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quality Thick Film Array Chip Resistors RALEC RTA02-4D680JTH with Lead Free Construction and RoHS Compliance factory
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quality Thick Film Array Chip Resistors RALEC RTA02-4D680JTH with Lead Free Construction and RoHS Compliance factory
>
Specifications
Number of Resistors:
4
Number of Pins:
8
Tolerance:
±5%
Resistance:
68Ω
Power(Watts):
62.5mW
Temperature Coefficient:
±200ppm/℃
Mfr. Part #:
RTA02-4D680JTH
Package:
0402x4
Key Attributes
Model Number: RTA02-4D680JTH
Product Description

RTA Series Thick Film Array Chip Resistors

The RTA series resistors are lead-free, halogen-free thick film array chip resistors that comply with RoHS directives. They are designed for general electronic applications.

Product Attributes

  • Brand: RALEC
  • Certifications: RoHS compliant, Halogen-free
  • Material: Thick film on ceramic substrate
  • Color: Not specified
  • Origin: Not specified

Technical Specifications

Type Rated Power Max. Rated Voltage Max. Overload Voltage T.C.R (ppm/) Resistance Range () Number of Terminals Number of Resistors Rated Current (JUMPER) Max. Resistance (JUMPER)
RTA02-2D (0402) 1W 25V 50V 300 (1R<10), 200 (10R10M) 1R<10, 10R10M 4 2 1A 25m MAX.
RTA02-4D (0402) 1W 25V 50V 300 (1R<10), 200 (10R10M) 1R<10, 10R10M 8 4 1A 25m MAX.
RTA02-8D (0402) 1W 25V 50V 250 (10R10M) 10R10M 16 8 1A 50m MAX.
RTA03-2D (0603) 1W 50V 100V 200 (10R10M) 10R10M 4 2 1A 50m MAX.
RTA03-4D (0603) 1W 50V 100V 200 (22R470K), 200 (1R10M) 22R470K, 1R10M 8 4 1A 25m MAX
RTA02-2C (0402) 1W 25V 50V 650 (3R10), 200 (10R<1M) 3R10, 10R<1M 4 2 1A 50m MAX.
RTA02-4C (0402) 1W 25V 50V 400 (1R<10), 200 (10R1M) 1R<10, 10R1M 8 4 1A 50m MAX.

Dimensions (mm)

Type L W H L1 L2 P Q
RTA02-2D (0402) 1.000.10 1.000.10 0.300.05 0.150.10 0.250.10 (0.67) 0.330.10
RTA02-4D (0402) 2.000.10 1.000.10 0.400.10 0.200.10 0.250.10 (0.50) 0.300.10
RTA02-8D (0402) 4.000.20 1.600.10 0.400.10 0.300.15 0.300.10 (0.50) 0.250.10
RTA03-2D (0603) 1.600.15 1.600.15 0.450.10 0.300.15 0.300.15 (0.80) 0.600.10
RTA03-4D (0603) 3.200.20 1.600.15 0.500.10 0.300.15 0.300.15 (0.80) 0.500.10
RTA02-2C (0402) 1.000.10 1.000.10 0.300.10 0.180.10 0.250.10 (0.50) 0.300.10
RTA02-4C (0402) 2.000.10 1.000.10 0.400.10 0.150.10 0.250.10 (0.50) 0.300.10

Structure Diagram

Refer to the provided images for detailed structure diagrams of D (Convex) and C (Concave) types.

Reliability Test Items

Electrical Performance Test

Item Conditions Specifications
Temperature Coefficient of Resistance (R2-R1)/R1(T2-T1) 10^6 R1: Room temp. R2: -55 or +125 T1: Room temp. T2: -55 or +125 According to JIS-C5201-1 4.8
Short Time Overload Apply 2.5x rated voltage for 5 sec, rest 30 min. 0.5%, 1%: R=1.0%; 5%: R=2.0% (Ref. 3. Spec. Table)
Insulation Resistance Apply 100 VDC for 1 min between electrodes and between electrode/substrate. 10^9 (According to JIS-C5201-1 4.6)
Dielectric Withstand Voltage Apply 300 VAC for 1 min between electrodes. No short or burn. (According to JIS-C5201-1 4.7)
Intermittent Overload 1 sec ON, 25 sec OFF at 2.5x rated voltage, 10,000 cycles. R=5.0% (Ref. 3. Spec. Table) (According to JIS-C5201-1 4.13)

