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Specifications
Number of Resistors:
4
Number of Pins:
8
Tolerance:
±5%
Resistance:
3Ω
Power(Watts):
62.5mW
Temperature Coefficient:
±300ppm/℃
Mfr. Part #:
RTA02-4D3R0JTH
Package:
0402x4
Key Attributes
Model Number:
RTA02-4D3R0JTH
Product Description
RTA Series Thick Film Array Chip Resistors
The RTA series resistors are lead-free, halogen-free, and RoHS compliant thick film array chip resistors designed for general electronic applications. They offer reliable performance and are suitable for a wide range of general electronic uses.
Product Attributes
- Brand: RALEC
- Certifications: RoHS compliant, Lead-free, Halogen-free
Technical Specifications
| Type | Rated Power | Max. Rated Voltage | Max. Overload Voltage | T.C.R (ppm/) | Resistance Range | Number of Terminals | Number of Resistors | Rated Current (JUMPER 0) | Max. Resistance (JUMPER 0) |
|---|---|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1 W | 25V | 50V | 300 (1R<10), 200 (10R10M) | 1R<10 (D:0.5%), 10R10M (D:0.5%, F:1%, J:5%) | 4 | 2 | 1A | 25m MAX. |
| RTA02-4D (0402) | 1 W | 25V | 50V | 300 (1R<10), 200 (10R10M) | 1R<10 (D:0.5%), 10R10M (D:0.5%, F:1%, J:5%) | 8 | 4 | 1A | 25m MAX. |
| RTA02-8D (0402) | 1 W | 25V | 50V | 250 (10R10M) | 10R10M (D:0.5%, F:1%, J:5%) | 16 | 8 | 1A | 50m MAX. |
| RTA03-2D (0603) | 1 W | 50V | 100V | 200 (10R10M) | 10R10M (D:0.5%, F:1%, J:5%) | 4 | 2 | 1A | 50m MAX. |
| RTA03-4D (0603) | 1 W | 50V | 100V | 200 (22R470K), 200 (1R10M) | 1R10M (D:0.5%), 1R10M (F:1%, J:5%), 22R470K (F:1%) | 8 | 4 | 1A | 25m MAX |
| RTA02-2C (0402) | 1 W | 25V | 50V | 650 (3R10), 200 (10R<1M) | 3R10 (D:0.5%), 10R<1M (D:0.5%, F:1%, J:5%) | 4 | 2 | 1A | 50m MAX. |
| RTA02-4C (0402) | 1 W | 25V | 50V | 400 (1R<10), 200 (10R1M) | 1R<10 (D:0.5%), 10R1M (D:0.5%, F:1%, J:5%) | 8 | 4 | 1A | 50m MAX. |
Dimensions (mm)
| Type | L | W | H | L1 | L2 | P | Q |
|---|---|---|---|---|---|---|---|
| RTA02-2D (0402) | 1.000.10 | 1.000.10 | 0.300.05 | 0.150.10 | 0.250.10 | (0.67) | 0.330.10 |
| RTA02-4D (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.200.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-8D (0402) | 4.000.20 | 1.600.10 | 0.400.10 | 0.300.15 | 0.300.10 | (0.50) | 0.250.10 |
| RTA03-2D (0603) | 1.600.15 | 1.600.15 | 0.450.10 | 0.300.15 | 0.300.15 | (0.80) | 0.600.10 |
| RTA03-4D (0603) | 3.200.20 | 1.600.15 | 0.500.10 | 0.300.15 | 0.300.15 | (0.80) | 0.500.10 |
| RTA02-2C (0402) | 1.000.10 | 1.000.10 | 0.300.10 | 0.180.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-4C (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.150.10 | 0.250.10 | (0.50) | 0.300.10 |
Reliability Test Items
| Item | Conditions | Specifications |
|---|---|---|
| Temperature Coefficient of Resistance | Based on JIS-C5201-1 4.8 | 0.5%, 1%: 300 ppm/ |
| 5%: 250 ppm/ | ||
| Jumper: NA | ||
| Short Time Overload | 2.5x rated voltage for 5 sec, rest 30 min. Based on JIS-C5201-1 4.13 | 0.5%, 1%: R=1.0% |
| 5%: R=2.0% | ||
| Insulation Resistance | 100 VDC for 1 min. Based on JIS-C5201-1 4.6 | 109 |
| Dielectric Withstand Voltage | 300 VAC for 1 min. Based on JIS-C5201-1 4.7 | No short or burn |
| Intermittent Overload | 2.5x rated voltage, 1 sec ON, 25 sec OFF, 10,000 cycles. Based on JIS-C5201-1 4.13 | 0.5%, 1%: R=5.0% |
| 5%: R=5.0% | ||
| Resistance to Solvent | Immersed in Isopropanol 5 min. Based on JIS-C5201-1 4.29 | 0.5%, 1%: R=0.5% |
| 5%: R=0.5% | ||
| Solderability | Pre-conditioning: 105, 100% RH, 1.22x105 Pa for 4 hrs. Aging at room temp 2 hrs. Test: Dipped in 2355 solder for 20.5 sec. Based on JIS-C5201-1 4.17 | Soldered area > 95% |
| (Jumper: NA) | ||
