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Specifications
Number of Resistors:
4
Number of Pins:
8
Tolerance:
±5%
Resistance:
510Ω
Power(Watts):
62.5mW
Temperature Coefficient:
±200ppm/℃
Mfr. Part #:
RTA03-4D511JTP
Package:
0603x4
Key Attributes
Model Number:
RTA03-4D511JTP
Product Description
RTA Series Thick Film Array Chip Resistors
The RTA series resistors are lead-free, halogen-free, and RoHS compliant thick film array chip resistors designed for general electronic applications. They offer reliable performance and are available in various configurations to meet diverse circuit needs.
Product Attributes
- Brand: RALEC
- Compliance: RoHS, Lead-free, Halogen-free
Technical Specifications
| Type | Rated Power | Max. Rated Voltage | Max. Overload Voltage | T.C.R (ppm/) | Resistance Range | Number of Terminals | Number of Resistors | JUMPER (0) Rated Current | JUMPER (0) Resistance |
|---|---|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1 W | 25V | 50V | ±300 | 1≤R<10 | 4 | 2 | 1A | 25mΩ MAX. |
| RTA02-4D (0402) | 1 W | 25V | 50V | ±300 | 1≤R<10 | 8 | 4 | 1A | 25mΩ MAX. |
| RTA02-8D (0402) | 1 W | 25V | 50V | ±250 | 10≤R≤10MΩ | 16 | 8 | 1A | -- |
| RTA03-2D (0603) | 1 W | 50V | 100V | ±200 | 10≤R≤10MΩ | 4 | 2 | 1A | -- |
| RTA03-4D (0603) | 1 W | 50V | 100V | ±200 | 1≤R≤10MΩ | 8 | 4 | 1A | 25mΩ MAX. |
| RTA02-2C (0402) | 1 W | 25V | 50V | ±650 | 3≤R≤1MΩ | 4 | 2 | 1A | -- |
| RTA02-4C (0402) | 1 W | 25V | 50V | ±400 | 1≤R≤1MΩ | 8 | 4 | 1A | -- |
Dimensions (mm)
| Type | L | W | H | L1 | L2 | P | Q |
|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1.00±0.10 | 1.00±0.10 | 0.30±0.05 | 0.15±0.10 | 0.25±0.10 | (0.67) | 0.33±0.10 |
| RTA02-4D (0402) | 2.00±0.10 | 1.00±0.10 | 0.40±0.10 | 0.20±0.10 | 0.25±0.10 | (0.50) | 0.30±0.10 |
| RTA02-8D (0402) | 4.00±0.20 | 1.60±0.10 | 0.40±0.10 | 0.30±0.15 | 0.30±0.10 | (0.50) | 0.25±0.10 |
| RTA03-2D (0603) | 1.60±0.15 | 1.60±0.15 | 0.45±0.10 | 0.30±0.15 | 0.30±0.15 | (0.80) | 0.60±0.10 |
| RTA03-4D (0603) | 3.20±0.20 | 1.60±0.15 | 0.50±0.10 | 0.30±0.15 | 0.30±0.15 | (0.80) | 0.50±0.10 |
| RTA02-2C (0402) | 1.00±0.10 | 1.00±0.10 | 0.30±0.10 | 0.18±0.10 | 0.25±0.10 | (0.50) | 0.30±0.10 |
| RTA02-4C (0402) | 2.00±0.10 | 1.00±0.10 | 0.40±0.10 | 0.15±0.10 | 0.25±0.10 | (0.50) | 0.30±0.10 |
Reliability Test Items
| Category | Item | Conditions | Specifications |
|---|---|---|---|
| Electrical Performance Test | Temperature Coefficient of Resistance | Based on JIS-C5201-1 4.8 | NA |
| Short Time Overload | Based on JIS-C5201-1 4.13 | 0.5%, 1%: ΔR=±1.0%; 5%: ΔR=±2.0% | |
| Insulation Resistance Test | Based on JIS-C5201-1 4.6 | ≥109Ω | |
| Dielectric Withstand Voltage | Based on JIS-C5201-1 4.7 | No short circuit or burnout | |
| Intermittent Overload | Based on JIS-C5201-1 4.13 | ΔR=±5.0% | |
| Mechanical Performance Test | Resistance to Solvent | Based on JIS-C5201-1 4.29 | ΔR=±0.5% |
| Solderability | According to JIS-C5201-1 4.17 | Soldered area should be greater than 95% | |
| Resistance to Soldering Heat | According to JIS-C5201-1 4.18 | Test Item 1: ΔR%=±1.0%; Test Item 2: Soldered area >95%, no underlying material visible at electrode edge. | |
| Joint Strength of Solder | Bending Test, Based on JIS-C5201-1 4.33 | ΔR%=±1.0% | |
| Environmental Test | Resistance to Dry Heat | Based on JIS-C5201-1 4.25 | 0.5%, 1%: ΔR=±1.0%; 5%: ΔR=±2.0% |
| Thermal Shock | Based on MIL-STD 202 Method 107 | ΔR=±1.0% | |
| Loading Life in Moisture | Based on JIS-C5201-1 4.24 | 0.5%, 1%: ΔR=±2.0%; 5%: ΔR=±3.0% | |
| Load Life | Based on JIS-C5201-1 4.25 | 0.5%, 1%: ΔR=±2.0%; 5%: ΔR=±3.0% |
Plating Thickness
- Nickel Layer (Ni): ≥2μm
- Pure Tin Layer (Sn): ≥3μm
- Plating tin is matte tin.
Technical Application Notes
- Recommended Soldering Conditions: Lead Free IR-Reflow Soldering Profile (J-STD-020 compliant), Iron Soldering: 350±10 within 3 seconds.
- Recommended Land Pattern Design for Reflow Soldering is provided.
- Environmental Precautions: Not recommended for use in high temperature/humidity, corrosive environments (sea breeze, Cl2, H2S, NH3, SO2, NO2), unverified liquids, or with unverified sealing/coating materials. Cleaning after soldering is recommended.
- Transient Overload: Be cautious of transient overloads that may cause functional loss.
- Handling and Operation: Avoid mechanical stress on resistor edges and protective layers. Ensure proper handling during PCB separation/fixing. Operate within rated power limits. Consider pulse load impacts and implement fail-safe design.
Storage and Handling Conditions
- Storage: Store in 25±5, 60±15% RH environment for up to two years. Avoid direct sunlight, condensation, and corrosive atmospheres.
- Handling: Ensure correct box orientation, avoid dropping or squeezing to prevent damage to electrodes or body.
2411221110_RALEC-RTA03-4D511JTP_C102677.pdf
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