RTA Series Thick Film Array Chip Resistors
The RTA series resistors are lead-free, halogen-free, and RoHS compliant thick film array chip resistors designed for general electronic applications. They offer reliable performance and are available in various configurations to meet diverse design needs.
Product Attributes
- Brand: RALEC
- Certifications: RoHS compliant, Lead-free, Halogen-free
Technical Specifications
| Type | Rated Power | Max. Rated Voltage | Max. Overload Voltage | T.C.R (ppm/) | Resistance Range | Number of Terminals | Number of Resistors | Rated Current (JUMPER 0) | Max. Resistance (JUMPER 0) |
| RTA02-2D (0402) | 1 W | 25V | 50V | 300 | 1R<10 (D:0.5%), 10R10M (D:0.5%) | 4 | 2 | 1A | 25m MAX. |
| RTA02-4D (0402) | 1 W | 25V | 50V | 300 | 1R<10 (D:0.5%), 10R10M (D:0.5%) | 8 | 4 | 1A | 25m MAX. |
| RTA02-8D (0402) | 1 W | 25V | 50V | 250 | 10R10M (D:0.5%) | 16 | 8 | 1A | 50m MAX. |
| RTA03-2D (0603) | 1 W | 50V | 100V | 200 | 10R10M (D:0.5%) | 4 | 2 | 1A | 50m MAX. |
| RTA03-4D (0603) | 1 W | 50V | 100V | 200 | 22R470K (F:1%), 1R10M (D:0.5%), 1R10M (J:5%) | 8 | 4 | 1A | 25m MAX. |
| RTA02-2C (0402) | 1 W | 25V | 50V | 650 | 3R10 (D:0.5%), 10R<1M (D:0.5%) | 4 | 2 | 1A | 50m MAX. |
| RTA02-4C (0402) | 1 W | 25V | 50V | 400 | 1R<10 (D:0.5%), 10R1M (D:0.5%) | 8 | 4 | 1A | 50m MAX. |
Dimensions (mm)
| Type | L | W | H | L1 | L2 | P | Q |
| RTA02-2D (0402) | 1.000.10 | 1.000.10 | 0.300.05 | 0.150.10 | 0.250.10 | (0.67) | 0.330.10 |
| RTA02-4D (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.200.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-8D (0402) | 4.000.20 | 1.600.10 | 0.400.10 | 0.300.15 | 0.300.10 | (0.50) | 0.250.10 |
| RTA03-2D (0603) | 1.600.15 | 1.600.15 | 0.450.10 | 0.300.15 | 0.300.15 | (0.80) | 0.600.10 |
| RTA03-4D (0603) | 3.200.20 | 1.600.15 | 0.500.10 | 0.300.15 | 0.300.15 | (0.80) | 0.500.10 |
| RTA02-2C (0402) | 1.000.10 | 1.000.10 | 0.300.10 | 0.180.10 | 0.250.10 | (0.50) | 0.300.10 |
| RTA02-4C (0402) | 2.000.10 | 1.000.10 | 0.400.10 | 0.150.10 | 0.250.10 | (0.50) | 0.300.10 |
Structure Diagram
D(Convex) Type
1. Ceramic substrate, 2. 2nd Protective coating, 3. Bottom inner electrode, 4. Top inner electrode, 5. Terminal inner electrode, 6. Resistive layer, 7. 1st Protective coating, 8. Ni plating, 9. Sn plating, 10. Marking
C(Concave) Type
1. Ceramic substrate, 2. 2nd Protective coating, 3. Bottom inner electrode, 4. Top inner electrode, 5. Terminal inner electrode, 6. Resistive layer, 7. 1st Protective coating, 8. Ni plating, 9. Sn plating, 10. Marking
Reliability Test Items
Electrical Performance Test
| Item | Conditions | Specifications |
| Temperature Coefficient of Resistance | TCR = (R2-R1) / R1(T2-T1) 10 R1: Room temp resistance, R2: -55 or +125 resistance, T1: Room temp, T2: -55 or +125 | According to JIS-C5201-1 4.8 |
| Short Time Overload | Apply 2.5x rated voltage for 5 sec, rest 30 min. | 0.5%, 1%: R=1.0%; 5%: R=2.0% (According to JIS-C5201-1 4.13) |
| Insulation Resistance | Apply 100 VDC for 1 min between electrodes and protective layer/substrate. | 10 (According to JIS-C5201-1 4.6) |
| Dielectric Withstand Voltage | Apply 300 VAC for 1 min between electrodes. | No short circuit or burn. (According to JIS-C5201-1 4.7) |
| Intermittent Overload | 1 sec ON, 25 sec OFF, 2.5x rated voltage, 10,000 cycles. | R=5.0% (According to JIS-C5201-1 4.13) |
Mechanical Performance Test
| Item | Conditions | Specifications |
| Resistance to Solvent | Immerse in Isopropanol at 20~25 for 50.5 min, rest 48 hrs. | R=0.5% (According to JIS-C5201-1 4.29) |
| Solderability | Pre-treatment: 105, 100% RH, 1.2210 pa for 4 hrs. Test: Immerse in 2355 solder bath for 20.5 sec. | Soldered area > 95% (According to JIS-C5201-1 4.17) |