| Resistance to Soldering Heat | Test 1: Dipped in 260+5/-0 solder for 10+1/-0 sec. Test 2: Dipped in 260+5/-0 solder for 30+1/-0 sec. Based on JIS-C5201-1 4.18 | Test 1: R%=1.0% |
| Test 2: Soldered area > 95%, no underlayer visible at electrode edge. | ||
| Joint Strength of Solder | Bending test: 5mm deflection. Based on JIS-C5201-1 4.33 | 0.5%, 1%: R%=1.0% |
| 5%: R%=1.0% | ||
| Resistance to Dry Heat | 1555 for 10004 hr. Based on JIS-C5201-1 4.25 | 0.5%, 1%: R=1.0% |
| 5%: R=2.0% | ||
| Thermal Shock | -55 (15 min) to +125 (15 min), 300 cycles. Based on MIL-STD 202 Method 107 | 0.5%, 1%: R=1.0% |
| 5%: R=1.0% | ||
| Moisture Load Life | 402, 90-95% RH, rated voltage, 90 min ON, 30 min OFF, 1000 hr. Based on JIS-C5201-1 4.24 | 0.5%, 1%: R=2.0% |
| 5%: R=3.0% | ||
| Load Life | 702, rated voltage, 90 min ON, 30 min OFF, 1000 hr. Based on JIS-C5201-1 4.25 | 0.5%, 1%: R=2.0% |
| 5%: R=3.0% |
Plating Thickness
- Nickel Layer (Ni): 2m
- Pure Tin Layer (Sn): 3m (Matte Tin)
Application Notes
Recommended Soldering Conditions:
- Lead Free IR-Reflow Soldering Profile (Comply with J-STD-020): Max component temperature 260+5/-0, 10 seconds.
- Soldering Iron Method: 35010 within 3 seconds.
Recommended Land Pattern Design (For Reflow Soldering)
| Type | A | B | P | Q1 | Q2 |
|---|---|---|---|---|---|
| RTA02-2D | 0.50 | 2.00 | 0.67 | 0.33 | 0.34 |
| RTA02-4D | 0.50 | 2.00 | 0.50 | 0.28 | 0.22 |
| RTA02-8D | 1.00 | 2.60 | 0.50 | 0.25 | 0.25 |
| RTA03-2D | 1.00 | 2.60 | 0.80 | 0.40 | 0.40 |
| RTA03-4D | 1.00 | 2.60 | 0.80 | 0.40 | 0.40 |
| RTA02-2C | 0.50 | 2.00 | 0.50 | 0.28 | 0.22 |
| RTA02-4C | 0.50 | 2.00 | 0.50 | 0.28 | 0.22 |
Environmental Considerations
- This product is for general electronic use. RALEC is not responsible for damages, costs, or losses resulting from the use of this product in special environments. Confirmation with RALEC is required for other applications.
- Customers intending to use this product in special environments (e.g., high temperature/humidity, corrosive atmospheres like sea breeze, Cl2, H2S, NH3, SO2, NO2, unverified liquids, unverified resins/coatings) must have product characteristics and reliability approved separately.
- Cleaning after soldering is recommended, even when using no-clean flux, especially if using water-soluble cleaning agents.
Transient Overload Precautions
- This product may lose functionality due to transient overload. Ensure manufacturing processes and storage prevent transient currents exceeding product specifications.
Handling and Operation Precautions
- Protect resistor edges and protective coating from mechanical stress during operation.
- Handle printed circuit boards (PCBs) with care when separating or fixing them to support structures, as PCB bending can cause mechanical stress on the resistors.
- Use resistors within their rated power range. Exceeding the rated power can lead to temperature rise and potential equipment damage.
- If the resistor is expected to receive significant pulsed load impacts, set up the operating environment accordingly before use.
- Evaluate and confirm product use in your specific application, implementing fail-safe designs to ensure system safety.
Storage and Handling Conditions
- Storage: 255, 6015% RH for two years.
- Avoid adverse environments such as sea breeze, corrosive gases (Cl2, H2S, NH3, SO2, NO2), direct sunlight, and condensation.
- Ensure correct box orientation during transport and storage. Avoid dropping or crushing boxes to prevent damage to electrodes or the body.
2411221110_RALEC-RTA02-4D3R0JTH_C2991284.pdf
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