RTA Series Thick Film Array Chip Resistors
The RTA series resistors are lead-free, halogen-free, and RoHS compliant thick film array chip resistors designed for general electronic applications. They offer reliable performance and are manufactured to meet industry standards.
Product Attributes
- Brand: RALEC
- Certifications: RoHS compliant, Lead-free, Halogen-free
Technical Specifications
| Type | Rated Power | Max. Rated Voltage | Max. Overload Voltage | T.C.R (ppm/) | Resistance Range | Number of Terminals | Number of Resistors | JUMPER (0) Rated Current | JUMPER (0) Resistance |
|---|---|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1 W | 25V | 50V | 300 | 1R<10 | 4 | 2 | 1A | 25m MAX. |
| RTA02-4D (0402) | 1 W | 25V | 50V | 300 | 1R<10 | 8 | 4 | 1A | 25m MAX. |
| RTA02-8D (0402) | 1 W | 25V | 50V | 250 | 10R10M | 16 | 8 | 1A | 50m MAX. |
| RTA03-2D (0603) | 1 W | 50V | 100V | 200 | 10R10M | 4 | 2 | 1A | 50m MAX. |
| RTA03-4D (0603) | 1 W | 50V | 100V | 200 | 1R10M | 8 | 4 | 1A | 25m MAX |
| RTA02-2C (0402) | 1 W | 25V | 50V | 650 | 3R10 | 4 | 2 | 1A | 50m MAX. |
| RTA02-4C (0402) | 1 W | 25V | 50V | 400 | 1R<10 | 8 | 4 | 1A | 50m MAX. |
Dimensions (mm)
| Type | L | W | H | L1 | L2 | P | Q |
|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1.000.10 | 1.000.10 | 0.300.05 | 0.150.10 | 0.250.10 | (0.67) | 0.330.10 |
| RTA02-4D (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.200.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-8D (0402) | 4.000.20 | 1.600.10 | 0.400.10 | 0.300.15 | 0.300.10 | (0.50) | 0.250.10 |
| RTA03-2D (0603) | 1.600.15 | 1.600.15 | 0.450.10 | 0.300.15 | 0.300.15 | (0.80) | 0.600.10 |
| RTA03-4D (0603) | 3.200.20 | 1.600.15 | 0.500.10 | 0.300.15 | 0.300.15 | (0.80) | 0.500.10 |
| RTA02-2C (0402) | 1.000.10 | 1.000.10 | 0.300.10 | 0.180.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-4C (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.150.10 | 0.250.10 | (0.50) | 0.300.10 |
Structure Diagram
D(Convex) Type: 1. Ceramic substrate, 2. 2nd Protective coating, 3. Bottom inner electrode, 4. Top inner electrode, 5. Resistive layer, 6. 1st Protective coating, 7. Terminal inner electrode, 8. Marking, 9. Ni plating, 10. Sn plating.
C(Concave) Type: 1. Ceramic substrate, 2. 2nd Protective coating, 3. Bottom inner electrode, 4. Top inner electrode, 5. Resistive layer, 6. 1st Protective coating, 7. Terminal inner electrode, 8. Marking, 9. Ni plating, 10. Sn plating.
Reliability Test Items
Electrical Performance Test
| Item | Conditions | Specifications |
|---|---|---|
| Temperature Coefficient of Resistance | (R2-R1)/R1(T2-T1) 106 | According to JIS-C5201-1 4.8 |
| Short Time Overload | Apply 2.5 times rated voltage for 5 sec, rest 30 min. | 0.5%, 1%: R=1.0%; 5%: R=2.0% (Ref. 3. Spec Table) |
| Insulation Resistance Test | Apply 100 VDC for 1 min. | 109 (According to JIS-C5201-1 4.6) |
| Dielectric Withstand Voltage | Apply 300 VAC for 1 min. | No short or burn (According to JIS-C5201-1 4.7) |
| Intermittent Overload | 1 sec ON, 25 sec OFF, 10,000 cycles. | R=5.0% (Ref. 3. Spec Table) |
Mechanical Performance Test
| Item | Conditions | Specifications |
|---|---|---|
| Resistance to Solvent | Immerse in Isopropanol at 20~25 for 50.5 min. | R=0.5% (Ref. 3. Spec Table) |
| Solderability | Aging test at 105, 100% RH, 1.22105 pa for 4 hrs. Immersion in 2355 solder bath for 20.5 sec. | Solder coverage >95% (According to JIS-C5201-1 4.17) |
| Resistance to Soldering Heat | Test 1: Immersion in 260+5/-0 solder bath for 10 sec+1/-0. Test 2: Immersion in 260+5/-0 solder bath for 30 sec+1/-0. | Test 1: R%=1.0%. Test 2: Solder coverage >95%, no underlying material visible at electrode edge. (Ref. 3. Spec Table) |
| Joint Strength of Solder | Bending test: Apply load to the center of the test board. Downward depth (D): 5mm. | R%=1.0% (Ref. 3. Spec Table) |
Environmental Test
| Item | Conditions | Specifications |
|---|---|---|
| Resistance to Dry Heat | 10004 hrs at 1555. | 0.5%, 1%: R=1.0%; 5%: R=2.0% (Ref. 3. Spec Table) |
| Thermal Shock | -55 for 15 min, +125 for 15 min, 300 cycles. | R=1.0% (Ref. 3. Spec Table) |
| Loading Life in Moisture | 402, 90~95% RH, 90 min ON, 30 min OFF, 1,000 hrs. | 0.5%, 1%: R=2.0%; 5%: R=3.0% (Ref. 3. Spec Table) |
| Load Life | 702, 90 min ON, 30 min OFF, 1,000 hrs. | 0.5%, 1%: R=2.0%; 5%: R=3.0% (Ref. 3. Spec Table) |
Plating Thickness
- Nickel layer (Ni): 2m
- Pure Tin layer (Tin): 3m (Matte tin)
Recommended Land Pattern Design (For Reflow Soldering)
| Type | A | B | P | Q1 | Q2 |
|---|---|---|---|---|---|
| RTA02-2D | 0.50 | 2.00 | 0.67 | 0.33 | 0.34 |
| RTA02-4D | 0.50 | 2.00 | 0.50 | 0.28 | 0.22 |
| RTA02-8D | 1.00 | 2.60 | 0.50 | 0.25 | 0.25 |
| RTA03-2D | 1.00 | 2.60 | 0.80 | 0.40 | 0.40 |
| RTA03-4D | 1.00 | 2.60 | 0.80 | 0.40 | 0.40 |
| RTA02-2C | 0.50 | 2.00 | 0.50 | 0.28 | 0.22 |
| RTA02-4C | 0.50 | 2.00 | 0.50 | 0.28 | 0.22 |
Storage and Handling Conditions
- Storage Environment: 255, 6015% RH for two years.
- Avoid corrosive environments (sea breeze, Cl2, H2S, NH3, SO2, NO2), direct sunlight, and condensation.
- Ensure correct box orientation during handling and storage; avoid dropping or crushing.
2411221110_RALEC-RTA03-4D751JTP_C458650.pdf
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