| Resistance to Soldering Heat | Test 1: Immerse in 260+5/-0 solder bath for 10 sec+1/-0. Test 2: Immerse in 260+5/-0 solder bath for 30 sec+1/-0. | Test 1: R%=1.0%. Test 2: Soldered area > 95%, no underlying material visible at electrode edge. (According to JIS-C5201-1 4.18) |
| Joint Strength of Solder | Bending test: Apply 5mm downward force at center of test board. | R%=1.0% (According to JIS-C5201-1 4.33) |
Environmental Test
| Item | Conditions | Specifications |
| Resistance to Dry Heat | 1555 oven for 10004 hrs. | 0.5%, 1%: R=1.0%; 5%: R=2.0% (According to JIS-C5201-1 4.25) |
| Thermal Shock | -55 for 15 min, +125 for 15 min, 300 cycles. | R=1.0% (According to MIL-STD 202 Method 107) |
| Moisture Load | 402, 90~95% RH, rated voltage, 90 min ON, 30 min OFF, 1,000 hrs. | 0.5%, 1%: R=2.0%; 5%: R=3.0% (According to JIS-C5201-1 4.24) |
| Load Life | 702 oven, rated voltage, 90 min ON, 30 min OFF, 1,000 hrs. | 0.5%, 1%: R=2.0%; 5%: R=3.0% (According to JIS-C5201-1 4.25) |
Plating Thickness
- Nickel Layer (Ni): 2m
- Pure Tin Layer (Tin): 3m (Matte Tin)
Technical Application Notes
Recommended Soldering Conditions
- Lead Free IR-Reflow Soldering Profile (Conforms to J-STD-020): Max component temperature 260+5/-0, 10 sec.
- Soldering Iron Method: 35010 within 3 seconds.
Recommended Land Pattern Design (For Reflow Soldering)
| Type | A | B | P | Q1 | Q2 |
| RTA02-2D | 0.50 | 2.00 | 0.67 | 0.33 | 0.34 |
| RTA02-4D | 0.50 | 2.00 | 0.50 | 0.28 | 0.22 |
| RTA02-8D | 1.00 | 2.60 | 0.50 | 0.25 | 0.25 |
| RTA03-2D | 1.00 | 2.60 | 0.80 | 0.40 | 0.40 |
| RTA03-4D | 1.00 | 2.60 | 0.80 | 0.40 | 0.40 |
| RTA02-2C | 0.50 | 2.00 | 0.50 | 0.28 | 0.22 |
| RTA02-4C | 0.50 | 2.00 | 0.50 | 0.28 | 0.22 |
Usage Environment Precautions
This product is for general electronic applications. RALEC is not responsible for damages, costs, or losses incurred due to the use of this product in special environments. Confirmation with RALEC is required for other applications. Customers intending to use this product in special environments (including but not limited to high temperature/humidity, corrosive atmospheres, unverified liquids, unverified sealing materials, or water-based cleaning agents after soldering) must have product characteristics and reliability individually approved.
Transient Overload Precautions
This product may lose functionality due to transient overload. Ensure manufacturing processes and storage prevent transient currents exceeding product specifications.
Handling and Operation Precautions
- Protect resistor edges and protective coating from mechanical stress during operation.
- Handle printed circuit boards (PCBs) with care when separating or fixing to support structures, as PCB bending can cause mechanical stress on the resistors.
- Use resistors within their rated power range. Exceeding the rated power can lead to temperature rise and equipment damage.
- If resistors are expected to receive significant pulse load impacts, establish appropriate operating conditions before use. Evaluate and confirm in your actual application, ensuring fail-safe design and system safety.
Storage and Handling Conditions
- Storage: 255, 6015% RH for two years.
- Avoid harsh environments such as sea breeze, corrosive gases (Cl2, H2S, NH3, SO2, NO2), direct sunlight, and condensation.
- Maintain correct box orientation during handling and storage. Avoid dropping or crushing boxes to prevent damage to electrodes or the body.
Labeling for Electronic Information Products (for export to Mainland China)
Includes Electronic Information Product Pollution Control Mark and Packaging Recycling Mark.
Attachment
- Document Revision Record Table (QA-QR-027)
2411221110_RALEC-RTA03-4D223JTP_C102659.pdf
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