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Specifications
Number of Resistors:
2
Number of Pins:
4
Tolerance:
±5%
Resistance:
1kΩ
Power(Watts):
62.5mW
Temperature Coefficient:
±200ppm/℃
Mfr. Part #:
RTA02-2D102JTH
Package:
0402x2
Key Attributes
Model Number:
RTA02-2D102JTH
Product Description
RTA Series Thick Film Array Chip Resistors
The RTA series thick film array chip resistors are lead-free, halogen-free, and RoHS compliant. They are designed for general electronic applications.
Product Attributes
- Brand: RALEC
- Certifications: RoHS compliant
Technical Specifications
| Type | Rated Power | Max. Rated Voltage | Max. Overload Voltage | T.C.R (ppm/) | Resistance Range | Number of Terminals | Number of Resistors | Rated Current (JUMPER 0) | Max. Resistance (JUMPER 0) |
|---|---|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1W | 25V | 50V | 300 | 1R<10 (0.5%, 1%) 10R10M (0.5%, 1%, 5%) | 4 | 2 | 1A | 25m MAX. |
| RTA02-4D (0402) | 1W | 25V | 50V | 300 | 1R<10 (0.5%, 1%) 10R10M (0.5%, 1%, 5%) | 8 | 4 | 1A | 25m MAX. |
| RTA02-8D (0402) | 1W | 25V | 50V | 250 | 10R10M (0.5%, 1%, 5%) | 16 | 8 | 1A | 50m MAX. |
| RTA03-2D (0603) | 1W | 50V | 100V | 200 | 10R10M (0.5%, 1%, 5%) | 4 | 2 | 1A | 50m MAX. |
| RTA03-4D (0603) | 1W | 50V | 100V | 200 | 22R470K (1%) 1R10M (0.5%, 1%, 5%) | 8 | 4 | 1A | 25m MAX. |
| RTA02-2C (0402) | 1W | 25V | 50V | 650 | 3R10 (0.5%, 5%) 10R<1M (0.5%, 1%, 5%) | 4 | 2 | 1A | 50m MAX. |
| RTA02-4C (0402) | 1W | 25V | 50V | 400 | 1R<10 (0.5%, 1%) 10R1M (0.5%, 1%, 5%) | 8 | 4 | 1A | 50m MAX. |
Dimensions (mm)
| Type | L | W | H | L1 | L2 | P | Q |
|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1.000.10 | 1.000.10 | 0.300.05 | 0.150.10 | 0.250.10 | (0.67) | 0.330.10 |
| RTA02-4D (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.200.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-8D (0402) | 4.000.20 | 1.600.10 | 0.400.10 | 0.300.15 | 0.300.10 | (0.50) | 0.250.10 |
| RTA03-2D (0603) | 1.600.15 | 1.600.15 | 0.450.10 | 0.300.15 | 0.300.15 | (0.80) | 0.600.10 |
| RTA03-4D (0603) | 3.200.20 | 1.600.15 | 0.500.10 | 0.300.15 | 0.300.15 | (0.80) | 0.500.10 |
| RTA02-2C (0402) | 1.000.10 | 1.000.10 | 0.300.10 | 0.180.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-4C (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.150.10 | 0.250.10 | (0.50) | 0.300.10 |
Structure Diagram
See attached diagrams for D(Convex) Type and C(Concave) Type structures.