Mechanical Performance Test

Item Conditions Specifications
Resistance to Solvent Immerse in Isopropyl alcohol (20~25) for 50.5 min, rest 48 hrs. R=0.5% (Ref. 3. Spec. Table) (According to JIS-C5201-1 4.29)
Solderability Pre-treatment: 4 hrs at 105, 100% RH, 1.2210^5 Pa. Test: Immerse in 2355 solder for 20.5 sec. Solder coverage >95%. (According to JIS-C5201-1 4.17)
Resistance to Soldering Heat Test 1: Immerse in 260+5/-0 solder for 10 sec+1/-0, rest 60 min. Test 2: Immerse in 260+5/-0 solder for 30 sec+1/-0, then clean. Test 1: R%=1.0%. Test 2: Solder coverage >95%, no underlayer visible at electrode edge. (According to JIS-C5201-1 4.18)
Joint Strength of Solder Bending Test: Apply 5mm downward force at center of PCB. R%=1.0% (Ref. 3. Spec. Table) (According to JIS-C5201-1 4.33)

Environmental Test

Item Conditions Specifications
Resistance to Dry Heat 10004 hrs at 1555 oven, rest 1 hr. 0.5%, 1%: R=1.0%; 5%: R=2.0% (Ref. 3. Spec. Table) (According to JIS-C5201-1 4.25)
Thermal Shock 300 cycles of -55 (15 min) to +125 (15 min), rest 60 min. R=1.0% (Ref. 3. Spec. Table) (According to MIL-STD 202 Method 107)
Moisture Load Test 1000 hrs at 402, 90~95% RH, 90 min ON, 30 min OFF, rest 60 min. 0.5%, 1%: R=2.0%; 5%: R=3.0% (Ref. 3. Spec. Table) (According to JIS-C5201-1 4.24)
Load Life 1000 hrs at 702, 90 min ON, 30 min OFF, rest 60 min. 0.5%, 1%: R=2.0%; 5%: R=3.0% (Ref. 3. Spec. Table) (According to JIS-C5201-1 4.25)

Plating Thickness

  • Nickel (Ni) Layer: 2m
  • Pure Tin (Sn) Layer: 3m (Matte tin)

Technical Application Notes

  • Recommended Soldering Conditions: Lead Free IR-Reflow (J-STD-020 compliant, max temp 260+5/-0, 10 sec), Soldering Iron (35010 within 3 sec).
  • Recommended Land Pattern Design: Refer to diagrams and dimensions provided.
  • Usage Environment Precautions: For general electronic use. Not recommended for high temp/humidity, corrosive environments (sea breeze, Cl2, H2S, NH3, SO2, NO2), unverified liquids, unverified sealing/coating materials. Cleaning after soldering is recommended, even with no-clean flux.
  • Transient Overload Precautions: Avoid transient currents exceeding product specifications.
  • Handling and Operation Precautions: Protect edges and protective coating from mechanical stress. Be careful of PCB bending during assembly. Operate within rated power. Consider pulse load impact. Evaluate and confirm in actual application for fail-safe design.

Storage and Handling Conditions

  • Storage: 2 years under 255, 6015% RH.
  • Avoid: Corrosive gases (sea breeze, Cl2, H2S, NH3, SO2, NO2), direct sunlight, condensation.
  • Handling: Maintain correct box orientation, avoid dropping or crushing to prevent damage to electrodes or body.

Marking

Outer boxes for export to mainland China will be marked with the Electronic Information Product Pollution Control Mark and the Packaging Recycling Mark.

Legal Disclaimer

RALEC and its distributors/agents (collectively "RALEC") assume no liability for any errors, inaccuracies, or incompleteness in product information. RALEC may change product information without notice. RALEC makes no commitments regarding product suitability for specific purposes or continued production. RALEC is not liable for any application or use of its products, including but not limited to lost profits, direct, indirect, special, punitive, consequential, or incidental damages. Implied warranties, including fitness for a particular purpose, non-infringement, and merchantability, are disclaimed to the maximum extent permitted by law. This product is defined for general electronic use and is not intended for automotive electronics, medical life support/sustaining equipment, or any application where failure could cause injury or death. Technical advice provided by RALEC is free of charge, and RALEC assumes no obligation or liability for its use. The buyer assumes all risks associated with using RALEC products in combination with other materials or processes. RALEC reserves the right to modify this document without notice; product changes will be announced via ECN.


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