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quality Thick Film Array Chip Resistors RALEC RTA03-4D751JTP Lead Free Halogen Free RoHS Compliant Series factory
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quality Thick Film Array Chip Resistors RALEC RTA03-4D751JTP Lead Free Halogen Free RoHS Compliant Series factory
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Specifications
Number of Resistors:
4
Number of Pins:
8
Tolerance:
±5%
Resistance:
750Ω
Power(Watts):
62.5mW
Temperature Coefficient:
±200ppm/℃
Mfr. Part #:
RTA03-4D751JTP
Package:
0603x4
Key Attributes
Model Number: RTA03-4D751JTP
Product Description

RTA Series Thick Film Array Chip Resistors

The RTA series resistors are lead-free, halogen-free, and RoHS compliant thick film array chip resistors designed for general electronic applications. They offer reliable performance and are manufactured to meet industry standards.

Product Attributes

  • Brand: RALEC
  • Certifications: RoHS compliant, Lead-free, Halogen-free

Technical Specifications

Type Rated Power Max. Rated Voltage Max. Overload Voltage T.C.R (ppm/) Resistance Range Number of Terminals Number of Resistors JUMPER (0) Rated Current JUMPER (0) Resistance
RTA02-2D (0402) 1 W 25V 50V 300 1R<10 4 2 1A 25m MAX.
RTA02-4D (0402) 1 W 25V 50V 300 1R<10 8 4 1A 25m MAX.
RTA02-8D (0402) 1 W 25V 50V 250 10R10M 16 8 1A 50m MAX.
RTA03-2D (0603) 1 W 50V 100V 200 10R10M 4 2 1A 50m MAX.
RTA03-4D (0603) 1 W 50V 100V 200 1R10M 8 4 1A 25m MAX
RTA02-2C (0402) 1 W 25V 50V 650 3R10 4 2 1A 50m MAX.
RTA02-4C (0402) 1 W 25V 50V 400 1R<10 8 4 1A 50m MAX.

Dimensions (mm)

Type L W H L1 L2 P Q
RTA02-2D (0402) 1.000.10 1.000.10 0.300.05 0.150.10 0.250.10 (0.67) 0.330.10
RTA02-4D (0402) 2.000.10 1.000.10 0.400.10 0.200.10 0.250.10 (0.50) 0.300.10
RTA02-8D (0402) 4.000.20 1.600.10 0.400.10 0.300.15 0.300.10 (0.50) 0.250.10
RTA03-2D (0603) 1.600.15 1.600.15 0.450.10 0.300.15 0.300.15 (0.80) 0.600.10
RTA03-4D (0603) 3.200.20 1.600.15 0.500.10 0.300.15 0.300.15 (0.80) 0.500.10
RTA02-2C (0402) 1.000.10 1.000.10 0.300.10 0.180.10 0.250.10 (0.50) 0.300.10
RTA02-4C (0402) 2.000.10 1.000.10 0.400.10 0.150.10 0.250.10 (0.50) 0.300.10

Structure Diagram

D(Convex) Type: 1. Ceramic substrate, 2. 2nd Protective coating, 3. Bottom inner electrode, 4. Top inner electrode, 5. Resistive layer, 6. 1st Protective coating, 7. Terminal inner electrode, 8. Marking, 9. Ni plating, 10. Sn plating.

C(Concave) Type: 1. Ceramic substrate, 2. 2nd Protective coating, 3. Bottom inner electrode, 4. Top inner electrode, 5. Resistive layer, 6. 1st Protective coating, 7. Terminal inner electrode, 8. Marking, 9. Ni plating, 10. Sn plating.

Reliability Test Items

Electrical Performance Test

ItemConditionsSpecifications
Temperature Coefficient of Resistance(R2-R1)/R1(T2-T1) 106According to JIS-C5201-1 4.8
Short Time OverloadApply 2.5 times rated voltage for 5 sec, rest 30 min.0.5%, 1%: R=1.0%; 5%: R=2.0% (Ref. 3. Spec Table)
Insulation Resistance TestApply 100 VDC for 1 min.109 (According to JIS-C5201-1 4.6)
Dielectric Withstand VoltageApply 300 VAC for 1 min.No short or burn (According to JIS-C5201-1 4.7)
Intermittent Overload1 sec ON, 25 sec OFF, 10,000 cycles.R=5.0% (Ref. 3. Spec Table)

Mechanical Performance Test

ItemConditionsSpecifications
Resistance to SolventImmerse in Isopropanol at 20~25 for 50.5 min.R=0.5% (Ref. 3. Spec Table)
SolderabilityAging test at 105, 100% RH, 1.22105 pa for 4 hrs. Immersion in 2355 solder bath for 20.5 sec.Solder coverage >95% (According to JIS-C5201-1 4.17)
Resistance to Soldering HeatTest 1: Immersion in 260+5/-0 solder bath for 10 sec+1/-0. Test 2: Immersion in 260+5/-0 solder bath for 30 sec+1/-0.Test 1: R%=1.0%. Test 2: Solder coverage >95%, no underlying material visible at electrode edge. (Ref. 3. Spec Table)
Joint Strength of SolderBending test: Apply load to the center of the test board. Downward depth (D): 5mm.R%=1.0% (Ref. 3. Spec Table)

Environmental Test

ItemConditionsSpecifications
Resistance to Dry Heat10004 hrs at 1555.0.5%, 1%: R=1.0%; 5%: R=2.0% (Ref. 3. Spec Table)
Thermal Shock-55 for 15 min, +125 for 15 min, 300 cycles.R=1.0% (Ref. 3. Spec Table)
Loading Life in Moisture402, 90~95% RH, 90 min ON, 30 min OFF, 1,000 hrs.0.5%, 1%: R=2.0%; 5%: R=3.0% (Ref. 3. Spec Table)
Load Life702, 90 min ON, 30 min OFF, 1,000 hrs.0.5%, 1%: R=2.0%; 5%: R=3.0% (Ref. 3. Spec Table)

Plating Thickness

  • Nickel layer (Ni): 2m
  • Pure Tin layer (Tin): 3m (Matte tin)

Recommended Land Pattern Design (For Reflow Soldering)

TypeABPQ1Q2
RTA02-2D0.502.000.670.330.34
RTA02-4D0.502.000.500.280.22
RTA02-8D1.002.600.500.250.25
RTA03-2D1.002.600.800.400.40
RTA03-4D1.002.600.800.400.40
RTA02-2C0.502.000.500.280.22
RTA02-4C0.502.000.500.280.22

Storage and Handling Conditions

  • Storage Environment: 255, 6015% RH for two years.
  • Avoid corrosive environments (sea breeze, Cl2, H2S, NH3, SO2, NO2), direct sunlight, and condensation.
  • Ensure correct box orientation during handling and storage; avoid dropping or crushing.

2411221110_RALEC-RTA03-4D751JTP_C458650.pdf

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