Reliability Test Items
Electrical Performance Test
| Item | Conditions | Specifications |
|---|---|---|
| Temperature Coefficient of Resistance | TCR = (R2-R1) / R1(T2-T1) 10 R1: Room temp. resistance, R2: -55 or +125 resistance, T1: Room temp., T2: -55 or +125 | According to JIS-C5201-1 4.8 |
| Short Time Overload | Apply 2.5x rated voltage for 5 sec, rest 30 min. | 0.5%, 1%: R=1.0%; 5%: R=2.0% (Ref. Spec. Table) |
| Insulation Resistance | Apply 100 VDC for 1 min between electrodes and protective layer/substrate. | 10 (According to JIS-C5201-1 4.6) |
| Dielectric Withstand Voltage | Apply 300 VAC for 1 min between electrodes. | No short circuit or burn. (According to JIS-C5201-1 4.7) |
| Intermittent Overload | 2.5x rated voltage, 1 sec ON, 25 sec OFF, 10,000 cycles. | R=5.0% (Ref. Spec. Table) (According to JIS-C5201-1 4.13) |
Mechanical Performance Test
| Item | Conditions | Specifications |
|---|---|---|
| Resistance to Solvent | Immerse in Isopropyl alcohol (20~25) for 50.5 min, rest 48 hrs. | R=0.5% (Ref. Spec. Table) (According to JIS-C5201-1 4.29) |
| Solderability | Pre-treatment: 105, 100% RH, 1.2210 pa for 4 hrs. Test: Immerse in 2355 solder for 20.5 sec. | Solder coverage >95% (According to JIS-C5201-1 4.17) |
| Resistance to Soldering Heat | Test 1: Immerse in 260+5/-0 solder for 10 sec+1/-0, rest 60 min. Test 2: Immerse in 260+5/-0 solder for 30 sec+1/-0, then clean. | Test 1: R%=1.0%. Test 2: Solder coverage >95%, no underlayer visible at electrode edge. (Ref. Spec. Table) (According to JIS-C5201-1 4.18) |
| Joint Strength of Solder | Bending test: Apply 5mm downward force at center of test board. | R%=1.0% (Ref. Spec. Table) (According to JIS-C5201-1 4.33) |
Environmental Test
| Item | Conditions | Specifications |
|---|---|---|
| Resistance to Dry Heat | 1555 oven for 10004 hr. | 0.5%, 1%: R=1.0%; 5%: R=2.0% (Ref. Spec. Table) (According to JIS-C5201-1 4.25) |
| Thermal Shock | -55 (15 min) to +125 (15 min), 300 cycles. | R=1.0% (Ref. Spec. Table) (According to MIL-STD 202 Method 107) |
| Moisture Loading Life | 402, 90~95% RH, rated voltage applied, 90 min ON, 30 min OFF, 1,000 hr. | 0.5%, 1%: R=2.0%; 5%: R=3.0% (Ref. Spec. Table) (According to JIS-C5201-1 4.24) |
| Load Life | 702 oven, rated voltage applied, 90 min ON, 30 min OFF, 1,000 hrs. | 0.5%, 1%: R=2.0%; 5%: R=3.0% (Ref. Spec. Table) (According to JIS-C5201-1 4.25) |
Plating Thickness
- Nickel Layer (Ni): 2m
- Pure Tin Layer (Sn): 3m (Matte tin)
Technical Application Notes
- Recommended Soldering Conditions: Lead Free IR-Reflow Soldering Profile (J-STD-020 compliant), max. temp. 260+5/-0 for 10 sec. Soldering Iron: 35010 within 3 sec.
- Recommended Land Pattern Design for Reflow Soldering: Refer to diagrams for specific types.
- Environmental Usage Precautions: For general electronic use. Not suitable for special environments without confirmation.
- Transient Overload Precautions: Avoid transient overloads exceeding product specifications.
- Handling and Operation Precautions: Avoid mechanical stress, bending of PCB, operate within rated power, consider pulse loads. Evaluate in actual application for safety.
Storage and Handling Conditions
- Storage: 255, 6015% RH for 2 years. Avoid corrosive environments, direct sunlight, condensation.
- Handling: Ensure correct box orientation, avoid dropping or crushing to prevent damage.
Marking
External packaging will be marked with Electronic Information Product Pollution Control Mark and Packaging Recycling Mark for export to mainland China.
2411221110_RALEC-RTA02-2D102JTH_C723774.pdf
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