4. Top inner electrode, 5. Terminal inner electrode, 6. Resistive layer, 7. 1st Protective coating, 8. Ni plating, 9. Sn plating, 10. Marking
Reliability Test Items
Electrical Performance Test
| Item | Conditions | Specifications |
| Temperature Coefficient of Resistance | TCR = (R2-R1) / R1(T2-T1) 10 R1: Resistance at room temp (), R2: Resistance at -55 or +125 (), T1: Room temp (), T2: -55 or +125 (). Ref JIS-C5201-1 4.8 | See Specification Table |
| Short Time Overload | Apply 2.5 times rated voltage for 5 seconds, rest for 30 minutes, then measure resistance change rate. Ref JIS-C5201-1 4.13 | 0.5%, 1%: R=1.0%; 5%: R=2.0% |
| Insulation Resistance | Apply 100 VDC for 1 minute between electrodes and between electrodes and substrate. Ref JIS-C5201-1 4.6 | 10 |
| Dielectric Withstand Voltage | Apply 300 VAC for 1 minute between electrodes. Ref JIS-C5201-1 4.7 | No short circuit or burn |
| Intermittent Overload | In oven at constant temp, apply 2.5 times rated voltage, 1 sec ON, 25 sec OFF, 10,000 cycles. Rest for 60 minutes, measure resistance change. Ref JIS-C5201-1 4.13 | R=5.0% |
Mechanical Performance Test
| Item | Conditions | Specifications |
| Resistance to Solvent | Immerse in 20~25 Isopropyl alcohol for 50.5 min, rest for 48 hrs, measure resistance change rate. Ref JIS-C5201-1 4.29 | R=0.5% |
| Solderability | Pre-treatment: Age in PCT at 105, 100% RH, 1.2210 pa for 4 hours, rest at room temp for 2 hours. Test method: Dip in 2355 solder bath for 20.5 seconds, observe solder coverage under microscope. Ref JIS-C5201-1 4.17 | Conductor coverage should be >95%. |
| Resistance to Soldering Heat | Test Item 1: Dip in 260+5/-0 solder bath for 10 sec+1/-0, rest for 60 min, measure resistance change rate. Test Item 2: Dip in 260+5/-0 solder bath for 30 sec+1/-0, clean, observe solder coverage. Ref JIS-C5201-1 4.18 | Test Item 1: (1) Resistance change rate R%=1.0%. Test Item 2: (1) Conductor coverage >95%. (2) No underlying material visible at electrode edge. |
| Joint Strength of Solder | Bending test: Solder resistor to bending test board, apply downward force of 5mm at center, measure resistance change rate under load. Ref JIS-C5201-1 4.33 | R%=1.0% |
Environmental Test
| Item | Conditions | Specifications |
| Resistance to Dry Heat | Place in oven at 1555 for 10004 hrs, rest for 1 hr, measure resistance change rate. Ref JIS-C5201-1 4.25 | 0.5%, 1%: R=1.0%; 5%: R=2.0% |
| Thermal Shock | In thermal shock chamber: -55 for 15 min, +125 for 15 min, 300 cycles. Rest for 60 min, measure resistance change rate. Ref MIL-STD 202 Method 107 | R=1.0% |
| Moisture Load | In constant temp/humidity chamber at 402, 90~95% RH. Apply rated voltage, 90 min ON, 30 min OFF, for 1,000 hrs. Rest for 60 min, measure resistance change rate. Ref JIS-C5201-1 4.24 | 0.5%, 1%: R=2.0%; 5%: R=3.0% |
| Load Life | In oven at 702. Apply rated voltage, 90 min ON, 30 min OFF, for 1,000 hrs. Rest for 60 min, measure resistance change rate. Ref JIS-C5201-1 4.25 | 0.5%, 1%: R=2.0%; 5%: R=3.0% |
Plating Thickness
- Nickel Layer (Ni): 2m
- Pure Tin Layer (Tin): 3m (Matte tin)
Technical Application Notes
Recommended Soldering Conditions
- Lead Free IR-Reflow Soldering Profile (Complies with J-STD-020): Max component temp 260+5/-0, 10 sec.
- Soldering Iron Method: 35010 within 3 seconds.
Recommended Land Pattern Design (For Reflow Soldering)
Note: Resistance value may vary slightly after soldering depending on the solder area and amount. Consider the effect of resistance decrease or increase when designing circuits.
| Type | A | B | P | Q1 | Q2 |
| RTA02-2D | 0.50 | 2.00 | 0.67 | 0.33 | 0.34 |
| RTA02-4D | 0.50 | 2.00 | 0.50 | 0.28 | 0.22 |
| RTA02-8D | 1.00 | 2.60 | 0.50 | 0.25 | 0.25 |
| RTA03-2D | 1.00 | 2.60 | 0.80 | 0.40 | 0.40 |
| RTA03-4D | 1.00 | 2.60 | 0.80 | 0.40 | 0.40 |
| RTA02-2C | 0.50 | 2.00 | 0.50 | 0.28 | 0.22 |
| RTA02-4C | 0.50 | 2.00 | 0.50 | 0.28 | 0.22 |
Usage Environment Precautions
This product is for general electronic use. RALEC is not responsible for any damages, costs, or losses incurred due to the use of this product in special environments. For other applications, please confirm suitability with RALEC. If customers intend to use the company's products in special environments or conditions, including but not limited to the following, product characteristics and reliability must be approved individually for each application environment.
- Operation in high temperature and high humidity environments.
- Exposure to sea breeze or other corrosive gas environments: Cl2, H2S, NH3, SO2, and NO2.
- Use in unverified liquids, including water, oil, chemicals, and organic solvents.
- Sealing or coating the company's products with unverified resins or other coating materials.
- Cleaning after soldering requires the use of water-soluble cleaning agents to remove flux residues. Cleaning is recommended even when using no-clean flux.
Transient Overload Precautions
This product may lose functionality due to transient overload. Please be mindful of your manufacturing process and storage to avoid applying transient currents exceeding product specifications.
Handling and Operation Precautions
- During operation, ensure the resistor edges and protective layer are free from mechanical stress damage.
- Handle printed circuit boards (PCBs) with care when separating or fixing them on support structures, as bending of the PCB installation can cause mechanical stress on the resistors.
- Resistors must be used within their rated power range. Exceeding the rated power will overload the resistor, potentially causing equipment damage due to temperature rise.
- If the resistor is likely to experience significant load (pulse) impacts, the operating environment must be set up before use.
When using this product, please evaluate and confirm under your company's actual installation conditions, fully consider fail-safe design, and ensure system safety.
Storage and Handling Conditions
- Storage environment: 255, 6015% RH, for up to two years.
- Avoid harsh environments during storage to prevent affecting product performance and solderability: locations with corrosive gases like sea breeze, Cl2, H2S, NH3, SO2, and NO2; direct sunlight; condensation.
- Ensure correct box orientation during handling and storage. Strictly prohibit dropping or squeezing the box, as this may damage product electrodes or the body.
Labeling for Electronic Information Products (for export to mainland China)
Outer packaging will be labeled with the following: Electronic Information Product Pollution Control Mark, Packaging Recycling Mark.
Attachment
- Document Revision Record Table (QA-QR-027)
2411221110_RALEC-RTA03-4D270JTP_C304959.pdf
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